$LWLG Lightwave Logic CEO Dr. Michael Lebby Invite
Post# of 102250
Englewood, Colorado, April 02, 2018 (GLOBE NEWSWIRE) -- Lightwave Logic, Inc. (OTCQB: LWLG), a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications, announced today that CEO, Dr. Michael Lebby has accepted an invitation to present to the PIC International Conference in Brussels, Belgium, on Wednesday April 11, 2018.
This is the 3rd International PIC conference which brings together Photonic Integration technologists from all over the world and attracts speakers from companies that purchase photonics for their networks and architectures in need of immediate technological solutions to scale their systems. The conference also draws stakeholders such as foundries, tool suppliers and technologists that support PIC based technologies for both fiber communications as well as other applications.
Dr. Lebby’s invited talk will be based on a previously published abstract is entitled, Scalable PIC platforms: The impact of Using Polymer PICs for 100 and 400 Gbps Datacom Applications. It will focus on the fast growth of integrated photonics both in data centers, telecom as well as non-communications applications and also explore the increased growth being driven by new opportunities for scalable PIC platforms.
Dr. Lebby will show the increased data-rates, scalability and lower cost structures that Lightwave Logics’ polymer-based PICs will offer based on 50 Gbps data rates and also provide an update on the World Photonics Roadmap process to explain how 50 Gbps polymer-based PICs can positively impact the data communications community.
The conference agenda can be found at the following URL: http://picinternational.net/agenda
Additionally, Dr. Lebby will present Lightwave Logic’s latest results of its polymer-based PIC technology-- specifically, Lightwave’s advancement of its Mach-Zehnder ridge waveguide packaged-modulator designs for 50 Gbps operation using a polymer PIC platform (P2IC™) technology.
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