Applied Materials Strengthens Position with Key Investment in Besi

Strategic Investment by Applied Materials in BE Semiconductor Industries

Applied Materials, Inc. recently made waves in the semiconductor industry with its announcement of acquiring 9 percent of the total outstanding shares of BE Semiconductor Industries N.V. (Besi). This investment showcases Applied Materials’ ongoing commitment to innovation in semiconductor manufacturing.

Collaboration with BE Semiconductor Industries

Since 2020, Applied Materials and Besi have embarked on a successful collaboration. The partnership has reached a pivotal milestone with the extension of their agreement aimed at co-developing groundbreaking technology, specifically the industry’s first fully integrated equipment solution designed for die-based hybrid bonding. This cutting-edge technology plays a vital role in the advanced packaging of semiconductors, central to the quest for creating more energy-efficient chips.

Understanding Hybrid Bonding Technology

Hybrid bonding technology is set to change how chips are connected. By utilizing direct copper-to-copper bonds, this method enhances chip density and minimizes the length of interconnect wiring between chiplets. The result? Improved overall performance and reduced power consumption. This technology holds significant importance as manufacturers strive to deliver chips that power numerous applications, particularly in artificial intelligence.

The Investment’s Strategic Importance

According to Terry Lee, Corporate Vice President and General Manager at Applied Materials, the company views this investment as a strategic, long-term initiative. He stated that it underscores their dedication to developing the most advanced hybrid bonding solutions available, which are becoming critical for both logic and memory chips integral to AI technology.

Integrated Hybrid Bonding System

The collaboration has already yielded impressive results, including the development of an integrated hybrid bonding system. This system combines Applied's extensive expertise in front-end wafer processing with Besi’s advanced die placement and assembly solutions. Such integration is expected to vastly increase manufacturing capacity for this technology in the coming years.

No Regulatory Barriers for the Investment

This strategic investment was executed through market-based transactions, ensuring it does not require regulatory approvals. Applied Materials has no intention of seeking representation on Besi’s board, nor do they plan to acquire any additional shares in the future.

About Applied Materials

Applied Materials, Inc. (NASDAQ: AMAT) is globally recognized as a leader in materials engineering solutions. The company plays a pivotal role in the production of virtually every new semiconductor chip and advanced display. Their ability to manipulate materials at atomic levels enables customers to transform innovative ideas into reality.

Contact Information for Applied Materials

If you have inquiries related to editorial or media, you can reach out to Ricky Gradwohl at 408.235.4676. For financial-related queries, feel free to contact Liz Morali at 408.986.7977.

Frequently Asked Questions

What is the significance of Applied Materials' investment in Besi?

This investment enhances their collaboration towards developing advanced hybrid bonding technology critical for efficient semiconductor manufacturing.

How does hybrid bonding benefit semiconductor technology?

Hybrid bonding allows for direct chip connections, which increases density and improves performance and efficiency in chip design.

Will Applied Materials seek further shares in Besi?

No, Applied Materials has no plans to acquire additional shares of Besi common stock at this time.

Who can I contact for more information about Applied Materials?

You can reach Ricky Gradwohl for media inquiries or Liz Morali for financial questions at the provided contact numbers.

What is the future outlook for the hybrid bonding system developed by Applied and Besi?

The integrated hybrid bonding system is expected to facilitate high-volume manufacturing in semiconductor production, critical for future technology advancements.

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