$GTCH SAN DIEGO, Jan. 20, 2022 (GLOBE NEWSWIRE) --
Post# of 7004
“For decades, technology companies have worked to shrink microchips to fit into devices as small as a watch, an earbud or a surgical instrument. Shrinking microchips to make them smaller often means losing space on the chip for performance and functionality, so the movement has turned to three-dimensional microchips. With the hope to maintain efficiency, the ongoing problem with 3D chips is that they rely on traditional interconnectivity methods, including wire bonding and flip chips, to stack vertically. By trying to create a 3D integrated circuit, the stacking of the silicon wafers develops limitations. We believe redesigning the microchip architecture can improve production like routing and the placement of critical building blocks within the IC. One method found to help make these improvements in the architecture of the microchip includes changing the design from the stereotypical flat (or two-dimensional design) to a 3D or layered structure. We believe our approach may alleviates the disadvantages of current ICs by providing new multi-dimensional IC architecture and design. The 3D microchip patent introduces a multi-dimensional, multi-planar IC structure that may potentially be used in IC fabrication. As microchip’s are constantly getting more complex there is a need for a breakthrough technology to enable much larger silicon utilization with higher performance and lower cost. We believe that the technology contemplated by the patent continuation application can be an efficient solution, breaking new grounds in the integrated circuits field, and introducing the next generation of design and manufacturing standards,” said Danny Rittman, the Company’s CTO.
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