$GTCH “Today’s microchips include billions of transistors which make a significant impact on the overall chip’s die size. As larger silicon ‘real-estate’ is, designers have to face more complex electrical and performance challenges. The industry is constantly scaling down the manufacturing process, reaching deep nanometer ranges which introduce more complicated physics-oriented challenges. We believe an efficient layout compaction technology can be a great functional and economical solution for existing and new IP blocks. We are now designing an AI based technology to read an existing IC layout block and compacting its size to the densest possible. The process is targeted to be done automatically and within short time. We are seeking to design the program with the goal of maintaining the process design rules, DFM guidelines and electrical connectivity correctness. It is the goal for the entire silicon area to undergo significant reduction and therefore enable improved silicon yield and ultimately cheaper ICs. The technology is planned to support older and advanced nanometer processes, Analog, Digital, RF and MIXED styles, making it a flexible tool for all types of IC design firms. As Integrated Circuits technology advances, more functionalities, lower power consumption, higher performance and lower cost are in high demand, especially within advanced nanometer projects,” stated Danny Rittman, the Company’s CTO.
https://www.benzinga.com/pressreleases/22/02/...ircuit-lay
https://www.benzinga.com/pressreleases/22/02/...ircuit-lay
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