Revolutionizing Chip Design: Arteris Unveils Magillem Packaging

Transforming Chip Design with Innovative Solutions

Arteris, Inc. (Nasdaq: AIP), celebrated for its cutting-edge semiconductor solutions, has unveiled the Magillem Packaging software to tackle the complexities of chip design. This product is not just an enhancement; it represents a significant leap forward in how engineers assemble advanced chips for diverse applications such as artificial intelligence (AI) data centers and edge devices.

Meeting the Challenges of Modern Chip Design

As the semiconductor industry advances, chip designs are becoming increasingly intricate. The demand for more components, heightened performance expectations, and rigorous timelines all contribute to this complexity. Magillem Packaging steps in to aid engineering teams in navigating these challenges, focusing on automating one of the most labor-intensive aspects of the design process: the packaging and reusing of existing technologies.

A Streamlined Design Process for Enhanced Productivity

K. Charles Janac, the president and CEO of Arteris, emphasizes the necessity of addressing the rising integration challenges in semiconductor design. The proliferation of silicon IP blocks and chiplets has made it paramount for teams to enhance their productivity. With Magillem Packaging, the process of preparing and packaging up to thousands of components into a chiplet or System-on-Chip (SoC) is simplified and made more reliable.

Comprehensive Capabilities of Magillem Packaging

Magillem Packaging is built on the foundation of the latest IEEE 1685 (IP-XACT) standard. This means it integrates seamlessly with existing industry tools, enabling companies to meet growing design demands effectively while minimizing errors and project delays.

Key Features Highlighted

• IP Reuse: Magillem Packaging promotes comprehensive IP, subsystem, and chiplet packaging in reusable formats, facilitating both incremental and full packaging through a proven methodology.
• Correct-by-Construction Compliance: It generates IEEE 1685-2022 standards without requiring prior expertise in IP-XACT, ensuring standard compliance by design with a robust built-in checker suite.
• Automated Scalability: The tool ensures scalable, fully automated generation of IP packaging for new and reused IP blocks while supporting legacy versions of the IEEE 1685 standard. The intuitive graphical editors allow engineers to view and edit IP block descriptions quickly.

Complementing a Broader Suite of Solutions

The introduction of Magillem Packaging adds to Arteris's comprehensive portfolio of design automation tools used by top semiconductor companies worldwide. This innovative product aims to enhance the overall performance of semiconductor projects by accelerating development timelines and reducing technical risks.

Industry Collaboration for Success

In a collaborative environment, companies like Andes Technology are taking advantage of the new IP-XACT 2022 specifications. These specifications, combined with the capabilities of Magillem Packaging, empower designers to optimize their SoC designs easily. The commitment to facilitating streamlined workflows is evident.

Accelerating Development for Complex Applications

MIPS, another pivotal player in the semiconductor space, recognizes the importance of rapid integration and design reuse in their high-efficiency compute applications. They are enthusiastic about how Arteris's packaging solutions align with the needs of customers looking to enhance their SoC development.

Understanding Arteris’s Impact

As a global leader in system IP, Arteris is committed to delivering tools that improve the power efficiency and performance of silicon designs. Their comprehensive network-on-chip (NoC) interconnect IP and system-on-chip (SoC) integration automation software significantly enhance engineering productivity while reducing costs and risks.

Frequently Asked Questions

What is Magillem Packaging?

Magillem Packaging is a software product from Arteris designed to simplify and automate the process of integrating various components into advanced semiconductor chips.

How does Magillem Packaging benefit semiconductor design?

The software streamlines the design process by automating the assembly and reuse of silicon IP blocks, contributing to increased productivity and reliability.

What are the key features of Magillem Packaging?

Magillem Packaging offers IP reuse in reusable formats, correct-by-construction compliance with IEEE 1685-2022, and fully automated generation of IP packaging.

Who can benefit from Magillem Packaging?

Engineering teams and semiconductor companies that require efficient integration of chips can benefit significantly from the capabilities of Magillem Packaging.

How does Arteris's software align with industry standards?

The software is based on the latest IEEE 1685 (IP-XACT) standard, ensuring compliance and accuracy throughout the integration process, thus lowering risks and delays.

About The Author

Hi there, As a writer and financial specialist, Henry Turner is passionate about guiding people through the complex world of finance. Having worked in finance for many years, I am an expert at simplifying difficult financial ideas into understandable, useful insights for my blog and articles. My goal is to arm you with the confidence and information you need to make wise financial choices.

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