ACM Research Unveils Innovative Ultra C bev-p Etching Tool
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ACM Research Expands FOPLP Portfolio with Innovative Tool
New double-sided bevel etching system enhances process efficiency and reliability for copper-related applications, supporting high-precision features on large panels.
ACM Research, Inc. (NASDAQ: ACMR), a prominent provider of wafer processing solutions in semiconductor and advanced wafer-level packaging, has introduced the Ultra C bev-p panel bevel etching tool tailored for fan-out panel-level packaging (FOPLP) applications. This state-of-the-art technology is developed for bevel etching and cleaning in copper-related processes, which is essential for maintaining the integrity of large panels.
Revolutionizing the Etching Process
Dr. David Wang, president and CEO of ACM, stated that FOPLP's importance is growing as it satisfies the rising needs of modern electronic applications—offering advantages in integration density, cost efficiency, and design flexibility. The Ultra C bev-p tool embodies ACM's significant expertise in wet processing, allowing for advanced performance, including double-sided bevel etching that simplifies horizontal panel applications. Alongside other recent additions like the Ultra ECP ap-p for horizontal panel electrochemical plating, this tool is set to enhance the FOPLP market significantly.
Key Features of the Ultra C bev-p Tool
This innovative etching tool is a crucial component for FOPLP operations, expertly utilizing a wet etching technique focused on bevel etching and copper residue elimination. This meticulous process is critical for avoiding electrical shorts, mitigating contamination risks, and safeguarding the integrity of successive processing phases—vital for the long-term reliability of semiconductor devices.
ACM's patented technology addresses the unique challenges associated with square panel substrates. The Ultra C bev-p ensures an accurate and confined bevel removal process—even for warped panels—ensuring optimal reliability and performance vital for advanced semiconductor technologies.
Advanced Panel Handling
The Ultra C bev-p is explicitly designed for panel substrates, exhibiting compatibility with organic, glass, and bonding panels. It manages both front and back panel processing efficiently, handling sizes ranging from 510 mm x 515 mm to 600 mm x 600 mm, with thickness options from 0.5 mm to 3 mm, while accommodating warpages up to 10 mm.
Efficient Copper Removal
The tool utilizes a diluted sulfuric acid and peroxide solution for effective copper removal and includes deionized water for rinsing, along with N2 for final drying. This process ensures a clean, dry surface critical for subsequent operations.
High Throughput and Reliability
Operating with up to six processing chambers, the Ultra C bev-p boasts an impressive throughput of 40 panels per hour (PPH), catering efficiently to high-volume production demands. The system maintains a bevel control accuracy of ±0.2 mm, with a control range of 0-20 mm and a mean time between failures (MTBF) of 500 hours. An uptime rate of 95% ensures exceptional reliability and consistent performance, positioning this tool as a cornerstone for efficient semiconductor manufacturing.
About ACM Research, Inc.
ACM Research specializes in the development, manufacturing, and sale of semiconductor process equipment, focusing on single-wafer or batch wet cleaning, electroplating, stress-free polishing, and various critical processes for advanced semiconductor device manufacturing. The company is dedicated to providing customized, high-performance, and cost-effective solutions that enhance productivity and product yield in semiconductor production.
Frequently Asked Questions
What is the Ultra C bev-p tool used for?
The Ultra C bev-p tool is designed for bevel etching and cleaning in copper-related processes for fan-out panel-level packaging applications, enhancing efficiency and reliability.
How does the Ultra C bev-p improve processing?
It utilizes innovative wet etching techniques to ensure precise bevel removal, prevents electrical shorts, and maintains the integrity of devices during production.
What type of panels can the Ultra C bev-p handle?
The tool is compatible with organic, glass, and bonding panels, accommodating varying sizes and thicknesses effectively.
What are the benefits of using the Ultra C bev-p?
Benefits include improved process efficiency, reduced contamination risks, a high throughput rate, and enhanced reliability in semiconductor manufacturing.
Who is ACM Research, Inc.?
ACM Research is a leading supplier of wafer processing solutions focused on developing advanced semiconductor process equipment critical for efficient manufacturing.
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