$GTCHD News: SAN DIEGO, Nov. 16, 2021 (GLOBE NEWSW
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Posted On: 11/19/2021 8:12:29 AM
$GTCHD News: SAN DIEGO, Nov. 16, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCHD) ("GBT” or the “Company”), is developing machine learning based software solutions to include integrated circuit design, verification and manufacturing aspects under one platform, enabling faster design, higher performance, and silicon yield. Based on its recent patented technology, GBT has started the development of a comprehensive software solution to address advanced nanometer challenges under one design environment. The software platform (internal code name MAGIC II), will address a wide variety of IC design aspects among these are functional verification, geometric design-rules correctness, power management, reliability and design for manufacturing (DFM).
The platform is targeted to support analog, digital and mixed signal designs, enabling efficient scalability and process migration. GBT’s ML technology plans to be implemented to ensure fast performance; especially, with today’s very large ICs in the domains of AI, IoT and data processing. The solution suite will include design, verification and manufacturing analysis under one platform which eliminates the use of different EDS vendors and tool tools. The platform will take into consideration design requirements and perform area optimization for efficient silicon yield. The platform will also include design automation utilities, among them are high level synthesis, geometrical and electrical auto-correction features, along with interactive capabilities, enabling on-the-fly feedback and violation elimination. The platform will be consisted of wide variety of independent programs that will work in a full interoperability method, providing fabless IC design firms with the capability to design their chips under one design environment, both faster and cheaper.
As our electronic world is constantly proliferating, fabless design firms are in the need of a breakthrough IC design technology to address the ever-growing design and manufacturing complexities. The MAGIC II platform will potentially offer intelligent, comprehensive portfolio IC design solutions, enabling design firms to deliver innovative projects faster, cheaper and with superior performance.
"In today’s IC design world, design firms are typically using EDA solutions from different vendors for different purposes and analysis. We started the development of one comprehensive IC design platform that will offer major design solutions under a single umbrella. There will be longer be a need to import and export data between different vendors EDA tools since our platform will handle all data; internally, transparent for the user. The platform will be covering geometrical, electrical and manufacturing aspects, so designers would be able to design their microchip from concept all the way to final data, that is sent to the fab for manufacturing. The platform will support analog, digital and mixed design styles, including, full scalability and is expected to save major design time cycle; particularly, in advanced nodes of 7nm and below. Designers will be able to design their chip with built-in, interactive assistance to guide them how to make their design flawless, virtually error-free. Additionally, the platform will include auto-correction and optimization utilities to improve older projects, correcting violations in massive designs. A deep learning system will enable intelligent solutions, along with vast amount of data processing (Big Data), which is a crucial factor with today’s enormous integrated circuit’s size. One of the system’s key advantages will be the minimization of the time spent on geometrical design rule corrections (DRCs), which will be done automatically. The platform will also include IC design utilities to optimize and balance the design’s power, area, functionality and performance. We strongly believe that a one-stop, comprehensive IC design solution will introduce a much easier and more efficient way to handle microchip’s design aspects. Creating new horizons for IC design firms in the digital, analog, and mixed signal domains,” said Danny Rittman the Company’s CTO.
The platform is targeted to support analog, digital and mixed signal designs, enabling efficient scalability and process migration. GBT’s ML technology plans to be implemented to ensure fast performance; especially, with today’s very large ICs in the domains of AI, IoT and data processing. The solution suite will include design, verification and manufacturing analysis under one platform which eliminates the use of different EDS vendors and tool tools. The platform will take into consideration design requirements and perform area optimization for efficient silicon yield. The platform will also include design automation utilities, among them are high level synthesis, geometrical and electrical auto-correction features, along with interactive capabilities, enabling on-the-fly feedback and violation elimination. The platform will be consisted of wide variety of independent programs that will work in a full interoperability method, providing fabless IC design firms with the capability to design their chips under one design environment, both faster and cheaper.
As our electronic world is constantly proliferating, fabless design firms are in the need of a breakthrough IC design technology to address the ever-growing design and manufacturing complexities. The MAGIC II platform will potentially offer intelligent, comprehensive portfolio IC design solutions, enabling design firms to deliver innovative projects faster, cheaper and with superior performance.
"In today’s IC design world, design firms are typically using EDA solutions from different vendors for different purposes and analysis. We started the development of one comprehensive IC design platform that will offer major design solutions under a single umbrella. There will be longer be a need to import and export data between different vendors EDA tools since our platform will handle all data; internally, transparent for the user. The platform will be covering geometrical, electrical and manufacturing aspects, so designers would be able to design their microchip from concept all the way to final data, that is sent to the fab for manufacturing. The platform will support analog, digital and mixed design styles, including, full scalability and is expected to save major design time cycle; particularly, in advanced nodes of 7nm and below. Designers will be able to design their chip with built-in, interactive assistance to guide them how to make their design flawless, virtually error-free. Additionally, the platform will include auto-correction and optimization utilities to improve older projects, correcting violations in massive designs. A deep learning system will enable intelligent solutions, along with vast amount of data processing (Big Data), which is a crucial factor with today’s enormous integrated circuit’s size. One of the system’s key advantages will be the minimization of the time spent on geometrical design rule corrections (DRCs), which will be done automatically. The platform will also include IC design utilities to optimize and balance the design’s power, area, functionality and performance. We strongly believe that a one-stop, comprehensive IC design solution will introduce a much easier and more efficient way to handle microchip’s design aspects. Creating new horizons for IC design firms in the digital, analog, and mixed signal domains,” said Danny Rittman the Company’s CTO.
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