Stats Chippac Ltd (SCIPF) 0.3250 $SCIPF
STATS ChipPAC's Fan-Out Wafer Level Packaging Shipments Exceed 1 Billion Units
Marketwire Canada - Tue May 10, 3:40PM CDT
Reflects Strong Demand for eWLB in Mobile Market With Accelerating Adoption in Internet of Things, Wearables, MEMS and Automotive Applications
Air Products Awarded Long-term Contract to Supply Leading Semiconductor Packaging and Test Services Company in South Korea
PR Newswire - Tue Apr 05, 8:56AM CDT
Air Products (NYSE: APD) today announced it has been awarded a long-term contract by JCET STATS ChipPAC Korea Ltd. (JSCK), a leading semiconductor packaging and test services provider, to supply tonnage quantities of nitrogen to its new production facility in Incheon, South Korea.
APD: 140.12 (-5.90)
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations
Marketwired - Mon Jan 18, 4:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
, a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2015 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology. This is the sixth consecutive year that STATS ChipPAC has been recognised in the annual scorecards.
Global 3D IC Market 2015-2019 - High Proliferation of IoT Devices to Boost Market Growth
M2 - Mon Dec 21, 5:35AM CST
Research and Markets (http://www.researchandmarkets.com/research/nrjdlr/global_3d_ic) has announced the addition of the "Global 3D IC Market 2015-2019" report to their offering. The global 3D IC market is projected to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards. The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure. APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market. Companies Mentioned: - Advanced Semiconductor Engineering (ASE) - Samsung - STMicroelectronics - Taiwan Semiconductors Manufacturing (TSMC) - Toshiba - Intel - Micron - SanDisk - SK Hynix - STATS ChipPAC - United Microelectronics - Xilinx. Key Topics Covered: PART 01: Executive summary PART 02: Scope of the report PART 03: Market research methodology PART 04: Introduction PART 05: Market landscape PART 06: Market segmentation by product types PART 07: Geographical segmentation PART 08: Market drivers PART 09: Market challenges PART 10: Impact of drivers and challenges PART 11: Market trends PART 12: Vendor landscape PART 13: Key vendor analysis For more information visit http://www.researchandmarkets.com/research/nr...obal_3d_ic
ASX: 5.27 (-0.25), UMC: 1.92 (-0.07), XLNX: 45.31 (-2.13)
Semiconductor Packaging and Test Market in China to Grow by 7.05% CAGR over Five Years - Analysis & Forecast 2015-2019
M2 - Mon Dec 07, 2:51AM CST
Research and Markets (http://www.researchandmarkets.com/research/9hbmcq/semiconductor) has announced the addition of the "Semiconductor Packaging and Test Market in China 2015-2019" report to their offering. The report forecasts the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019. The report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market. Key Topics Covered: The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis: - IDM (integrated devices manufacturers) - Outsourced semiconductor assembly and test (OSAT) Questions Answered: - What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be? - What are the key Market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? Companies Mentioned: - Amkor Technology - ASE - Powertech Technology - Siliconware Precision Industries (SPIL) - STATS ChipPAC - UTAC - ChipMos - Greatek - Huahong - JCET - KYEC - Lingsen Precision - Nepes - SMIC - Tianshui Huatian - Unisem Report Structure PART 01: Executive summary PART 02: Scope of the report PART 03: Market research methodology PART 04: Introduction PART 05: Market landscape PART 06: Market segmentation by business type PART 07: Market drivers PART 08: Impact of drivers PART 09: Market challenges PART 10: Impact of drivers and challenges PART 11: Market trends PART 12: Vendor landscape PART 13: Key vendor analysis PART 14: Appendix PART 15: About the Author For more information visit http://www.researchandmarkets.com/research/9h...iconductor
AMKR: 5.80 (-0.39), SPIL: 7.31 (-0.27)
STATS ChipPAC Ltd. Announces Pricing of New Senior Secured Notes
Marketwired - Tue Nov 17, 4:37PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, which had earlier on 9 November 2015 announced the proposed offering of new senior secured notes, has today announced the pricing of its $425.0 million in aggregate principal amount of 8.5% senior secured notes due 2020 (the "New Notes" . The New Notes are expected to be issued on November 24, 2015, and the issue of the New Notes is subject to the satisfaction of customary closing conditions.
