AMD Showcases High-Performance Ecosystem Ready for

LAS VEGAS, NV--(Marketwired - Jan 4, 2017) - 2017 International Consumer Electronics Show (CES) -- Following global excitement generated by the reveal of new technology and performance details of upcoming AMD Ryzen™ high-performance desktop processors, AMD ( NASDAQ : AMD ) today announced 16 cutting-edge high-performance AM4 motherboards from five manufacturers. In addition, AMD exhibited Ryzen processor-based "extreme performance" PC designs from 17 top system integrators across the globe as well as innovative third-party CPU cooler designs, demonstrating a ready and robust ecosystem for Ryzen CPUs. AMD also expects Ryzen-based designs from all top global PC OEMs, with more information on systems to be revealed at launch.

"2017 will be an unforgettable year for AMD, its technology partners and the PC industry as a whole, and we're thrilled to kick off the year at CES by showing wide arrays of high-performance motherboard and PC designs from our OEM partners for whom the future is Ryzen," said Jim Anderson, senior vice president and general manager, Computing and Graphics Group, AMD. "AMD and our partners are committed to supporting enthusiasts, gamers, and creators with a new generation of computing innovation and choice through AMD Ryzen processor-based motherboards, custom-built PCs, and coolers built to support these impressive systems."

New Chipsets and Motherboards AMD and its motherboard partners today debuted a wide array of new motherboards from ASRock, Asus, Biostar, Gigabyte, and MSI, all built upon two upcoming desktop chipsets for AMD Ryzen processors: the X370 and X300. X370 chipset-based motherboards are designed for those who need the most performance, cutting-edge features, and superior I/O connectivity from their PCs including support for overclocking ¹ , and dual graphics. For users looking for performance in a more compact size, the X300 chipset also features an AMD Ryzen-ready AM4 socket while utilizing the mini-ITX size ideal for small form factor PCs. Both chipsets take full advantage of innovative technology features including:

• Dual-channel DDR4 memory
• NVMe
• M.2 SATA devices
• USB 3.1 Gen 1 and Gen 2
• PCIe® 3.0 capability ²

AM4 chipsets provide dedicated PCIe lanes for USB, graphics, data and other I/O, providing a powerful, scalable and reliable computing experience and bringing the benefit of future-ready technologies. Motherboards on display at CES 2017 include:

• ASRock X370 Taichi, ASRock X370 Gaming K4, ASRock AB350 Gaming K4 & ASRock A320M Pro4
• Asus B350M-C
• Biostar X370GT7, Biostar X350GT5 & Biostar X350GT3
• Gigabyte GA-AX370-Gaming K5, Gigabyte GA-AX370-Gaming 5, Gigabyte AB350-Gaming 3 & Gigabyte A320M-HD3
• MSI A320M Pro-VD, MSI X370 Xpower Gaming Titanium, MSI B350 Tomahawk & MSI B350M Mortar

AMD Ryzen processor-based PCs Exemplifying the goal of bringing innovation and competition back to desktop PCs, AMD and renowned custom-PC builders such as Cyberpower, Maingear and Origin, amongst others, presented an array of 'dream PCs' based on high-performance AMD Ryzen processors. From exotic, custom water-cooled systems to more refined, practical solutions, a myriad of PCs incorporating AMD Ryzen processors were on display at CES including:

• Caseking
• CSL - Computer
• CyberPower PC
• Cybertron PC
• Icoda (Korea)
• IBUYPOWER
• iPason Wuhan
• Komplett
• LDLC
• Maingear
• Mayn Wuhan
• Medion AG
• Mindfactory
• Oldi (Russia)
• Origin PC 
• Overclockers UK
• PC Specialist

New 3 ^rd Party Thermal Solutions For enthusiasts and PC builders focused on a premium, quiet, and effective cooling solution or wishing to overclock, AMD is working with 15 top cooler manufacturers and vendors to create an array of aftermarket CPU coolers for AM4 processors. For ultra-quiet air cooling, Noctua will offer both its NH-D15 and its slimmer counterpart the NH-U12S. In, addition, EKWB will offer AM4 support for its custom water cooling solutions.

AMD Ryzen processor-based PCs, AM4 motherboards, and compatible cooling solutions are expected to be available in Q1 2017.

Supporting Resources

• Learn more about AMD Ryzen processors at AMD.com/Ryzen
• Learn more about the "Zen" core architecture at AMD.com/Zen
• Learn more about AMD Products , Solutions , and Innovations
• Become a fan of AMD on Facebook
• Follow AMD on Twitter @AMD

About AMD For more than 45 years, AMD has driven innovation in high-performance computing, graphics, and visualization technologies -- the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses, and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD ( NASDAQ : AMD ) website , blog , Facebook and Twitter pages.

AMD, the AMD Arrow logo, Ryzen and combinations thereof, are trademarks of Advanced Micro Devices, Inc. PCIe is a registered trademark of PCI-SIG Corporation. Other names are for informational purposes only and may be trademarks of their respective owners.

Cautionary Statement This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, expectations, timing and availability of future AMD Ryzen processor-based motherboards, custom-built PCs, and cooling solutions; and the expected benefits from working with AMD's technology partners, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation's dominance of the microprocessor market and its aggressive business practices may limit AMD's ability to compete effectively; AMD is party to a wafer supply agreement with GLOBALFOUNDRIES Inc. (GF) with obligations to manufacture products at GF with certain exceptions. If GF is not able to satisfy AMD's manufacturing requirements, its business could be adversely impacted; AMD relies on third parties to manufacture its products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, AMD's business could be materially adversely affected; failure to achieve expected manufacturing yields for AMD's products could negatively impact its financial results; the success of AMD's business is dependent upon its ability to introduce products on a timely basis with features and performance levels that provide value to its customers while supporting and coinciding with significant industry transitions; if AMD cannot generate sufficient revenue and operating cash flow or obtain external financing, it may face a cash shortfall and be unable to make all of its planned investments in research and development or other strategic investments; the loss of a significant customer may have a material adverse effect on AMD; AMD's receipt of revenue from its semi-custom SoC products is dependent upon its technology being designed into third-party products and the success of those products; global economic uncertainty may adversely impact AMD's business and operating results; the markets in which AMD's products are sold are highly competitive; AMD may not be able to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD has a substantial amount of indebtedness which could adversely affect its financial position and prevent it from implementing its strategy or fulfilling its contractual obligations; the agreements governing AMD's notes and the secured revolving line of credit (Secured Revolving Line of Credit) impose restrictions on AMD that may adversely affect its ability to operate its business; uncertainties involving the ordering and shipment of AMD's products could materially adversely affect it; the demand for AMD's products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for AMD's products or a market decline in any of these industries could have a material adverse effect on its results of operations; AMD's ability to design and introduce new products in a timely manner is dependent upon third-party intellectual property; AMD depends on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components to support its business; if AMD loses Microsoft Corporation's support for its products or other software vendors do not design and develop software to run on AMD's products, its ability to sell its products could be materially adversely affected; and AMD's reliance on third-party distributors and Add-in-Board partners subjects it to certain risks. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended September 24, 2016.

¹ AMD's product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26 ² Pending PCIe® certification