Broadcom Showcases Future of AI Infrastructure at OCP Summit

Broadcom's Vision for AI Infrastructure

Broadcom Inc. (NASDAQ: AVGO), a leading technology powerhouse, is gearing up for the 2024 Open Compute Project (OCP) Global Summit, set to take place from Oct. 15-17 in San Jose, California. The company aims to enhance the landscape of artificial intelligence (AI) infrastructure through innovative technologies rooted in open standards, scalability, and power-efficient solutions.

Advanced Solutions for AI Clusters

As AI technology evolves, creating AI clusters that can support a million nodes is becoming more common. A focal point of Broadcom's strategy is developing high-performance connectivity solutions that prioritize energy efficiency, crucial for managing the substantial energy demands of expansive AI networks. Open standards like Ethernet and PCIe are essential for ensuring seamless interoperability in these growing AI frameworks.

Innovations Highlighted at the Summit

At the OCP Global Summit, Broadcom will showcase a range of groundbreaking technologies aimed at supporting AI infrastructure, including:

• Ethernet Networking Switches: Models like the Tomahawk 5 and Jericho3-AI are designed to accelerate workloads associated with AI and machine learning.
• Trident4-X11 Ethernet Switch: This piece of technology is specifically engineered to create the vital front-end fabric that connects with back-end AI components.
• Tomahawk 5 - Bailly: This leading-edge switch delivers a remarkable 51.2 Tbps, connecting robust silicon photonics with Broadcom's established switch chip, setting new benchmarks for performance.
• 400G PCIe Gen 5.0 Ethernet Adapters: These power-efficient adapters are based on industry standards to tackle connectivity challenges as data center demands surge.
• PCIe Gen 5.0 Switches: Drawing half the power compared to competitors, these switches offer outstanding performance with advanced telemetry.
• Industry First PCI Express Gen5/Gen6 Retimers: These solutions enhance efficiency significantly in AI infrastructures while ensuring low power usage.
• Sian and Sian2 DSPs: This technology supports 200G/lane pluggable modules, effectively linking next-generation AI clusters.

Key Presentations and Panel Discussions

Broadcom’s presence at the summit includes an extensive schedule of talks and technical panels, allowing attendees to delve deeper into their innovative technologies:

• An Overview of Hardware Management Projects: A presentation by Hemal Shah from Broadcom and Jeff Autor from Hewlett Packard Enterprise.
• Best Practices for Cooling 51.2Tbps Switches: Discussing insights from Henry Wu, technical director at Broadcom and Fangbo Zhu from Alibaba.
• Optical Power Consumption Standards Update: Offered by Karl Muth and Nathan Tracy, featuring updates on reducing power consumption strategies.
• SONiC Orchestration for AI Clusters: This session led by Kamini Santhanagopalan and Dan Hanson explores networking product management.
• SPDM Authorization Specification: A collaboration between experts from Broadcom, NVIDIA, and Microsoft.
• OCP NIC 3.0's PCIe Gen 6 Support: An advanced look at next-generation testing fixtures with insights from Broadcom's Hemal Shah.
• Link Delay Measurement Techniques: Deepening understanding of measurement methods with experts from Broadcom.

About Broadcom

As a global leader in technology solutions, Broadcom Inc. (NASDAQ: AVGO) designs and supplies a comprehensive range of semiconductor, enterprise software, and security solutions. The company's innovative portfolio serves key markets including cloud services, data centers, broadband, mobile devices, and cybersecurity. With its headquarters in Palo Alto, California, Broadcom continues to push the boundaries of technology. For more information about their cutting-edge solutions, please visit their official website.

Contact Information

Press Contact:
Jon Piazza
Corporate Communications
press.relations@broadcom.com
Telephone: +1 310 498 5254

Frequently Asked Questions

What is Broadcom showcasing at the OCP Global Summit?

Broadcom is showcasing advanced AI infrastructure solutions, including innovative networking switches and PCIe technology to enhance AI processing capabilities.

What are some key products highlighted by Broadcom?

Key products include the Tomahawk 5 switch, Trident4-X11 Ethernet switch, and 400G PCIe Gen 5.0 adapters aimed at efficient AI integration.

How is Broadcom addressing power efficiency?

Broadcom designs power-efficient switches and adapters that utilize advanced technology to manage energy demands in large-scale AI environments.

Who are the speakers at the summit?

Speakers include distinguished engineers and technologists from Broadcom and partner companies like Hewlett Packard Enterprise and Alibaba.

Where is the OCP Global Summit taking place?

The summit is being held in San Jose, California, from Oct. 15-17, 2024.

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