$GTCH news alert: March 23, 2021 (GLOBE NEWSWIRE)
Post# of 42191
The multi-dimensional microchip invention relates to the field of integrated circuit (IC) silicon structure, and covering GBT' futuristic integrated circuit technology which introduces new methods for microchip's manufacturing. The technology enables the manufacturing of more transistors on a silicon wafer in order to place more circuits/features on a die. The company’s 3D microchip patent was granted as of December 1, 2020 by the USPTO as US patent U.S. Patent No. 10,854,763.
The database management patent is targeted to enable a highly secured communication protocol and to produce increased processing of database objects through its networks. Using the technology contemplated in the patent, it is believed that mobile and IoT devices may be able to share/exchange vast amounts of data using what is believed to be highly secured, segmentation oriented, proprietary techniques. The was granted on December 1, 2020 by the USPTO as a US patent No. 10,853,327.