STATS ChipPAC Ltd. Announces Proposed Private Placement of New Senior Secured Notes
Marketwired - Mon Nov 09, 9:31AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce that the Company intends to, subject to market conditions and other factors, commence an offering of new senior secured notes (the "New Notes" .
STATS ChipPAC Ltd. Announces Expiration and Final Results of Its Change of Control Offer for the Existing Notes
Marketwired - Fri Oct 16, 6:34AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced the expiration and final results of the change of control offer in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" .
STATS ChipPAC Ltd. Announces Expiration and Final Results of Its Tender Offer for the Existing Notes
Marketwired - Tue Oct 13, 8:21AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced the expiration and final results of the cash tender offer and consent solicitation in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" .
The Semiconductor Market Is Expected to Post a CAGR of 4.2% Over the Next Five Years
M2 - Mon Oct 05, 6:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zfss45/the_worldwide_ic) has announced the addition of the "The Worldwide IC Packaging Market 2015 Edition" report to their offering. While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (consumer, computer, communications, transportation,industrial) are benefiting and leading to new product innovation. Following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline some what in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years. This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market by package type and application. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth. Following this high-level review, the report presents forecasts for the total worldwide IC packaging marketplace (Chapter 4), and explains the market segmentation defined by NVR. Next, the report dives deeply into an analysis of each semiconductor product type (Chapter 5), and segments these products by package family, I/O count range and general market application. The analysis returns to the individual package families (Chapter 6) and presents each in terms of semiconductor devices and I/O count. In all tables, unit shipments and revenue figures are displayed for each segment. Next, the report presents NVR's continuing coverage of the outsourced semiconductor assembly and test (OSAT) market. These companies already comprise a significant share of the worldwide IC packaging market and will continue to grow in importance in the coming years. The report presents the total OSAT market in terms of both unit shipments and revenues. To help you further assess this group of companies, the report profiles the activities of the leading OSAT companies and the packages they offer. Key Topics Covered: Chapter 1: Introduction Chapter 2: Executive Summary Chapter 3: The State of the Industry Chapter 4: Worldwide IC Packaging Market Chapter 5: IC Package Market Analysis and Forecasts by Semiconductor Device - 2013-2019 Chapter 6: IC Package Market Analysis and Forecasts by Packaging Family - 2013-2019 Chapter 7: OSAT Market Analysis and Forecasts Chapter 8: OSAT Company Profiles - 3D Plus, Inc. - Advotech - AIC Semiconductor - Amkor - Anst China - ASE - Azimuth - Carsem - Chant World Technology - China Wafer Level CSP - ChipMOS - Cirtek - CONNECTEC Japan - CORWIL Technology - Deca Technologies - FlipChip Int'l - Greatek Electronics - HANA Microelectronics - HANA Micron - I2a Technology - J-Devices - Jiangsu Changjiang - Lingsen Precision - NANIUM - Nantong Fujitsu - OSE - Powertech - Shinko Electric - Signetics - Sigurd - Siliconware - SPEL - STATS ChipPAC - Tera Probe - Tianshui Huatian Tech For more information visit http://www.researchandmarkets.com/research/zf...rldwide_ic
STATS ChipPAC Ltd. Announces Its Election to Exercise Early Purchase Option and the Early Settlement Date
Marketwired - Wed Sep 30, 8:35PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce that it has elected to exercise the early purchase option with respect to its Offer and Consent Solicitation in respect of its $200 million 5.375% Senior Notes due 2016 and $611.152 million 4.5% Senior Notes due 2018 (collectively, the "Existing Notes" .
STATS ChipPAC Ltd. Announces Early Results of the Tender Offer and Consent Solicitation for Its Existing Notes
Marketwired - Mon Sep 28, 10:49AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce the early results of the cash tender offer and consent solicitation in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" .
