SUNNYVALE, CA--(Marketwired - May 29, 2013) -
What: eSilicon will present on emerging packaging technologies as well as advanced physical IP -- including the challenges of FinFET and FD-SOI technologies that will take us to 14nm.
Where: Design Automation Conference (DAC 2013) Austin, Texas
When: June 2-5, 2013
Who:
Advanced Technologies Driving Selective Memory Customization ChipEstimate.com Booth #2446 eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, and Lisa Minwell, senior director, IP Solutions Marketing, will present.
- Monday, June 3, 11:30 AM
- Tuesday, June 4, 2:00 PM
- Wednesday, June 5, 1:30 PM
What's beyond 28nm? Advanced IP for Advanced Chip Solutions GLOBALFOUNDRIES Open Theater Booth #1314 eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, will present.
- Tuesday, June 4, 3:45 PM
Concurrent Design Delivers Innovative Package for Fast Time-to-Market Solution GLOBALFOUNDRIES Open Theater Booth #1314 eSilicon's Gino Skulick, VP and GM, SDMS Solutions, will present an integrated approach to a very low cost, low power, small form factor device produced for the mobile market.
- Monday, June 3, 2:45 PM
- Wednesday, June 5, 11:05 AM
Targeted IP Solutions for Mobile, Compute, Connect and Store GLOBALFOUNDRIES Private Theater Booth #1314 eSilicon's Lisa Minwell, senior director, IP Solutions Marketing, will present.
- Wednesday, June 5, 2:00 PM
About eSilicon eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com .
eSilicon -- Enabling Your Silicon Success™
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Contacts: Sally Slemons eSilicon Corporation 408-616-4695 Email Contact Susan Cain Cain Communications 408-393-4794 Email Contact