Apptigo International Inc (APPG) 0.0001 $APPG
Apptigo International Begins Alpha Testing for Big Dog App
Marketwired - Tue Jan 05, 2:04PM CST
Fresh on the heels of the successful launch of Rate My Pussycat (RMPC) in the Apple App Store, Apptigo International (OTCBB: APPG) has entered the next app in their "Rate" series, "Rate My Pooch," into alpha testing. The dog lover's answer to RMPC, RMP will be the third original entry into the portfolio of the creators of the SCORE Matchmaker app,
Global High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015
M2 - Tue Sep 01, 11:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/5bkb3d/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report to their offering. The explosion of applications in the consumer and mobile space, internet of things (IoT) and the slowdown of Moore's law have been driving many new trends and innovations in packaging. The semiconductor industry now has to focus on system scaling and integration to meet the ever-increasing electronic system demands for performance and functionality, and for reduction of system form factor, system power consumption and system cost. This paradigm shift from chip-scaling to system-scaling will re-invent microelectronics, continue driving system bandwidth and performance, and help sustain Moore's Law. The challenge for semiconductor industry is to develop a disruptive packaging technology platform capable of achieving these goals. This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC?s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects. Key Topics Covered: Chapter 1 Introduction Chapter 2 Executive Summary Chapter 3 Technology Issues and Trends Chapter 4 Applications Chapter 5 Competitive Environment Chapter 6 3-D-TSV Technology Chapter 7 Market Forecast Companies Mentioned - 30 of the 100 Companies Featured - ALLVIA - Appian Technology - BeSang - Elpaq - Elpida - Elpida Memory - Eureka - Freescale - Fujikura - Fujitsu - Intersil - Jazz Semiconductor - Kodak - Kyocera - Lexmark International - Lucent Technologies - MicroModule Systems - Micron - Micron Technology - Mitsubishi - Motorola - NEC - NXP - NXP Semiconductors - STMicroelectronics - Samsung - TSMC - Tektronix - Teledyne Electronic Technologies - Tessera For more information visit http://www.researchandmarkets.com/research/5b...ighdensity
MU: 14.67 (+0.75), ISIL: 14.56 (+0.38)
Apptigo International Launches Beta Version of Its New Cat Sharing App
Marketwired - Thu Jul 09, 8:34AM CDT
Following on the heels of its critically-acclaimed SCORE app, Apptigo International (OTCQB: APPG) has stayed true to its creative roots and is pleased to announce that the next app in the company's portfolio -- Rate My Pussycat, a popularity and sharing app dedicated exclusively to cats -- has exited the development stage and is now in active Beta.
Apptigo International Announces Major Update of SCORE(TM)- Match Maker Now Available in Apple(R) App Store
Marketwired - Mon Oct 20, 7:30AM CDT
Apptigo International, Inc. (OTCBB: APPG) (OTCQB: APPG), a non-conforming, highly creative agency and mobile app developer, today announced the global release of a major update of SCORE(TM) - Match Maker, now available for free download from the Apple(R) App Store.
Apptigo International Begins Alpha Testing for Big Dog App
Marketwired - Tue Jan 05, 2:04PM CST
Fresh on the heels of the successful launch of Rate My Pussycat (RMPC) in the Apple App Store, Apptigo International (OTCBB: APPG) has entered the next app in their "Rate" series, "Rate My Pooch," into alpha testing. The dog lover's answer to RMPC, RMP will be the third original entry into the portfolio of the creators of the SCORE Matchmaker app,
Global High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015
M2 - Tue Sep 01, 11:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/5bkb3d/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report to their offering. The explosion of applications in the consumer and mobile space, internet of things (IoT) and the slowdown of Moore's law have been driving many new trends and innovations in packaging. The semiconductor industry now has to focus on system scaling and integration to meet the ever-increasing electronic system demands for performance and functionality, and for reduction of system form factor, system power consumption and system cost. This paradigm shift from chip-scaling to system-scaling will re-invent microelectronics, continue driving system bandwidth and performance, and help sustain Moore's Law. The challenge for semiconductor industry is to develop a disruptive packaging technology platform capable of achieving these goals. This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC?s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects. Key Topics Covered: Chapter 1 Introduction Chapter 2 Executive Summary Chapter 3 Technology Issues and Trends Chapter 4 Applications Chapter 5 Competitive Environment Chapter 6 3-D-TSV Technology Chapter 7 Market Forecast Companies Mentioned - 30 of the 100 Companies Featured - ALLVIA - Appian Technology - BeSang - Elpaq - Elpida - Elpida Memory - Eureka - Freescale - Fujikura - Fujitsu - Intersil - Jazz Semiconductor - Kodak - Kyocera - Lexmark International - Lucent Technologies - MicroModule Systems - Micron - Micron Technology - Mitsubishi - Motorola - NEC - NXP - NXP Semiconductors - STMicroelectronics - Samsung - TSMC - Tektronix - Teledyne Electronic Technologies - Tessera For more information visit http://www.researchandmarkets.com/research/5b...ighdensity
MU: 14.67 (+0.75), ISIL: 14.56 (+0.38)
Apptigo International Launches Beta Version of Its New Cat Sharing App
Marketwired - Thu Jul 09, 8:34AM CDT
Following on the heels of its critically-acclaimed SCORE app, Apptigo International (OTCQB: APPG) has stayed true to its creative roots and is pleased to announce that the next app in the company's portfolio -- Rate My Pussycat, a popularity and sharing app dedicated exclusively to cats -- has exited the development stage and is now in active Beta.
Apptigo International Announces Major Update of SCORE(TM)- Match Maker Now Available in Apple(R) App Store
Marketwired - Mon Oct 20, 7:30AM CDT
Apptigo International, Inc. (OTCBB: APPG) (OTCQB: APPG), a non-conforming, highly creative agency and mobile app developer, today announced the global release of a major update of SCORE(TM) - Match Maker, now available for free download from the Apple(R) App Store.
