$GTCH Both applications were published on March 18
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Posted On: 03/29/2021 8:29:59 AM
$GTCH Both applications were published on March 18, 2021.
The multi-dimensional microchip invention relates to the field of integrated circuit (IC) silicon structure, and covering GBT' futuristic integrated circuit technology which introduces new methods for microchip's manufacturing. The technology enables the manufacturing of more transistors on a silicon wafer in order to place more circuits/features on a die. The company’s 3D microchip patent was granted as of December 1, 2020 by the USPTO as US patent U.S. Patent No. 10,854,763.
The multi-dimensional microchip invention relates to the field of integrated circuit (IC) silicon structure, and covering GBT' futuristic integrated circuit technology which introduces new methods for microchip's manufacturing. The technology enables the manufacturing of more transistors on a silicon wafer in order to place more circuits/features on a die. The company’s 3D microchip patent was granted as of December 1, 2020 by the USPTO as US patent U.S. Patent No. 10,854,763.
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