Post
of 72,765
$GTCH The company 's original invention design presents a new way to design and manufacture larger size integrated circuits (ICs) to fit advanced analog, digital and mixed IC types on a silicon wafer. The technology that was subject to the patent sought to enable the advanced microchip design and manufacturing within significantly less space which can be a major factor for IC’s manufacturing, performance and cost. It is thought that the invention can be a game changer particularly for integrated circuits that require vast amount of silicon space like memories, CPU, GPU and AI.