APNT News .21 Applied Nanotech Unveils THERCOBO

APNT News .21

Applied Nanotech Unveils THERCOBOND Family of Highly Thermally-Conductive Bonding Materials

2012-05-21 09:15 ET - News Release

AUSTIN, Texas, May 21, 2012 (GLOBE NEWSWIRE) -- Applied Nanotech Holdings, Inc. (OTCBB:APNT), a global leader in nanotechnology, is pleased to announce that it has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND^TM for power electronics and photonics applications.

THERCOBOND^TM materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability.

"The implementation of new thermal interface composites with a significantly higher level of heat dissipation performance is critical for the extreme requirements of power electronic devices today" said Dr. Nan (David) Jiang, Director of the Thermal Management Division at Applied Nanotech, Inc. "The scope of industrial and commercial applications for THERCOBOND^TM materials is immense, starting with electronic packaging, power LEDs, and PCB assembly, just to name a few."

THERCOBOND^TM materials can easily be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs.

The first two products in the THERCOBOND^TM family are polymer-based (DTC-P) and ceramic-based (DTC-C).