QuickLogic Expands Innovations Through Intel Chiplet Alliance

QuickLogic Partners with Intel for Advanced Technology

QuickLogic Corporation (NASDAQ: QUIK), a key player in the embedded field programmable gate array (eFPGA) market, has taken significant strides by joining the Intel Foundry Chiplet Alliance. This partnership serves as a strategic move to leverage Intel's advanced processes and packaging technologies to enhance their own offerings.

The Benefits of Joining the Chiplet Alliance

The Chiplet Alliance is designed to create a secure and standards-based ecosystem by uniting notable industry partners known for their expertise in chiplets. Through this collaboration, QuickLogic gains early access to Intel Foundry's latest processes, including insights into advanced packaging and design kits that are pivotal for future developments.

Access to State-of-the-Art Resources

Members of the Intel Foundry Chiplet Alliance benefit from invaluable resources that help streamline the chip fabricating process. QuickLogic is excited to participate in multi-project-wafer (MPW) shuttles, which allow for quicker prototype cycles while efficiently managing costs. This approach not only accelerates innovation but also aligns with QuickLogic's objectives to provide cutting-edge engineering solutions.

Focus on Security and Reliability

With security and reliability at the forefront of technology development, the Chiplet Alliance emphasizes the need for interoperability. QuickLogic aims to leverage the Universal Chiplet Interconnect Express (UCIe) standard, which is critical in catering to stringent security requirements necessary for applications within the military, aerospace, and high-volume commercial sectors.

QuickLogic’s Commitment to Customizable Solutions

Continuing its mission alignment, QuickLogic already provides customer-defined eFPGA Hard IP through its participation in Intel’s existing programs. The new membership in the Chiplet Alliance enhances their capabilities at the packaging level, ensuring that their reconfigurable logic blocks can smoothly function alongside other members' dies within multi-chip packages.

“Joining the Intel Foundry Chiplet Alliance is a logical next step for QuickLogic,” remarked Brian Faith, CEO of QuickLogic. This partnership positions QuickLogic to accelerate the rollout of their customizable eFPGA chiplets, benefitting their clients who seek secure, adaptable solutions in a variety of fast-paced industries.

About QuickLogic Corporation

QuickLogic Corporation specializes in innovative semiconductor solutions including eFPGA Hard IP, discrete FPGAs, and AI applications tailored for edge computing. By integrating unique technologies with open-source tools, QuickLogic delivers highly interoperable and efficient silicon products that cater to the aerospace and defense, industrial, and consumer markets.

As a fabless semiconductor company, QuickLogic is dedicated to pushing the boundaries of technology advancement. For more information, please visit www.quicklogic.com.

Frequently Asked Questions

What is the Intel Foundry Chiplet Alliance?

The Intel Foundry Chiplet Alliance is a collaboration of industry partners focused on advancing chiplet technology through secure and interoperable standards.

How will QuickLogic benefit from this partnership?

QuickLogic will gain early access to Intel's advanced processes, enabling faster developments of eFPGA chiplets while reducing risks and costs.

What are eFPGA chiplets?

eFPGA chiplets are customizable logic components that offer flexibility and adaptability for various applications, including defense and aerospace.

What is the goal of the Chiplet Alliance?

The goal is to create a reliable ecosystem that enhances chiplet interoperability, ultimately benefiting military, aerospace, and commercial sectors.

Can you provide more information about QuickLogic?

QuickLogic is a fabless semiconductor company focusing on delivering customizable low-power silicon solutions for diverse markets.

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