3D TSV Devices - Global Strategic Business Report 2015: Noteworthy Market Trends & Growth Drivers
M2 - Mon Sep 21, 3:35AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jctcgf/3d_tsv_devices) has announced the addition of the "3D TSV Devices - Global Strategic Business Report" report to their offering. This report analyzes the worldwide markets for 3D TSV Devices in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 28 companies including many key and niche players such as - Amkor Technology, Inc. (US) - GLOBALFOUNDRIES (US) - Invensas Corporation (US) - Iwate Toshiba Electronics Co., Ltd. (Japan) - Micron Technology, Inc. (US) - Samsung Electronics Co., Ltd. (South Korea) - SK Hynix Inc. (South Korea) - Sony Corporation (Japan) - STATS ChipPAC Ltd. (Singapore) - Taiwan Semiconductor Manufacturing Company Limited (TSMC) ( Taiwan) - Teledyne DALSA Inc. (Canada) - Tezzaron Semiconductor Corp. (US) - United Microelectronics Corporation (UMC) (Taiwan) - Xilinx Inc. (US) Key Topics Covered: 1. INDUSTRY OVERVIEW 2. NOTEWORTHY MARKET TRENDS & GROWTH DRIVERS 3. PRODUCT/TECHNOLOGY OVERVIEW 4. PRODUCT INTRODUCTIONS/LAUNCHES 5. RECENT INDUSTRY ACTIVITY 6. FOCUS ON SELECT GLOBAL PLAYERS 7. GLOBAL MARKET PERSPECTIVE Total Companies Profiled: 28 (including Divisions/Subsidiaries - 29) - The United States (10) - Canada (1) - Japan (3) - Europe (5) - - France (1) - - Germany (1) - - The United Kingdom (1) - - Rest of Europe (2) - Asia-Pacific (Excluding Japan) (9) - Middle East (1) For more information visit http://www.researchandmarkets.com/research/jc...sv_devices
AMKR: 5.80 (-0.39), MU: 13.21 (-0.84), UMC: 1.92 (-0.07), XLNX: 45.31 (-2.13), SNE: 27.60 (-1.40), TSM: 25.68 (-1.13)
IC Packaging Market in Taiwan 2015-2019 - Rise in Demand for Smartphones and Tablets a Major Market Driver
M2 - Wed Sep 16, 9:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/kfjq6m/ic_packaging) has announced the addition of the "IC Packaging Market in Taiwan 2015-2019" report to their offering. The IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019. This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. The authoruses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size. Portable electronic devices such as smartphones and tablets become obsolete after a short time. This is because of rapid launches of next-version models by vendors. The duration of the replacement-cycle period, on average, is 8-12 months. In the past, the replacement period was much longer. Because of the reduction in product-replacement-cycle time, the demand for semiconductor ICs in newly launched devices is expected to rise drastically, and this will increase the demand for IC packaging, leading to the growth of the market. According to the report, the availability of low-cost smartphones in Taiwan and increased access to the internet are expected to increase the shipments of smartphones and tablets during the forecast period. With the increasing functionality of smartphones and tablets coupled with the growing LTE infrastructure, consumers are demanding these devices at a higher rate. Semiconductor ICs, an integral part of such devices, will undergo a similar rise in demand, leading to market growth during the forecast period. Further, the report states that the market requires high capital investment, which is a major challenge for its growth. Key Vendors - Advanced Semiconductor Engineering - Powertech Technology - Siliconware Precision Industries Other Prominent Vendors - Amkor Technology - ChipMOS Technologies - Greatek Electronics - King Yuan ELECTRONICS - Orient Semiconductor Electronics - STATS ChipPAC - UTAC For more information visit http://www.researchandmarkets.com/research/kf..._packaging
