(Industry Related) Topic of Heat/Cooling - (copy)

(Industry Related) Topic of Heat/Cooling - (copy) Okiedo .. one fundamental aspect of the POE* OI platform is the ability to connect devices with minimal loss (coupling efficiency). This reduces the energy required to produce and move light and minimizes the heat generated. That is a very big deal and was something that VR emphasised. The heat that is generated by the operation of active devices (the laser) is reduced because the power required to transfer that light into the passive elements (in this case Rockley’s big silicon waveguides) is reduced while at the same time isolating the heat signature of that laser away from the silicon. As we will recall POE* has a laser design that efficiently couples into silicon to expand their market into the silicon photonics industry."



"and minimizes the heat generated"



Statement from 2007: "The cost of IT equipment is no longer the bulk of the cost, but rather the cost of the power and cooling infrastructure has crept in to be the primary cost driver." Source: https://www.electronics-cooling.com/2007/02/i...-supports/



ZD Net article from 2019: "Maximizes cooling efficiency. The largest operational expense in most data centers worldwide -- more so than powering the servers -- is powering the climate control systems." Source:https://www.zdnet.com/article/how-hyperscale-data-centers-are-reshaping-all-of-it/



https://www.dataspan.com/blog/data-center-coo...practices/

$MJ