Adeia's Upcoming Conferences Highlight Hybrid Bonding Advances
Adeia's Upcoming Conferences Highlight Hybrid Bonding Advances
Adeia Inc. (NASDAQ: ADEA), renowned for its innovations in semiconductor technology, is gearing up for several exciting presentations at prominent industry conferences. The focus will be on their cutting-edge hybrid bonding technology, which plays a pivotal role in enhancing high-performance computing and artificial intelligence applications.
Key Presentations on Hybrid Bonding
The semiconductor industry has been buzzing with interest in hybrid bonding technology, and Adeia is at the forefront of this advancement. They will showcase their innovations at the following events:
IMAPS Conference
Taking place in Boston, the IMAPS Conference will be hosted from October 1 to 3, 2024. Dr. Guilian Gao, a highly esteemed engineer within Adeia, is set to present an invited session on "Hybrid Bonding Process Technology." This presentation will delve into the market demands, provide an overview of the processes involved, and explore future trends surrounding hybrid bonding.
International Conference on Planarization/CMP Technology
Next up is the International Conference on Planarization/CMP Technology (ICPT) in Wiesbaden, Germany, scheduled for October 16-18, 2024. Dr. Laura Mirkarimi, Senior Vice President of Semiconductor Engineering at Adeia, will discuss "CMP, A Key Enabling Process for Hybrid Bonding." Attendees can expect insights into the significance of chemical mechanical polishing and its impact on advancing hybrid bonding technologies.
IEEE CPMT Symposium Japan
Later in November, from the 13th to the 15th, Adeia will be represented at the IEEE CPMT Symposium in Kyoto, Japan. Dr. Bongsub Lee, Director of Adeia's semiconductor engineering team, will be presenting on "Hybrid Bonding in Advanced Heterogeneous Integration: Key Metrology Enablers." His discussion will highlight metrology techniques that are essential for successful hybrid bonding processes.
Adeia's Commitment to Innovation
Adeia is dedicated to driving progress within several sectors, including media, entertainment, e-commerce, and semiconductor industries. Their innovative technologies are designed to facilitate the future of digital entertainment, connecting devices, and enriching human experiences worldwide. As they continue to influence the tech landscape, Adeia's intellectual property ranges across multiple facets of technology.
Contact Adeia for More Information
If you're interested in learning more about Adeia and their advancements in hybrid bonding technology, you may contact their teams directly:
Investor Relations
Chris Chaney
ir@adeia.com
Semiconductor Business Development
Yan Chai
marketing@adeia.com
Media Relations
JoAnn Yamani
press@adeia.com
Frequently Asked Questions
What is hybrid bonding technology?
Hybrid bonding technology is a semiconductor assembly technique that enables the integration of multiple materials or devices at a microscopic level, essential for advanced computing applications.
What conferences will Adeia be attending?
Adeia will be attending the IMAPS Conference, the International Conference on Planarization/CMP Technology, and the IEEE CPMT Symposium Japan.
Who are the key speakers from Adeia?
Dr. Guilian Gao, Dr. Laura Mirkarimi, and Dr. Bongsub Lee are the notable speakers representing Adeia at these conferences.
Why is Adeia's technology important?
Adeia's technology is crucial for the evolution of high-performance computing and AI applications, addressing the growing demands of the semiconductor industry.
How can I learn more about Adeia?
You can visit their official website at www.adeia.com or reach out directly to their various contact points for more information.
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