ACM Research Celebrates 2025 Award for Innovative Technology
ACM Research Honored with Prestigious Industry Award
ACM Research, Inc. (NASDAQ: ACMR), renowned for its innovative wafer and panel processing solutions, has recently achieved a significant milestone in its journey. The company proudly announces receiving the esteemed 2025 3D InCites Award in the Technology Enablement category. This distinguished honor recognizes ACM's continuous efforts to tackle critical challenges facing the semiconductor industry, particularly in advancing heterogeneous integration.
Driving Innovation in Semiconductor Technologies
The award highlights ACM's Ultra ECP ap-p tool, which stands out as the first commercially available high-volume copper deposition system specifically designed for fan-out panel-level packaging (FOPLP). This groundbreaking tool is characterized by its horizontal plating approach, providing remarkable uniformity and precision across the entire panel. With the capability to support substantial panel sizes of 515 mm x 510 mm and 600 mm x 600 mm, the Ultra ECP ap-p tool is exceptionally versatile, suitable for various plating processes like pillar, bump, and redistribution.
ACM's Vision for Panel-Level Packaging
Dr. David Wang, President and CEO of ACM, expressed gratitude for the recognition from 3D InCites, emphasizing the company's ongoing commitment to innovation in the panel-level packaging (PLP) domain. As the semiconductor landscape evolves, the demand for larger chip sizes, robust graphics processing units, and high-density bandwidth memory is escalating. This growth positions PLP as a key solution in meeting manufacturing challenges efficiently and cost-effectively. The Ultra ECP ap-p system plays a vital role in enhancing ACM’s expanding FOPLP portfolio.
Comprehensive FOPLP Solutions
ACM Research continues to expand its FOPLP offerings, with an impressive array of technologies designed to meet industry demands:
- Ultra ECP ap-p: High-performance copper deposition for advanced wiring and interconnects.
- Ultra C vac-p: Specialized flux cleaning systems for enhanced cleanliness in manufacturing processes.
- Ultra C bev-p: Innovative bevel etching and cleaning tool that ensures optimal surface quality.
Recognizing Industry Contributions
The 3D InCites awards were presented during the IMAPS Device Packaging Conference, an event that celebrates innovations contributing significantly to the advancement of heterogeneous integration. ACM’s recognition is a testament to its dedication to overcoming industry obstacles with cutting-edge technological solutions.
About ACM Research, Inc.
ACM Research, Inc. specializes in the development and manufacture of semiconductor process equipment, covering a broad spectrum of technologies such as cleaning, electroplating, stress-free polishing, and advanced packaging tools. The company's mission is to provide customized, cost-effective solutions that enhance productivity and product yield for semiconductor manufacturers.
Frequently Asked Questions
What award did ACM Research win?
ACM Research won the 2025 3D InCites Award in the Technology Enablement category.
What is the Ultra ECP ap-p system?
The Ultra ECP ap-p system is a high-volume copper deposition tool designed for fan-out panel-level packaging applications.
Why is panel-level packaging important?
Panel-level packaging is vital in semiconductor manufacturing as it improves efficiency, reduces costs, and supports larger chip designs.
Who is the CEO of ACM Research?
Dr. David Wang is the President and Chief Executive Officer of ACM Research.
What is ACM's commitment in the semiconductor industry?
ACM is committed to delivering innovative, high-performance process solutions that enhance semiconductor manufacturing efficiency and product yield.
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