AMKR: 5.80 (-0.39), ASX: 5.27 (-0.25), SPIL: 7.31 (-0.27), IMOS: 18.20 (-0.63)
Significance of Possible Acquisition of Micron by Tsinghua Unigroup
M2 - Mon Sep 07, 2:58AM CDT
Research and Markets (http://www.researchandmarkets.com/research/d4k7d4/significance_of) has announced the addition of the "Significance of Possible Acquisition of Micron by Tsinghua Unigroup" report to their offering. China's Tsinghua Unigroup is alleged to acquire the largest US memory company Micron, according to the Wall Street Journal on July 14, 2015. While the news has yet to be confirmed by both companies, it has aroused considerable interest in the worldwide semiconductor industry and evoked heated discussions in China as well as overseas. This report will take a close look at the purposes, influences, and challenges of the acquisition. List of Topics - Background analysis of Tsinghua Unigroup's intention to acquire Micron and the Chinese government's memory industry policies - Potential influences of the acquisition, both on Taiwanese vendors and the worldwide memory industry - Hurdles that Tsinghua Unigroup may face when trying to acquire Micron, including conflicts with Micron's long-term strategies and US government's disapproval Key Topics Covered: 1. Purposes of the Acquisition Offer 2. Potential Influences of the Acquisition 3. Challenges Ahead of Acquisition Companies Mentioned - Changjiang Electronics Technology - Dongbu HiTek - Elite Semiconductor - Memory Technology - Elpida Memory - Etron Technology - Hua Capital - IM Flash - Inotera Memories - Intel - ISSI - Macronix - Micron - Micron Memory Taiwan (Rexchip Electronics) - Nanya Technology - Numonyx - OmniVision - PTI - Qualcomm - Samsung - Shanghai HuaLi Microelectronics - SK Hynix - SMIC - STATS ChipPAC - Toshiba - Tsinghua Unigroup - Winbond Electronics - Sinochip Semiconductors - Xinxin Semiconductor Manufacturing For more information visit http://www.researchandmarkets.com/research/d4...ficance_of
QCOM: 52.12 (-3.43)
STATS ChipPAC Ltd. Announces: (1) Tender Offer and Consent Solicitation in Respect of the Existing Notes, and (2) Change of Control Offer for the Existing Notes
Marketwired - Fri Sep 04, 6:27AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced that it has commenced a cash tender offer and consent solicitation in respect of any and all of its outstanding $200 million of 5.375% Senior Notes due 2016 (the "2016 Notes" and any and all of its outstanding $611.152 million of 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" .
STATS ChipPAC Appoints New Chief Financial Officer
Marketwired - Wed Aug 05, 7:40AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today the appointment of Kwek Kiong Woo ("KK Woo" as Senior Vice President and Chief Financial Officer for the Company.
STATS ChipPAC Appoints Co-President and Chief Executive Officer
Marketwired - Wed Aug 05, 7:37AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr Han Byung Joon ("Dr BJ Han" as Co-President and Chief Executive Officer for the Company, together with Mr Tan Lay Koon.
