$GTCH an update to its press release issued Novemb
Post# of 102870
The patent seeks to cover new silicon manufacturing structure and orientation, with the stated designed of providing more capabilities and lower power consumption with reduced cost. The goal of the new manufacturing architecture is to enable larger designs within smaller areas and significantly increases the silicon yield to enhance smaller nodes like 5nm, 3nm and below. The invention is defined to support analog, RF, digital, MIXED and MEMS IC's design styles.