Dublin, March 24, 2017 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables" report to their offering. With the MC3672, mCube has released the industry's smallest WLCSP ultra-low power accelerometer for wearables, enabling significantly extended battery life and very small form factors. This new component should increase the company's market share. One target is earbud applications, like Apple's AirPods, where power consumption is a major parameter and the space is very limited. Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integration for consumer electronics in a WLCSP package. This uses only wafer level steps to assemble the ASIC, MEMS sensor, MEMS cap and package. Mainly produced by TSMC, which made great efforts to provide complete platforms for MEMS manufacturing, the component is elegantly designed and better integrated than most of its competitors. After Bosch Sensortec released a WLCSP 3-axis accelerometer, mCube chose a different approach, although it still uses a Via-Middle TSV process for the package integration. Two TSV processes are used in this component, including for connecting the MEMS sensor to the IC electronics. The final size is smaller compared than Bosch's device, at 1.1mmx1.3mmx0.74mm. This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package. The report includes a complete overview of the evolution of mCube's MEMS accelerometers since the second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec and STMicroelectronics and a process comparison with Bosch's WLCSP accelerometer. Key Topics Covered: Overview / Introduction Company Profile and Supply Chain Physical Analysis Package - Package views, dimensions and pin-out - Package cross-section - Package opening - MEMS Cap - MEMS Sensing Area - View, dimensions, and marking - Delayering and process - ASIC Die - View, dimensions, and marking - Delayering and process - Cross-section Physical Comparison mCube accelerometer evolution - Comparison with competitors - Package comparison with Bosch BMA355 Manufacturing Process Flow ASIC front-end process - ASIC wafer fabrication unit - MEMS process flow - MEMS wafer fabrication unit - Packaging process flow - Package assembly unit Cost Analysis Synthesis of the cost analysis - Yield explanation and hypotheses - ASIC front-end cost - MEMS front-end cost - MEMS front-end cost per process steps - Total front-end - WLCSP package cost - WLCSP package per process steps - Component cost Estimated Price Analysis Companies Mentioned - Bosch - STMicroelectronics For more information about this report visit http://www.researchandmarkets.com/research/pj...mc3672_the
About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
CONTACT: Research and Markets Laura Wood, Senior Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 Related Topics: Wearable Technology, Microelectromechanical Systems (MEMS)