Global and Chinese Advanced Packaging Industry Report, 2014-2015
M2 - Thu Jul 09, 8:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/qrp2nm/global_and) has announced the addition of the "Global and Chinese Advanced Packaging Industry Report, 2014-2015" report to their offering. Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD 27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016. New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers. Two pronounced trends of OSAT industry are: 1) Revenue growth of large companies far exceeds that of small ones, as the former has more funding for R&D than the latter, and OSAT industry hungers for new technologies. Long-term development of the companies cannot be realized without adequate technology accumulation. 2) Chinese OAST companies grow at the fastest rate, largely due to strong liquidity and hot stock market, which provide strong financial backing for OSAT companies, thus giving them adequate funds for R&D and capacity expansion. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions. Global and Chinese Advanced Packaging Industry Report, 2014-2015 focuses on the followings: 1 Analysis of Global Semiconductor Market and Industry 2 Analysis of Chinese Semiconductor Market and Industry 3 Technical Trends of Advanced Packaging 4 Analysis of Global and China Advanced Packaging Industry 5 Study of 24 Advanced Packaging Vendors Key Topics Covered: 1 Global Semiconductor Industry 2 Downstream Markets of IC Packaging Industry 3 Trends of Packaging & Test Technology 4 Packaging & Test Industry 5 Packaging & Test Vendors - ASE - Amkor - China Wafer Level CSP - ChipMOS - Chipbond - FATC - Greatek - Hana Micron - J-DEVICES - JECT - KYEC - Lingsen Precision - MPI - NEPES - Nantong Fujitsu Microelectronics - PTI - SPIL - STATS ChipPAC - STS Semiconductor - Signetics - Tianshui Huatian Technology - UTAC - Unisem - Walton Advanced Engineering For more information visit http://www.researchandmarkets.com/research/qrp2nm/global_and
STATS ChipPAC's Fan-Out Wafer Level Packaging Shipments Exceed 1 Billion Units
Marketwire Canada - Tue May 10, 3:40PM CDT
Reflects Strong Demand for eWLB in Mobile Market With Accelerating Adoption in Internet of Things, Wearables, MEMS and Automotive Applications
Air Products Awarded Long-term Contract to Supply Leading Semiconductor Packaging and Test Services Company in South Korea
PR Newswire - Tue Apr 05, 8:56AM CDT
Air Products (NYSE: APD) today announced it has been awarded a long-term contract by JCET STATS ChipPAC Korea Ltd. (JSCK), a leading semiconductor packaging and test services provider, to supply tonnage quantities of nitrogen to its new production facility in Incheon, South Korea.
APD: 140.12 (-5.90)
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations
Marketwired - Mon Jan 18, 4:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
, a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2015 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology. This is the sixth consecutive year that STATS ChipPAC has been recognised in the annual scorecards. Global 3D IC Market 2015-2019 - High Proliferation of IoT Devices to Boost Market Growth
M2 - Mon Dec 21, 5:35AM CST
Research and Markets (http://www.researchandmarkets.com/research/nrjdlr/global_3d_ic) has announced the addition of the "Global 3D IC Market 2015-2019" report to their offering. The global 3D IC market is projected to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards. The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure. APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market. Companies Mentioned: - Advanced Semiconductor Engineering (ASE) - Samsung - STMicroelectronics - Taiwan Semiconductors Manufacturing (TSMC) - Toshiba - Intel - Micron - SanDisk - SK Hynix - STATS ChipPAC - United Microelectronics - Xilinx. Key Topics Covered: PART 01: Executive summary PART 02: Scope of the report PART 03: Market research methodology PART 04: Introduction PART 05: Market landscape PART 06: Market segmentation by product types PART 07: Geographical segmentation PART 08: Market drivers PART 09: Market challenges PART 10: Impact of drivers and challenges PART 11: Market trends PART 12: Vendor landscape PART 13: Key vendor analysis For more information visit http://www.researchandmarkets.com/research/nr...obal_3d_ic
ASX: 5.27 (-0.25), UMC: 1.92 (-0.07), XLNX: 45.31 (-2.13)
Semiconductor Packaging and Test Market in China to Grow by 7.05% CAGR over Five Years - Analysis & Forecast 2015-2019
M2 - Mon Dec 07, 2:51AM CST
