$GTCH GBT Technologies Inc.'s (OTC Pink: GTCH) mul
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Posted On: 10/13/2021 1:44:00 PM
$GTCH GBT Technologies Inc.'s (OTC Pink: GTCH) multi planar 3D chip design affords greater capacity than current industry standards, according to company CTO, Danny Rittman.
"Using GBT's granted patent on the multi planar approach introduces a completely new standard that we foresee is going to be the future," Rittman said. "Imagine instead of having the flat surface, having a hexagon or any other geometrical shape, and on each plane we can actually put a part of the silicon wafer. So, the microchip itself can be made up of small planes that are connected together, and on both sides, and in this way we actually produce way more silicon real estate and capacity to put more circuits on the chip."
Rittman explained the limits of the common design currently implemented in the industry.
"It's a completely different approach from the traditional industry standard we see today," he said. "Today, the microchip arena is still based on the typical wafer, flat silicon approach. Yes, there is the 3-D architecture where one can add layers and connect them vertically, but it's still keeping the same silicon approach which is basically a flat design."
"We came up with an approach that is completely different. The main thing today is the real estate on the silicon. Chips become bigger and the foundries try to make it a smaller process, so we go to 5 nanometre, 3 nanometre, 2 nanometre and below, and soon we're going to reach the limit. The idea is to compact more circuits and more features on the chip."
https://www.marketwatch.com/press-release/spe...ws_seemore
"Using GBT's granted patent on the multi planar approach introduces a completely new standard that we foresee is going to be the future," Rittman said. "Imagine instead of having the flat surface, having a hexagon or any other geometrical shape, and on each plane we can actually put a part of the silicon wafer. So, the microchip itself can be made up of small planes that are connected together, and on both sides, and in this way we actually produce way more silicon real estate and capacity to put more circuits on the chip."
Rittman explained the limits of the common design currently implemented in the industry.
"It's a completely different approach from the traditional industry standard we see today," he said. "Today, the microchip arena is still based on the typical wafer, flat silicon approach. Yes, there is the 3-D architecture where one can add layers and connect them vertically, but it's still keeping the same silicon approach which is basically a flat design."
"We came up with an approach that is completely different. The main thing today is the real estate on the silicon. Chips become bigger and the foundries try to make it a smaller process, so we go to 5 nanometre, 3 nanometre, 2 nanometre and below, and soon we're going to reach the limit. The idea is to compact more circuits and more features on the chip."
https://www.marketwatch.com/press-release/spe...ws_seemore
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