FARMINGTON, CT and HILLSBORO, OR--(Marketwired - Jun 26, 2013) - Horizon Technology Finance Corporation (
"We are pleased to provide this debt facility to NexPlanar as we continue to take advantage of attractive lending opportunities to well-sponsored technology companies," stated Gerald A. Michaud, President of Horizon. "NexPlanar has experienced considerable growth by developing a proprietary technology that improves the quality of chips and the yield obtained by their customers. Our venture loan, combined with NexPlanar's recent equity financing, puts NexPlanar in a strong position to meet the demand from semiconductor manufacturers for its advanced products and continue to expand globally."
Jim LaCasse, President & CEO of NexPlanar, stated, "We appreciate Horizon's support and confidence in NexPlanar. Horizon provided growth capital that matched NexPlanar's financing needs with an appropriate structure and attractive terms. In addition, Horizon's team of venture lending experts worked diligently to ensure a smooth closing. We look forward to working with Horizon as we maintain our focus on expanding production and driving future growth."
About Horizon Technology Finance Horizon Technology Finance Corporation is a business development company that provides secured loans to development-stage companies backed by established venture capital and private equity firms within the technology, life science, healthcare information and services, and clean-tech industries. The investment objective of Horizon Technology Finance is to maximize total risk-adjusted returns by generating current income from a portfolio of directly originated secured loans as well as capital appreciation from warrants to purchase the equity of portfolio companies. Headquartered in Farmington, Connecticut, with regional offices in Walnut Creek, California and Reston, Virginia, the Company is externally managed by its investment advisor, Horizon Technology Finance Management LLC. Horizon's common stock trades on the NASDAQ Global Select Market under the ticker symbol, "HRZN." In addition, the Company's 7.375% Senior Notes due 2019 trade on the New York Stock Exchange under the ticker symbol "HTF." To learn more, please visit www.horizontechnologyfinancecorp.com .
About NexPlanar NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Their proprietary polymer technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life. For more information, please visit www.nexplanar.com .
Forward-Looking Statements Statements included herein may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Statements other than statements of historical facts included in this press release may constitute forward-looking statements and are not guarantees of future performance, condition or results and involve a number of risks and uncertainties. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described from time to time in our filings with the Securities and Exchange Commission. The Company undertakes no duty to update any forward-looking statement made herein. All forward-looking statements speak only as of the date of this press release.
Contact: Horizon Technology Finance Corporation Christopher M. Mathieu Chief Financial Officer (860) 676-8653 chris@horizontechfinance.com Investor Relations and Media Contacts: The IGB Group Michael Cimini / Leon Berman (212) 477-8261 / (212) 477-8438 mcimini@igbir.com / lberman@igbir.com