Research and Markets (http://www.researchandmarkets.com/research/9hbmcq/semiconductor) has announced the addition of the "Semiconductor Packaging and Test Market in China 2015-2019" report to their offering. The report forecasts the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019. The report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market. Key Topics Covered: The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis: - IDM (integrated devices manufacturers) - Outsourced semiconductor assembly and test (OSAT) Questions Answered: - What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be? - What are the key Market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? Companies Mentioned: - Amkor Technology - ASE - Powertech Technology - Siliconware Precision Industries (SPIL) - STATS ChipPAC - UTAC - ChipMos - Greatek - Huahong - JCET - KYEC - Lingsen Precision - Nepes - SMIC - Tianshui Huatian - Unisem Report Structure PART 01: Executive summary PART 02: Scope of the report PART 03: Market research methodology PART 04: Introduction PART 05: Market landscape PART 06: Market segmentation by business type PART 07: Market drivers PART 08: Impact of drivers PART 09: Market challenges PART 10: Impact of drivers and challenges PART 11: Market trends PART 12: Vendor landscape PART 13: Key vendor analysis PART 14: Appendix PART 15: About the Author For more information visit http://www.researchandmarkets.com/research/9h...iconductor
AMKR: 5.80 (-0.39), SPIL: 7.31 (-0.27)
STATS ChipPAC Ltd. Announces Pricing of New Senior Secured Notes
Marketwired - Tue Nov 17, 4:37PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, which had earlier on 9 November 2015 announced the proposed offering of new senior secured notes, has today announced the pricing of its $425.0 million in aggregate principal amount of 8.5% senior secured notes due 2020 (the "New Notes" . The New Notes are expected to be issued on November 24, 2015, and the issue of the New Notes is subject to the satisfaction of customary closing conditions. STATS ChipPAC Ltd. Announces Proposed Private Placement of New Senior Secured Notes
Marketwired - Mon Nov 09, 9:31AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce that the Company intends to, subject to market conditions and other factors, commence an offering of new senior secured notes (the "New Notes" . STATS ChipPAC Ltd. Announces Expiration and Final Results of Its Change of Control Offer for the Existing Notes
Marketwired - Fri Oct 16, 6:34AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced the expiration and final results of the change of control offer in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" . STATS ChipPAC Ltd. Announces Expiration and Final Results of Its Tender Offer for the Existing Notes
Marketwired - Tue Oct 13, 8:21AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced the expiration and final results of the cash tender offer and consent solicitation in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" . The Semiconductor Market Is Expected to Post a CAGR of 4.2% Over the Next Five Years
M2 - Mon Oct 05, 6:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zfss45/the_worldwide_ic) has announced the addition of the "The Worldwide IC Packaging Market 2015 Edition" report to their offering. While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (consumer, computer, communications, transportation,industrial) are benefiting and leading to new product innovation. Following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline some what in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years. This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market by package type and application. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth. Following this high-level review, the report presents forecasts for the total worldwide IC packaging marketplace (Chapter 4), and explains the market segmentation defined by NVR. Next, the report dives deeply into an analysis of each semiconductor product type (Chapter 5), and segments these products by package family, I/O count range and general market application. The analysis returns to the individual package families (Chapter 6) and presents each in terms of semiconductor devices and I/O count. In all tables, unit shipments and revenue figures are displayed for each segment. Next, the report presents NVR's continuing coverage of the outsourced semiconductor assembly and test (OSAT) market. These companies already comprise a significant share of the worldwide IC packaging market and will continue to grow in importance in the coming years. The report presents the total OSAT market in terms of both unit shipments and revenues. To help you further assess this group of companies, the report profiles the activities of the leading OSAT companies and the packages they offer. Key Topics Covered: Chapter 1: Introduction Chapter 2: Executive Summary Chapter 3: The State of the Industry Chapter 4: Worldwide IC Packaging Market Chapter 5: IC Package