Ultra Flexible Substrate Phase 2 SBIR Ag
Post# of 1422
Posted On: 06/05/2013 1:11:45 AM
Phase 2 SBIR
Agency: Defense Advanced Research Projects Agency
Topic: SB031-019
Budget: 08/23/04 - 11/30/06
Sarcos has worked on the development of a new technology that enables electronic devices to be fabricated on filamentary and elongated prismatic flexible substrates which can then be interconnected to form large area and even volumetric flexible electronic and multi-regime systems. As part of the phase I effort we have analytically developed new...
Phase 1 SBIR
Agency: Defense Advanced Research Projects Agency
Topic: SB031-019
Budget: 06/10/03 - 02/11/04
Current microelectronics relies on silicon substrate, ceramic packaging and fiber glass circuit board, devices built using this technology is costly and not flexible. Although foils (such as polyimide or steel) promised to address flexibility, they have to be very thin. Sarcos has been working on a revolutionary technology that will enable elect...
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