Cadence and TSMC Transform AI-Driven Silicon Design Solutions
Cadence Partners with TSMC for AI-Driven Design Innovation
Cadence Design Systems, Inc. (NASDAQ: CDNS) is making significant strides in collaboration with TSMC to boost productivity and optimize the performance of AI-driven advanced-node designs and 3D-IC solutions. With the demand for AI applications skyrocketing, the need for advanced silicon solutions that can process vast datasets and perform complex computations is critical. Cadence and TSMC are at the forefront of this rapidly evolving landscape, enabling customers to fast-track their market delivery while enhancing product performance.
Collaboration on Advanced Process Technologies
TSMC has recognized Cadence’s powerful digital and custom design flows, which are now certified for TSMC’s latest N3 and N2P process technologies. This partnership continues a long-standing relationship in design technology co-optimization (DTCO), with a shared goal of improving power, performance, and area (PPA) across key chip designs, including the A16 architecture. Incorporating advanced features, such as backside routing, has also been a focus to meet the needs of modern design challenges.
Utilizing AI for Enhanced Design Automation
In addition to providing robust design tools, Cadence and TSMC are jointly developing Cadence.AI, a platform that leverages artificial intelligence to refine both digital and analog design automation. This initiative aims to significantly increase productivity and the quality of outcomes in electronic design. Cadence.AI encompasses a comprehensive range of design and verification aspects, targeting three key domains for development.
Key Innovations in AI-Driven Solutions
First, the partnership brings forth the Cadence® Cerebrus™ Intelligent Chip Explorer, which utilizes artificial intelligence to optimize digital design with a focus on achieving the best PPA results. Second, the Cadence Joint Enterprise Data and AI (JedAI) Platform employs generative AI for improved design debugging and analytics, facilitating thorough PPA analysis. Lastly, Cadence's Virtuoso® Studio provides tools for transitioning legacy analog designs to contemporary process nodes, alongside advanced circuit optimization capabilities.
Advancing 3D-IC Technologies
The Cadence Integrity™ 3D-IC Platform stands out as a pivotal solution that integrates packaging, analog, and digital implementation, enabling efficient design for 3D-IC technologies. By leveraging the latest 3Dblox features, this collaboration propels innovation in the industry, particularly in support of TSMC’s 3DFabric™ technologies. The two companies are working closely to create a next-generation substrate router facilitating die-to-die and die-to-substrate connections, which is crucial for high-density interconnect designs.
Performance and Reliability through Multiphysics Analysis
As 3D-IC technologies evolve, the ability to conduct multiphysics analyses becomes increasingly important. TSMC and Cadence are jointly enabling warpage and stress analysis specifically tailored for TSMC 3DFabric. This capability complements electrical and thermal assessments, and Cadence’s Celsius™ Studio offers validated simulation results to ensure reliability in thermal and voltage impacts on integrated circuits within the Cadence Integrity 3D-IC Platform.
Addressing the Growing Demand for Data Interconnects
The surge in data requirements, particularly from AI-driven applications, has led to heightened expectations for effective interconnects within chip designs. Cadence addresses this demand with a broad portfolio of critical IP focused on efficiently managing data transport between chiplets and across communication networks. Among its offerings are the Universal Chiplet Interconnect Express™ (UCIe™) 1.0 and advancements in PCI Express® (PCIe®) 6.0, alongside the world’s first silicon-proven GDDR7 on TSMC N3, enabling exceptional performance for AI interfaces in various applications.
Pioneering Solutions for the Automotive Industry
The collaboration between TSMC and Cadence extends to the automotive sector, which is increasingly reliant on silicon innovations. As the complexity of automotive designs escalates, the development of IP for next-generation processes like TSMC N5A and N3A becomes imperative. This focus underlines the importance of integrating advanced silicon solutions into the automotive ecosystem.
Cloud Solutions Enhancing Design Efficiency
Furthering their commitment to maximizing design efficiency, TSMC and Cadence are showcasing the scalability and accuracy of Cadence’s chip design flows on the Cloud tailored for TSMC’s advanced process nodes. By utilizing these powerful Cloud solutions, customers can achieve shortened design timeliness, enabling them to remain competitive in a fast-paced market.
Long-standing Partnership Driving Innovation
The ongoing partnership between TSMC and Cadence is marked by a shared vision of transforming silicon design through the integration of AI-enabled EDA software. “Together, we are paving the way for the AI factories of the future,” states Chin-Chi Teng, senior vice president at Cadence. Echoing this sentiment, Dan Kochpatcharin from TSMC highlights the substantial advancements realized in both digital and custom solutions through their collaboration.
Frequently Asked Questions
1. What are the key focuses of the Cadence-TSMC collaboration?
The collaboration focuses on enhancing advanced-node designs, improving productivity through AI automation, and developing innovative 3D-IC solutions.
2. How does Cadence.AI support design automation?
Cadence.AI leverages artificial intelligence to refine design and verification processes, leading to increased productivity and better quality outputs.
3. In which industries are TSMC and Cadence focusing their innovations?
The companies are primarily focused on the AI, automotive, and advanced electronics sectors, pushing the boundaries of technology within these industries.
4. What significance does the Cadence Integrity 3D-IC Platform hold?
This platform unifies multiple design aspects, making it a comprehensive solution for high-efficiency 3D-IC designs, essential for modern chip requirements.
5. How does their Cloud collaboration benefit mutual customers?
Leveraging Cloud solutions enables customers to quicken their design processes, thus enhancing their competitive edge in fast-evolving markets.
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