Market Analysis and Forecasts by Semiconductor Device - 2013-2019 Chapter 6: IC Package Market Analysis and Forecasts by Packaging Family - 2013-2019 Chapter 7: OSAT Market Analysis and Forecasts Chapter 8: OSAT Company Profiles - 3D Plus, Inc. - Advotech - AIC Semiconductor - Amkor - Anst China - ASE - Azimuth - Carsem - Chant World Technology - China Wafer Level CSP - ChipMOS - Cirtek - CONNECTEC Japan - CORWIL Technology - Deca Technologies - FlipChip Int'l - Greatek Electronics - HANA Microelectronics - HANA Micron - I2a Technology - J-Devices - Jiangsu Changjiang - Lingsen Precision - NANIUM - Nantong Fujitsu - OSE - Powertech - Shinko Electric - Signetics - Sigurd - Siliconware - SPEL - STATS ChipPAC - Tera Probe - Tianshui Huatian Tech For more information visit http://www.researchandmarkets.com/research/zf...rldwide_ic
STATS ChipPAC Ltd. Announces Its Election to Exercise Early Purchase Option and the Early Settlement Date
Marketwired - Wed Sep 30, 8:35PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce that it has elected to exercise the early purchase option with respect to its Offer and Consent Solicitation in respect of its $200 million 5.375% Senior Notes due 2016 and $611.152 million 4.5% Senior Notes due 2018 (collectively, the "Existing Notes" . STATS ChipPAC Ltd. Announces Early Results of the Tender Offer and Consent Solicitation for Its Existing Notes
Marketwired - Mon Sep 28, 10:49AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, wishes to announce the early results of the cash tender offer and consent solicitation in respect of its $200 million 5.375% Senior Notes due 2016 (the "2016 Notes" and $611.152 million 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" . 3D TSV Devices - Global Strategic Business Report 2015: Noteworthy Market Trends & Growth Drivers
M2 - Mon Sep 21, 3:35AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jctcgf/3d_tsv_devices) has announced the addition of the "3D TSV Devices - Global Strategic Business Report" report to their offering. This report analyzes the worldwide markets for 3D TSV Devices in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 28 companies including many key and niche players such as - Amkor Technology, Inc. (US) - GLOBALFOUNDRIES (US) - Invensas Corporation (US) - Iwate Toshiba Electronics Co., Ltd. (Japan) - Micron Technology, Inc. (US) - Samsung Electronics Co., Ltd. (South Korea) - SK Hynix Inc. (South Korea) - Sony Corporation (Japan) - STATS ChipPAC Ltd. (Singapore) - Taiwan Semiconductor Manufacturing Company Limited (TSMC) ( Taiwan) - Teledyne DALSA Inc. (Canada) - Tezzaron Semiconductor Corp. (US) - United Microelectronics Corporation (UMC) (Taiwan) - Xilinx Inc. (US) Key Topics Covered: 1. INDUSTRY OVERVIEW 2. NOTEWORTHY MARKET TRENDS & GROWTH DRIVERS 3. PRODUCT/TECHNOLOGY OVERVIEW 4. PRODUCT INTRODUCTIONS/LAUNCHES 5. RECENT INDUSTRY ACTIVITY 6. FOCUS ON SELECT GLOBAL PLAYERS 7. GLOBAL MARKET PERSPECTIVE Total Companies Profiled: 28 (including Divisions/Subsidiaries - 29) - The United States (10) - Canada (1) - Japan (3) - Europe (5) - - France (1) - - Germany (1) - - The United Kingdom (1) - - Rest of Europe (2) - Asia-Pacific (Excluding Japan) (9) - Middle East (1) For more information visit http://www.researchandmarkets.com/research/jc...sv_devices
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IC Packaging Market in Taiwan 2015-2019 - Rise in Demand for Smartphones and Tablets a Major Market Driver
M2 - Wed Sep 16, 9:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/kfjq6m/ic_packaging) has announced the addition of the "IC Packaging Market in Taiwan 2015-2019" report to their offering. The IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019. This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. The authoruses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size. Portable electronic devices such as smartphones and tablets become obsolete after a short time. This is because of rapid launches of next-version models by vendors. The duration of the replacement-cycle period, on average, is 8-12 months. In the past, the replacement period was much longer. Because of the reduction in product-replacement-cycle time, the demand for semiconductor ICs in newly launched devices is expected to rise drastically, and this will increase the demand for IC packaging, leading to the growth of the market. According to the report, the availability of low-cost smartphones in Taiwan and increased access to the internet are expected to increase the shipments of smartphones and tablets during the forecast period. With the increasing functionality of smartphones and tablets coupled with the growing LTE infrastructure, consumers are demanding these devices at a higher rate. Semiconductor ICs, an integral part of such devices, will undergo a similar rise in demand, leading to market growth during the forecast period. Further, the report states that the market requires high capital investment, which is a major challenge for its growth. Key Vendors - Advanced Semiconductor Engineering - Powertech Technology - Siliconware Precision Industries Other Prominent Vendors - Amkor Technology - ChipMOS Technologies - Greatek Electronics - King Yuan ELECTRONICS - Orient Semiconductor Electronics - STATS ChipPAC - UTAC For more information visit http://www.researchandmarkets.com/research/kf..._packaging
