SCHMID Group Celebrates Innovation at 2025 Awards
The SCHMID Group has achieved a significant milestone by winning the Innovation Award at productronica 2025 for its pioneering InfinityLine L+. This achievement highlights SCHMID's commitment to advancing next-generation manufacturing solutions, especially through its revolutionary Chemical Mechanical Planarization (CMP) system designed for large-format substrates.
The Breakthrough of InfinityLine L+
The InfinityLine L+ stands out by enabling CMP processing for rectangular substrates and PCBs that measure up to 24.5” x 24.5”. This capability not only ensures exceptional flatness but also guarantees uniformity, making it an ideal fit for sophisticated build-up technologies used in panel level packaging and SLP applications. This includes SCHMID’s own “Àny layer ET-Board” and various technologies involving SAP, TGV, and glass substrates, catering to the evolving demands of high-volume manufacturing environments.
Leadership Through Technological Advancement
Christian Schmid, CEO of SCHMID Group, expressed pride over this accolade, emphasizing how the InfinityLine L+ embodies the organization's dedication to tech leadership in electronics manufacturing. Schmid stated, "Our ongoing commitment to innovation and excellence reshapes the future of sustainable and high-performance production technologies."
Tackling New Challenges in Substrate Processing
Manufacturing large, fragile, and non-ductile materials involves numerous challenges that conventional CMP systems, usually restricted to wafer sizes of Ø300 mm, cannot overcome. These typical systems fail to accommodate the thin yet flexible nature of large panels. As variations in layer thickness, material combinations, and topographical elements emerge, precise control becomes essential. This is where traditional wafer-based CMP concepts fall short.
Revolutionizing Planarization Techniques
The InfinityLine L+ introduces an innovative design, ensuring that slurry is precisely applied in the center and optimally dispersed across the entire surface via the polishing pad. This system effectively supports and secures sensitive substrates with an advanced clamping and backing setup. New zone control technologies, accurate endpoint detection, and automatic panel exchanges markedly increase flatness and stability while minimizing downtime.
Commitment to CMP Precision
Steffen Beck, Director of Technology at SCHMID, described this award as a validation of their vision to enhance semiconductor-grade CMP precision for larger substrates. He highlighted the InfinityLine L+ as a breakthrough technology, which enables features like sub-5 µm structures and outstanding uniformity while facilitating manufacturing scalability for advanced packaging, SLP, and glass substrate applications.
Advanced Technology and Benefits
Utilizing SCHMID's "Oscar" principle, the InfinityLine L+ is remarkable for its low slurry consumption combined with high removal rates and excellent uniformity. Its design incorporates features like platen cooling, variable pressure settings, and vacuum clamping with real-time pressure monitoring, creating high process reliability. Its modular architecture allows for quick consumable exchanges and the capability of monitoring all process parameters in real-time, thus ensuring consistent outcomes and maximizing operational uptime.
Target Markets and Applications
The InfinityLine L+ effectively translates semiconductor-grade CMP technology for much larger substrates, catering to manufacturers in various sectors:
- Producers of substrates for AI and emerging technologies
- High-end SLP and advanced packaging developers
- Manufacturers of glass-core and substrate materials
- Photonics and optoelectronics industries
- Research institutions and universities focused on microsystems, materials science, and electronics
Setting New Industry Standards
By bridging the gap between semiconductor wafer processes and the complex requirements of next-generation substrates, SCHMID’s InfinityLine L+ establishes a new benchmark within the industry. This system merges precision and adaptability while offering scalable solutions capable of cluster integration featuring up to four systems as well as automated loading and unloading mechanisms via FOUP, with the option to integrate the InfinityLine H+ inline cleaning system.
Gratitude for Support and Innovation
SCHMID Group extends heartfelt thanks to all contributors who played a role in achieving this remarkable success.
Frequently Asked Questions
What is the InfinityLine L+?
The InfinityLine L+ is an advanced Chemical Mechanical Planarization solution designed for large-format substrates, enhancing precision and efficiency in manufacturing processes.
Why did SCHMID Group receive the Innovation Award?
It was awarded for its groundbreaking approach to advanced electronics manufacturing through the InfinityLine L+, showcasing significant contributions to the industry.
What are the key benefits of the InfinityLine L+?
Benefits include high uniformity, effective slurry usage, and modular design allowing for quick consumable changes, contributing to high throughput and low downtime.
In which markets is the InfinityLine L+ utilized?
The InfinityLine L+ is primarily used in markets such as AI, advanced packaging, photonics, and by various research institutions in electronics.
How does SCHMID Group prioritize sustainable manufacturing?
SCHMID Group focuses on environmentally friendly processes in their technologies while ensuring high efficiency and quality in production.
