AUSTIN, Texas, March 20, 2012 (GLOBE NEWSWIRE) -- Applied Nanotech Holdings, Inc. (OTCBB:APNT), a global leader in nanotechnology, is pleased to announce that it has unveiled the next generation of CarbAl™, its award-winning passive thermal management material.
CarbAl™ is a carbon-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion. CarbAl's unique attributes allow it to far exceed the capabilities of conventional thermal management materials, like copper and aluminum. New electroplating and surface coatings have improved its durability and functionality, making it a solution for electronics manufacturers to keep temperature under control.
"Major electronic companies are looking for ways to eliminate heat while also reducing weight and cost," said David Jiang, Ph.D., Director of the Thermal Management Division at Applied Nanotech. "CarbAl™ sets a new standard for removing heat and eliminating hotspots quickly and affordably. It is lighter than aluminum, more affordable than copper, and is approximately three times better at diffusing heat."
CarbAl™ is lighter weight and has increased thermal performance compared to competing materials. CarbAl™ has a density of 1.75 g/cm 3 compared to 2.7 g/cm 3 for aluminum and 8.9 g/cm 3 for copper. While copper has a slightly higher thermal conductivity than CarbAl™, 390 W/mK compared to 350 W/mK, CarbAl's thermal diffusivity is approximately 2.9 cm 2 /sec compared to 0.84 cm 2 /sec for aluminum and 1.12 cm 2 /sec for copper. Additionally, CarbAl™ has a superior CTE and is cost competitive.
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