Major Funding Boost for Microelectronics Development Projects
Major Funding Boost for Microelectronics Development Projects
The Midwest Microelectronics Consortium (MMEC) has recently announced the exciting news about receiving funding for five new technology development projects through the Microelectronics Commons initiative. This funding represents more than $31 million for the first year alone, contributing to a total proposed budget of approximately $138 million over four years, including significant cost-sharing contributions. These projects are set to involve over 30 members from various sectors, including industry, academia, and government, all collaborating to strengthen the domestic microelectronics supply chain.
Understanding the Microelectronics Commons Initiative
This initiative is backed by the CHIPS and Science Act and aims to enhance the United States' global leadership in microelectronics. Through the Microelectronics Commons program, a network of technology hubs is being developed to foster domestic prototyping and nurture a talent pipeline for the semiconductor sector. The program is implemented under the guidance of the Office of the Undersecretary for Research and Engineering, showcasing a commitment to advancing resilient and trusted systems.
Project Areas of Focus
This year, the MMEC had submitted 15 proposals aimed at six crucial technical areas that align with the priorities of the Department of Defense. The selected areas included Secure Edge Computing/IoT, 5G/6G technologies, AI hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead initiatives. The award-winning projects aim to significantly contribute to these fields, demonstrating the consortium's commitment to innovation in microelectronics.
Details of Awarded Projects
The awarded projects are as follows:
- 5G/6G: Wideband Multifunctional Software Defined Radio (WMSDR) involving Lockheed Martin, Intel, Indiana Micro, CapV LLC, University of Dayton, and 3dGS.
- Artificial Intelligence: Ultra Efficient In-Hardware Prototype Using Hyperdimensional Computing, supported by Intel Federal, University of Pennsylvania, SkyWater Technology, AI-Sensation, Air Force Research Laboratory (AFRL), and DEVCOM Army Research Laboratory.
- Electromagnetic Warfare: Co-packaged Reconfigurable Signal and Intelligence Architecture with collaboration from Lockheed Martin, Intel Corporation, and AFRL.
- Electromagnetic Warfare: Center for Technology Transition and Rapid Prototyping of Infrared Detectors, engaging The Ohio State University, Attollo Engineering, SK Infrared, Senseeker Engineering, IQE USA, and NSWC-Crane.
- Secure Edge: Validated GPU Based Secure Processing Module, a joint effort with Northrop Grumman, University of Maryland, NHanced Semiconductors, Battelle, and NVIDIA.
Significance of These Collaborative Efforts
The collaborative nature of MMEC is evident as they focus on building partnerships that drive microelectronics innovation. According to MMEC CEO Jackie Janning-Lask, the recent awards are a testament to the hard work and talent of MMEC members. These projects are expected to play a pivotal role in enhancing domestic chip development, reinforcing the importance of a robust microelectronics supply chain in the U.S.
Moreover, the focus extends beyond project funding; the MMEC aims to enhance its workforce development efforts. They intend to use part of the funding to upgrade existing manufacturing tools and machinery while investing in new infrastructure for facility modernization. Collaborations with educational institutions are also essential, ensuring that pupils from K-12 to colleges are being prepared for the booming semiconductor industry.
Shaping the Future of American Manufacturing
JP Nauseef, JobsOhio CEO, has emphasized Ohio's historic role as a manufacturing hub, predicting that the state will soon be pivotal in producing cutting-edge semiconductors. With a vibrant ecosystem comprising the Air Force Research Laboratory and innovation districts, Ohio is working towards reshoring critical technologies and reviving American manufacturing, contributing to national security and economic prosperity.
About the Midwest Microelectronics Consortium
The MMEC is committed to accelerating advancements in microelectronics technologies to secure a resilient domestic supply chain. Acting as a premier collaborative platform, the consortium unites public and private sectors to catalyze innovation, enhance workforce capabilities, and bring groundbreaking technologies from concept to scalable production, benefiting the economy and national security.
Frequently Asked Questions
What is the purpose of the Microelectronics Commons program?
The program aims to expand the U.S.'s leadership in microelectronics by promoting domestic prototyping and developing talent in the semiconductor field.
What are the five awarded projects related to?
The projects focus on areas such as 5G/6G technology, artificial intelligence, electromagnetic warfare, and secure edge computing.
Who are the key collaborators in these projects?
Key collaborators include renowned companies and institutions like Lockheed Martin, Intel, the University of Pennsylvania, and the Ohio State University.
How does MMEC support workforce development?
MMEC invests in educational partnerships to prepare students for careers in the semiconductor industry and upgrade manufacturing tools and capabilities.
Why is Ohio significant to semiconductor manufacturing?
Ohio is positioned as a key player in semiconductor production due to its historical manufacturing heritage, innovation districts, and strong research institutions.
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