$GTCH GBT's Patent for 3D Monolithic, Multi-Dimensional/Plane, Memory Structure - Integrated Circuits - Received a Notice of Allowance
GBT Technologies Inc.
SAN DIEGO, Oct. 29, 2020 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT”, or the “Company”), announced that it received a notice of allowance for application number 16/292,388, which was filed on March 5, 2019, issued by the United States Patent and Trademark Office (“USPTO”) for its 3D, Monolithic, multi-dimensional, multi-plane, memory structure for integrated circuits patent. The application has been examined by USPTO and is allowed for issuance as a patent. The Company expects that it will receive a granted date during the next few months.
The present invention relates to the field of integrated circuit (IC), and more particularly to multi-dimensional, multi-planar IC memory. GBT's 3D microchip patent is protecting GBT's futuristic integrated circuit technology which introduces new systems and methods for microchip's manufacturing. The invention is designed to present a new die structure and orientation with a focus on deep nanometer range. The goal of the technology is to enable manufacturing more devices on silicon in order to achieve more circuits/features on die. Further, it is designed to enables new IC architectures for larger designs within smaller areas while lowering the overall IC's power consumption. This target market for this technology, when fully developed, will be area-dependent ICs such as memory chips, MEMS (Micro-Electro Mechanical Systems) and micro solar cells.
GBT's invention goes beyond 3D concept with multi-plane silicon structures, for example honeycomb, hexagonal and further multi-planetary structures, in order to significantly increase silicon surface area. These types of structures are designed to enable the design and manufacture chips with multi-trillion transistors on die, creating new horizons for mega-chips with mega features.
"We believe this invention will open a whole world of possibilities for mega-chips with numerous possible features. We believe silicon structures in the shape of honeycomb, and hexagonal structural layout, can significantly increase the silicon surface for transistors, enabling a new generation of microchips" stated Danny Rittman, GBT CTO. "We intend to explore various practical uses for this technology including with memory cells, micro solar cells and MEMS chips, we believe enabling larger silicon areas will create new horizons for the creation of advanced, miniaturized electro-mechanical systems like micro-sensors and micro-actuators with the goal of creating advanced AI, CPU and powerful GPUs within smaller areas. "
About GBT Technologies Inc.
GBT Technologies Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development-stage company which considers itself a native IoT creator, developing Internet of Things (IoT) and Artificial Intelligence (AI) enabled mobile technology platforms. GBT has a portfolio of Intellectual Property that, if commercialized, is designed to include smart microchips, mobile and security applications and protocols and supporting cloud software. GBT’s system envisions the creation of a global mesh network. The core of the system will be its advanced microchip technology that can be installed in any mobile or fixed device worldwide. GBT envisions this system as a low-cost, secure, private mesh network between any enabled devices, providing shared processing, advanced mobile database management/sharing and enhanced mobile features as an alternative to traditional carrier services.
Forward-Looking Statements
Certain statements contained in this press release may constitute "forward-looking statements". Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements as a result of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website ( http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company's views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company's views as of any date subsequent to the date of the press release.
Contact:
Dr. Danny Rittman, CTO
GBT Technologies Inc.
Media: press@gopherprotocol.com
GBT Technologies Inc.
SAN DIEGO, Oct. 29, 2020 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT”, or the “Company”), announced that it received a notice of allowance for application number 16/292,388, which was filed on March 5, 2019, issued by the United States Patent and Trademark Office (“USPTO”) for its 3D, Monolithic, multi-dimensional, multi-plane, memory structure for integrated circuits patent. The application has been examined by USPTO and is allowed for issuance as a patent. The Company expects that it will receive a granted date during the next few months.
The present invention relates to the field of integrated circuit (IC), and more particularly to multi-dimensional, multi-planar IC memory. GBT's 3D microchip patent is protecting GBT's futuristic integrated circuit technology which introduces new systems and methods for microchip's manufacturing. The invention is designed to present a new die structure and orientation with a focus on deep nanometer range. The goal of the technology is to enable manufacturing more devices on silicon in order to achieve more circuits/features on die. Further, it is designed to enables new IC architectures for larger designs within smaller areas while lowering the overall IC's power consumption. This target market for this technology, when fully developed, will be area-dependent ICs such as memory chips, MEMS (Micro-Electro Mechanical Systems) and micro solar cells.
GBT's invention goes beyond 3D concept with multi-plane silicon structures, for example honeycomb, hexagonal and further multi-planetary structures, in order to significantly increase silicon surface area. These types of structures are designed to enable the design and manufacture chips with multi-trillion transistors on die, creating new horizons for mega-chips with mega features.
"We believe this invention will open a whole world of possibilities for mega-chips with numerous possible features. We believe silicon structures in the shape of honeycomb, and hexagonal structural layout, can significantly increase the silicon surface for transistors, enabling a new generation of microchips" stated Danny Rittman, GBT CTO. "We intend to explore various practical uses for this technology including with memory cells, micro solar cells and MEMS chips, we believe enabling larger silicon areas will create new horizons for the creation of advanced, miniaturized electro-mechanical systems like micro-sensors and micro-actuators with the goal of creating advanced AI, CPU and powerful GPUs within smaller areas. "
About GBT Technologies Inc.
GBT Technologies Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development-stage company which considers itself a native IoT creator, developing Internet of Things (IoT) and Artificial Intelligence (AI) enabled mobile technology platforms. GBT has a portfolio of Intellectual Property that, if commercialized, is designed to include smart microchips, mobile and security applications and protocols and supporting cloud software. GBT’s system envisions the creation of a global mesh network. The core of the system will be its advanced microchip technology that can be installed in any mobile or fixed device worldwide. GBT envisions this system as a low-cost, secure, private mesh network between any enabled devices, providing shared processing, advanced mobile database management/sharing and enhanced mobile features as an alternative to traditional carrier services.
Forward-Looking Statements
Certain statements contained in this press release may constitute "forward-looking statements". Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements as a result of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website ( http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company's views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company's views as of any date subsequent to the date of the press release.
Contact:
Dr. Danny Rittman, CTO
GBT Technologies Inc.
Media: press@gopherprotocol.com
