Kulicke & Soffa Enhances Hybrid Bonding with New Process

Kulicke & Soffa Unveils Cutting-Edge CuFirst Hybrid Bonding

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has made significant strides in semiconductor manufacturing by partnering with ROHM Co., Ltd. Together, they have developed a groundbreaking approach to hybrid bonding that leverages Kulicke & Soffa's advanced Fluxless Thermo-Compression (FTC) process. This innovative method aims to address the limitations faced in typical die-to-wafer bonding.

Transformative Technology for Semiconductor Applications

The newly launched APTURA FTC system from Kulicke & Soffa combines cutting-edge technology with ROHM's semiconductor innovations to support robust chip-to-wafer hybrid bonding. The CuFirst hybrid bonding process positions copper interconnect bonding at the initial stage, facilitating better production outcomes. Following the initial bonding, the dielectric components are connected once the device has cooled down to room temperature.

Enhanced Performance and Cost Benefits

This new hybrid bonding approach is anticipated to significantly improve yield rates, decrease infrastructure costs, and reduce overall cost of ownership compared to conventional solutions. The APTURA FTC system is adaptable and can also handle different bonding methods including direct copper-to-copper pillow bonding.

Broad Applicability Across Multiple Markets

Kulicke & Soffa's APTURA FTC platform is versatile, capable of accommodating die-to-die, die-to-substrate, and die-to-wafer configurations. This flexibility allows it to meet diverse material handling needs and end-application specifications. Bob Chylak, the Chief Technology Officer at Kulicke & Soffa, states that ongoing research and development, coupled with collaborations, are key to supporting the transition to advanced semiconductor technologies such as chiplet ecosystems.

Anticipated Growth in TCB Business

Kulicke & Soffa projects substantial growth within its thermo-compression bonding (TCB) segment, with expectations of a remarkable increase of 40-50% sequentially in the upcoming fiscal year. This anticipated expansion is attributed to the increasing adoption of their technologies across various industries, including optical, communications, and consumer electronics.

About Kulicke & Soffa

Founded in 1951, Kulicke and Soffa Industries, Inc. has established itself as a leader in semiconductor and electronics assembly solutions, driving advancements across critical sectors such as automotive, data storage, and advanced displays. Their commitment to innovation has facilitated a transition toward more sustainable and efficient technologies that can meet the evolving demands of the market.

Frequently Asked Questions

What is the CuFirst hybrid bonding process?

The CuFirst hybrid bonding process involves bonding the copper interconnect first, followed by the dielectric connection, utilizing Kulicke & Soffa's APTURA FTC platform.

Who has Kulicke & Soffa partnered with for this development?

Kulicke & Soffa partnered with ROHM Co., Ltd to develop the new CuFirst hybrid bonding technology.

What are the benefits of the CuFirst process?

The CuFirst process is expected to yield higher production rates, reduced costs, and improved overall efficiency compared to traditional die-to-wafer bonding methods.

In which sectors is this technology expected to have the most impact?

This technology is anticipated to significantly benefit industries such as communications, optical devices, and consumer electronics.

When does Kulicke & Soffa expect its TCB business to grow?

The company projects a growth of 40-50% in its TCB business in the coming fiscal year based on increased adoption of its technologies.

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