Innovative Low Dielectric PPS Film for Advanced Electronics

Revolutionizing Millimeter-Wave Technology

DIC Corporation, known for its innovation in chemical technology, has partnered with Unitika Ltd. to create a cutting-edge specialty polyphenylene sulfide (PPS) film. This new film significantly reduces transmission loss at high frequencies, making it ideal for millimeter-wave printed circuit boards utilized in advanced communications systems. The necessity for a material with low dielectric properties has never been more critical, as modern devices increasingly depend on millimeter-wave technology for efficient operation.

Enhancing Electronic Devices with Advanced Materials

Conventional flexible printed circuit boards (PCBs), prevalent in the manufacturing of smartphones and various electronic gadgets, typically utilize liquid crystal polymer (LCP) films bonded to copper foil. Unfortunately, this method often leads to inconsistencies in the adhesive interface, which in turn raises transmission loss. With the shift toward next-generation communication devices that operate within the 30 to 300 GHz frequency range, there is a pressing demand for materials designed to minimize this loss.

Innovative Properties of the New PPS Film

The unique PPS film developed through DIC and Unitika’s collaboration marries proprietary polymerization and compounding technologies with advanced manufacturing processes. This combination not only ensures low moisture absorption but also preserves the flame and chemical resistance characteristic of PPS resins. Additionally, it achieves exceptional dielectric stability and uniform thickness, essential for high-frequency circuit boards. This film’s robustness across a spectrum of frequencies—from 10 to 1,000 GHz—sets it apart from traditional films like LCP, making it versatile across multiple applications, from smartphones to automotive technology.

Compatibility and Processing Advantages

The versatility of the new PPS film extends to its compatibility with several flexible copper clad laminate (FCCL) processing techniques. Whether integrating through sputtering, plating, or adhesive lamination, the film provides a smooth and stable adhesive interface that significantly reduces transmission loss when compared to conventional options like LCP or fluoropolymers. This adaptability will likely lead to widespread adoption in evolving electronic applications.

Addressing Future Communications Needs

DIC Corporation is committed to being a leader in the digital transformation through innovative material development. Their focus on functional materials anticipates rising demands for infrastructure supporting next-generation communications technologies, including 5G/6G applications and advancements in generative AI. As these sectors expand, demand for high-performance materials that meet these emerging needs will be crucial.

About DIC Corporation

DIC Corporation stands as a pivotal player in the fine chemicals sector, encapsulating a vast multinational network comprising around 180 companies, including Sun Chemical Corporation, operating in over 60 countries. The DIC Group is celebrated for its integral contributions to modern markets, offering essential products ranging from packaging materials to high-performance components used in smartphones, displays, and automobiles. Its commitment to innovation positions the DIC Group at the forefront of industries reliant on advanced materials.

Frequently Asked Questions

1. What is the significance of the new PPS film developed by DIC and Unitika?

The new PPS film significantly reduces transmission loss, making it highly suitable for millimeter-wave applications in modern electronic devices.

2. How does the new film compare to traditional materials?

Unlike conventional materials, the new film offers superior dielectric properties, dimensional stability, and compatibility with various processing methods.

3. In which applications can the new PPS film be utilized?

This film can be used in a wide range of applications, from smartphones to automotive technologies, especially in high-frequency communication devices.

4. What are the main advantages of using PPS resin?

PPS resin provides excellent moisture resistance, flame resistance, and chemical resistance, making it ideal for various environmental conditions.

5. What future trends is DIC Corporation focusing on?

DIC Corporation is prioritizing the development of materials for next-generation communication technologies, anticipating increased demand for 5G/6G and AI-driven solutions.

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