Unveiling Vertiv's Cutting-Edge AI Infrastructure Solutions
Innovative AI Infrastructure Solutions by Vertiv
Integrated, modular solutions to address power and density challenges for AI environments will be unveiled at the OCP Global Summit.
Vertiv (NYSE: VRT), recognized as a global leader in critical digital infrastructure, proudly announces its latest advancements in rack, power, and cooling technologies. These innovations are designed with adherence to Open Compute Project (OCP) design guidelines, aimed at supporting high-density, energy-efficient data center environments. Visitors can witness these cutting-edge solutions at the upcoming OCP Global Summit, where Vertiv will have a significant presence highlighting its commitment to developing open and flexible infrastructure tailored for the dynamic needs of AI and compute workloads.
Showcasing Advanced Power Management Technologies
At the summit, Vertiv will showcase a suite of technologies that exemplifies a broad range of OCP-aligned designs. This includes the Vertiv™ SmartIT OCP rack solution, a configurable and high-capacity rack system aimed at simplifying integration for system builders. This system is capable of supporting loads up to 142 kW and comes with prefabricated configurations that combine validated power and cooling options, ultimately speeding up deployment while enhancing reliability in high-performance environments.
Power Distribution Units and Modular Systems
The Vertiv™ PowerIT rack power distribution units (PDUs) announced for markets in North America and Europe provide a powerful solution with up to 57.6 kW of reliable power distribution. These PDUs are equipped with advanced features for power management, load balancing, and cybersecurity, tailored for high-density computing settings.
Complementing this is the Vertiv™ PowerBar Track, a scalable overhead power distribution system tailored for high-density AI and HPC applications. The system features a modular, open-track busbar architecture that optimizes space usage, simplifies installation processes, and ensures continuous power delivery, contributing to business continuity through its reliable and upgradeable design components.
Innovation in Thermal Management Solutions
Vertiv will also present its CoolChip Fluid Network manifolds from its liquid cooling portfolio, highlighting flexible and efficient methods to manage thermal loads within high-density environments. These advanced manifolds work seamlessly with the Vertiv™ CoolChip CDU family, exemplifying the ongoing evolution of modular and adaptive cooling technologies specifically designed for AI and next-generation computing architectures.
Collaboration Enhancements with Harting Solutions
The summit will showcase collaborative efforts with Harting to promote connectivity and cabling solutions that exemplify compact and high-performance connections. These solutions are designed to distribute power efficiently from the OCP Busway through the Power Distribution Box (PDB) into the rack, thereby reducing installation complexity and maximizing the usable space within the rack for IT equipment. Vertiv's partnership with Harting emphasizes its dedication to fostering reliable connectivity and promoting open standards for the advantage of the OCP community.
Commitment to OCP Standards and Future Innovation
Ramesh Menon, vice president of the IT systems business unit at Vertiv, stated, "Meeting OCP standards is more than just a compliance exercise; it's about delivering infrastructure that performs at scale. By integrating rack, busway, cabling, and distribution into one ecosystem, we are providing our customers a faster, more reliable path to deploy AI-ready capacity across their facilities."
The showcased technologies will reinforce Vertiv's extensive portfolio across power, thermal management, IT management, integrated infrastructure, and global services, underscoring its commitment to efficient, open, and vendor-neutral systems aimed at empowering the next generation of data center design.
Additionally, Vertiv’s chief innovation officer, Greg Ratcliff, will engage attendees by presenting a session titled, "From Concept to Capability: Innovating the Future of OCP Reference Designs." This session promises an insightful look into how Vertiv translates early concepts into functional prototypes, effectively accelerating the evolution of open infrastructure. The presentation will spotlight the significance of modular and scalable designs, AI-assisted planning tools, and collaborative efforts with OCP stakeholders, all geared towards creating data centers that are more adaptable, energy-efficient, and prepared for emerging workloads like AI.
For more comprehensive details about Vertiv’s OCP-compliant solutions and their full range of infrastructure offerings, please visit Vertiv.com. Interested parties can also arrange to meet with a Vertiv expert during the OCP Summit through the company's scheduling page.
About Vertiv
Vertiv (NYSE: VRT) integrates hardware, software, analytics, and ongoing services to ensure that critical applications run continuously, function optimally, and adapt to evolving customer needs. Vertiv addresses the vital challenges faced by today’s data centers, communication networks, and commercial facilities through a diverse portfolio of power, cooling, and IT infrastructure solutions. Headquartered in Westerville, Ohio, USA, Vertiv operates in over 130 countries globally. For more information and the latest updates from Vertiv, visit Vertiv.com.
Frequently Asked Questions
1. What new technologies are being unveiled by Vertiv at the summit?
Vertiv is unveiling innovative rack solutions, power distribution units, cooling systems, and modular designs aimed at supporting high-density AI environments.
2. How do the new PDUs from Vertiv enhance power management?
The PDUs feature advanced management capabilities, enabling load balancing and cybersecurity measures for optimized performance in high-density settings.
3. What is the significance of Vertiv's collaboration with Harting?
This collaboration aims to improve connectivity and cabling solutions, reducing installation complexity and maximizing space efficiency in high-performance environments.
4. Who is presenting at the OCP Global Summit?
Greg Ratcliff, Vertiv's chief innovation officer, will present insights into innovating future OCP reference designs.
5. Where can I find more information about Vertiv’s solutions?
More details can be found on Vertiv's official website, Vertiv.com, which provides information on their infrastructure offerings and solutions.
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