$LWLG Another PIC Patent > POLYMER MODULATOR AND L
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Posted On: 03/14/2019 8:41:02 PM
$LWLG Another PIC Patent > POLYMER MODULATOR AND LASER INTEGRATED ON A COMMON PLATFORM AND METHOD
Dated Feb 28, 2019 so unclear if this Application was Granted on this date?
http://appft.uspto.gov/netacgi/nph-Parser?Sec...692,080%22
A monolithic photonic integrated circuit includes a platform, a monolithic laser formed in/on the platform, and an electro-optic polymer modulator monolithically built onto the platform and optically coupled to the monolithic laser. The polymer modulator is optically coupled to the monolithic laser by waveguides including electro-optic polymer waveguides. The electro-optic polymer modulator and the electro-optic polymer waveguides including an electro-optic polymer core and top and bottom electro-optic polymer cladding layers. The electro-optic polymer core having an electro-optic coefficient (r.sub.33) greater than 250 pm/v, and a Tg 150.degree. C. to >200.degree. C., and the top and bottom electro-optic polymer cladding layers having a Tg approximately the same as the Tg of the electro-optic polymer core.
the Billion $ question is, has LWLG been running a track along side the customized "stnd" packaging for a PIC fabrication, recall the 2018 ASM goals are for the design thereof, and time permitting the fabrication, but if done at a Foundry this could take 6 months, so can LWLG do/have done it in-house ?
- proto
Dated Feb 28, 2019 so unclear if this Application was Granted on this date?
http://appft.uspto.gov/netacgi/nph-Parser?Sec...692,080%22
A monolithic photonic integrated circuit includes a platform, a monolithic laser formed in/on the platform, and an electro-optic polymer modulator monolithically built onto the platform and optically coupled to the monolithic laser. The polymer modulator is optically coupled to the monolithic laser by waveguides including electro-optic polymer waveguides. The electro-optic polymer modulator and the electro-optic polymer waveguides including an electro-optic polymer core and top and bottom electro-optic polymer cladding layers. The electro-optic polymer core having an electro-optic coefficient (r.sub.33) greater than 250 pm/v, and a Tg 150.degree. C. to >200.degree. C., and the top and bottom electro-optic polymer cladding layers having a Tg approximately the same as the Tg of the electro-optic polymer core.
the Billion $ question is, has LWLG been running a track along side the customized "stnd" packaging for a PIC fabrication, recall the 2018 ASM goals are for the design thereof, and time permitting the fabrication, but if done at a Foundry this could take 6 months, so can LWLG do/have done it in-house ?
- proto
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