TORONTO, July 11, 2018 (GLOBE NEWSWIRE) -- CAD MicroSolutions Inc., a leading service partner and distributer of 3D technology in Canada, has relocated its Toronto headquarters to 30 International Blvd. near Toronto Pearson International Airport to support its rapid growth and better serve the Canadian engineering and manufacturing community. The new facility features the first CAD MicroSolutions Additive Manufacturing Customer Experience Centre (CEC), home to the production grade HP Jet Fusion 4200 3D printing solution.

“This is an exciting time for CAD MicroSolutions,” said Darren Gornall, President of CAD MicroSolutions. “Not just for our employees, but also for our network of customers and partners who will benefit from the opportunities that this new space presents.”

A leading SOLIDWORKS Solutions provider in Ontario, CAD MicroSolutions has an expansive network of customers leveraging the SOLIDWORKS portfolio and Dassault 3DExperience platform. Driven by their goal to support their clients throughout the entire product development lifecycle, CAD MicroSolutions has formed several new partnerships with leaders in Industry 4.0 technology in recent years. In addition to housing the new CEC, the new headquarters increases the overall office footprint, supporting the company’s growth strategy which includes continued expansion in the areas of additive manufacturing, virtual reality, augmented reality, IoT and design automation.

“This investment is geared towards helping our clients better understand additive manufacturing processes and technologies,” said Deep Singh, Director of Additive Manufacturing at CAD MicroSolutions. “Partners and clients will have the ability to validate their business cases by leveraging our unique state-of-the-art Additive Manufacturing Customer Experience Centre.”

CAD MicroSolutions’ new Customer Experience Centre will serve as a dynamic lab space, showcasing technology innovations in additive manufacturing, virtual and augmented reality. In addition to offering customers the ability to see, touch and interact with the technology driving Industry 4.0, the new facility is designed to help customers understand the entire additive process, from design through prototyping and production. The CEC offers the additional benefit of hands-on training courses at the facility, ranging from design for 3D printing and/or mixed reality, through machine operations and support.

Featuring additive technology from industry leaders including HP, Markforged, BigRep and Nano Dimension, as well as VR/AR business solutions from Virtalis, the CEC enables customers to accelerate the adoption of Industry 4.0 in their organizations by allowing them to experience firsthand the transformative potential that these technologies possess.  

Individuals are welcome to schedule an appointment to visit CAD MicroSolutions’ Customer Experience Centre, to experience this next generation of technology and to strategize on how to apply these innovations to transform their business in this new industrial era.

The new CAD MicroSolutions head office and Customer Experience Centre are located at:

30 International Blvd., Unit 1 Toronto, ON M9W 1A2

About CAD MicroSolutions:

CAD MicroSolutions, headquartered in Toronto, Ontario, has been providing engineers, designers and manufacturers with 3D technology and training for the entire product development lifecycle for over 30 years. CAD MicroSolutions is uniquely positioned to help their clients enable innovation across Canada, selling and supporting 3D printing solutions, virtual and augmented reality, as well as design automation software, training and consultation to help clients in mechatronics innovate, design and succeed. For more information about CAD MicroSolutions, please visit  www.cadmicro.com  or call 1-888-401-5885.

For further information, please contact Darren Gornall, dgornall@cadmicro.com , (416) 213-0533.

A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/Attachm...64265ddf64 . The photo is also available via AP PhotoExpress.