$LWLG Key PIC patent granted! This is HUGE!
from, Background of the Invention
It is another object of the present invention to provide a new and improved hermetic capsule with multiple input/output ports coupled to multiple optical fibers in a wafer scale solution that is cost effective.
from, Summary of the Invention
(Steps to fabricate the PIC)
Providing a first semiconductor/metal wafer and fabricating sensitive semiconductor/polymer electrical and optical components in the first semiconductor/metal wafer defining a semiconductor/metal base. Fabricating a semiconductor/metal embedded lid in a shell-like form providing edges defining a volume space within the edges and hermetically sealing the edges of the semiconductor/metal embedded lid to the semiconductor/metal base by metallization so as to form a first chamber including at least one of the sensitive semiconductor/polymer electrical and optical components. The embedded lid and base defining an embedded hermetic capsule hermetically sealing the at least one sensitive semiconductor/polymer electrical and optical component from the ambient. Fabricating a semiconductor/metal basic lid in a shell-like form providing edges defining a volume space within the edges and hermetically sealing the edges of the semiconductor/metal basic lid to the semiconductor/metal base by metallization so as to form a second chamber including the sensitive semiconductor/polymer electrical and optical components and the embedded hermetic capsule. The basic lid and base defining a basic hermetic capsule hermetically sealing the sensitive semiconductor/polymer electrical and optical components and the embedded hermetic capsule from the ambient, and providing multiple optical pathways coupling multiple optical fibers to the optical components sealed within the chamber.
http://patft.uspto.gov/netacgi/nph-Parser?Sec...22&OS=
granted US Patent number 10,162,111 entitled, "Multi-fiber/port hermetic capsule sealed by metallization and method" [2]. While this brings our total portfolio to 30 patents, the greater significance in my opinion is that this is a packaging and integration patent, and moreover one that leverages established semiconductor manufacturing to solve photonics challenges. The novel package described in the patent reduces cost and size, but also simplifies assembly and increases reliability. We believe that this patent is especially significant for us because improved packaging and manufacturability are essential for photonics to reach the volumes and cost points demanded by the datacenter and 5G markets; and we believe this particular patent will protect our competitive advantages due to improved cost and volume manufacturability. We are very protective of our trade secrets and our proprietary information on our electro-optic polymers, particularly as we go out to market. Our patent portfolio protects our enabling technologies ranging from our electro-optic polymer material through packaging.
https://lightwavelogic.com/profiles/investor/...&G=914
LWLG has patented its own OSA which includes the co-packaging of Optics and Electronics so effectively being its own Interposer, so this means that LWLG not only is the ONLY technology that can scale standalaone speeds to 100Gbs and beyond with their best in class material systems having proven femtosecond response times, but now they additionally will be slashing the manufacturing costs the Industry incurs today!
- proto
from, Background of the Invention
It is another object of the present invention to provide a new and improved hermetic capsule with multiple input/output ports coupled to multiple optical fibers in a wafer scale solution that is cost effective.
from, Summary of the Invention
(Steps to fabricate the PIC)
Providing a first semiconductor/metal wafer and fabricating sensitive semiconductor/polymer electrical and optical components in the first semiconductor/metal wafer defining a semiconductor/metal base. Fabricating a semiconductor/metal embedded lid in a shell-like form providing edges defining a volume space within the edges and hermetically sealing the edges of the semiconductor/metal embedded lid to the semiconductor/metal base by metallization so as to form a first chamber including at least one of the sensitive semiconductor/polymer electrical and optical components. The embedded lid and base defining an embedded hermetic capsule hermetically sealing the at least one sensitive semiconductor/polymer electrical and optical component from the ambient. Fabricating a semiconductor/metal basic lid in a shell-like form providing edges defining a volume space within the edges and hermetically sealing the edges of the semiconductor/metal basic lid to the semiconductor/metal base by metallization so as to form a second chamber including the sensitive semiconductor/polymer electrical and optical components and the embedded hermetic capsule. The basic lid and base defining a basic hermetic capsule hermetically sealing the sensitive semiconductor/polymer electrical and optical components and the embedded hermetic capsule from the ambient, and providing multiple optical pathways coupling multiple optical fibers to the optical components sealed within the chamber.
http://patft.uspto.gov/netacgi/nph-Parser?Sec...22&OS=
granted US Patent number 10,162,111 entitled, "Multi-fiber/port hermetic capsule sealed by metallization and method" [2]. While this brings our total portfolio to 30 patents, the greater significance in my opinion is that this is a packaging and integration patent, and moreover one that leverages established semiconductor manufacturing to solve photonics challenges. The novel package described in the patent reduces cost and size, but also simplifies assembly and increases reliability. We believe that this patent is especially significant for us because improved packaging and manufacturability are essential for photonics to reach the volumes and cost points demanded by the datacenter and 5G markets; and we believe this particular patent will protect our competitive advantages due to improved cost and volume manufacturability. We are very protective of our trade secrets and our proprietary information on our electro-optic polymers, particularly as we go out to market. Our patent portfolio protects our enabling technologies ranging from our electro-optic polymer material through packaging.
https://lightwavelogic.com/profiles/investor/...&G=914
LWLG has patented its own OSA which includes the co-packaging of Optics and Electronics so effectively being its own Interposer, so this means that LWLG not only is the ONLY technology that can scale standalaone speeds to 100Gbs and beyond with their best in class material systems having proven femtosecond response times, but now they additionally will be slashing the manufacturing costs the Industry incurs today!
- proto
Lightwave Logic Inc (LWLG) Stock Research Links
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