$POETF $POET New Patent Granted posted on Feb 04,
Post# of 1140
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Posted On: 02/04/2020 12:09:45 PM
$POETF $POET New Patent Granted posted on Feb 04, 2020 11:05AM
United States Patent
10,551,561
Ring , et al.
February 4, 2020
Optical dielectric waveguide structures
Abstract
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
The waveguide provides low film stress and low optical signal loss.
Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops.
Optical signals are delivered to the submount assembly via optical fibers.
The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted.
The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.
Inventors:Ring; William (High Bridge, NJ), Florjanczyk; Miroslaw (Kanata, CA)
Applicant: POET Technologies, Inc. San Jose CA US
Assignee: POET Technologies, Inc. (San Jose, CA)
Family ID:1000004570355
Appl. No.: 16/036,151
Filed: July 16, 2018
United States Patent
10,551,561
Ring , et al.
February 4, 2020
Optical dielectric waveguide structures
Abstract
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
The waveguide provides low film stress and low optical signal loss.
Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops.
Optical signals are delivered to the submount assembly via optical fibers.
The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted.
The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.
Inventors:Ring; William (High Bridge, NJ), Florjanczyk; Miroslaw (Kanata, CA)
Applicant: POET Technologies, Inc. San Jose CA US
Assignee: POET Technologies, Inc. (San Jose, CA)
Family ID:1000004570355
Appl. No.: 16/036,151
Filed: July 16, 2018
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