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Significance of Possible Acquisition of Micron by Tsinghua Unigroup
M2 - Mon Sep 07, 2:58AM CDT
Research and Markets (http://www.researchandmarkets.com/research/d4k7d4/significance_of) has announced the addition of the "Significance of Possible Acquisition of Micron by Tsinghua Unigroup" report to their offering. China's Tsinghua Unigroup is alleged to acquire the largest US memory company Micron, according to the Wall Street Journal on July 14, 2015. While the news has yet to be confirmed by both companies, it has aroused considerable interest in the worldwide semiconductor industry and evoked heated discussions in China as well as overseas. This report will take a close look at the purposes, influences, and challenges of the acquisition. List of Topics - Background analysis of Tsinghua Unigroup's intention to acquire Micron and the Chinese government's memory industry policies - Potential influences of the acquisition, both on Taiwanese vendors and the worldwide memory industry - Hurdles that Tsinghua Unigroup may face when trying to acquire Micron, including conflicts with Micron's long-term strategies and US government's disapproval Key Topics Covered: 1. Purposes of the Acquisition Offer 2. Potential Influences of the Acquisition 3. Challenges Ahead of Acquisition Companies Mentioned - Changjiang Electronics Technology - Dongbu HiTek - Elite Semiconductor - Memory Technology - Elpida Memory - Etron Technology - Hua Capital - IM Flash - Inotera Memories - Intel - ISSI - Macronix - Micron - Micron Memory Taiwan (Rexchip Electronics) - Nanya Technology - Numonyx - OmniVision - PTI - Qualcomm - Samsung - Shanghai HuaLi Microelectronics - SK Hynix - SMIC - STATS ChipPAC - Toshiba - Tsinghua Unigroup - Winbond Electronics - Sinochip Semiconductors - Xinxin Semiconductor Manufacturing For more information visit http://www.researchandmarkets.com/research/d4...ficance_of
QCOM: 52.12 (-3.43)
STATS ChipPAC Ltd. Announces: (1) Tender Offer and Consent Solicitation in Respect of the Existing Notes, and (2) Change of Control Offer for the Existing Notes
Marketwired - Fri Sep 04, 6:27AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today announced that it has commenced a cash tender offer and consent solicitation in respect of any and all of its outstanding $200 million of 5.375% Senior Notes due 2016 (the "2016 Notes" and any and all of its outstanding $611.152 million of 4.5% Senior Notes due 2018 (the "2018 Notes" and, together with the 2016 Notes, the "Existing Notes" . STATS ChipPAC Appoints New Chief Financial Officer
Marketwired - Wed Aug 05, 7:40AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today the appointment of Kwek Kiong Woo ("KK Woo" as Senior Vice President and Chief Financial Officer for the Company. STATS ChipPAC Appoints Co-President and Chief Executive Officer
Marketwired - Wed Aug 05, 7:37AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr Han Byung Joon ("Dr BJ Han" as Co-President and Chief Executive Officer for the Company, together with Mr Tan Lay Koon. Global and Chinese Advanced Packaging Industry Report, 2014-2015
M2 - Thu Jul 09, 8:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/qrp2nm/global_and) has announced the addition of the "Global and Chinese Advanced Packaging Industry Report, 2014-2015" report to their offering. Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD 27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016. New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers. Two pronounced trends of OSAT industry are: 1) Revenue growth of large companies far exceeds that of small ones, as the former has more funding for R&D than the latter, and OSAT industry hungers for new technologies. Long-term development of the companies cannot be realized without adequate technology accumulation. 2) Chinese OAST companies grow at the fastest rate, largely due to strong liquidity and hot stock market, which provide strong financial backing for OSAT companies, thus giving them adequate funds for R&D and capacity expansion. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions. Global and Chinese Advanced Packaging Industry Report, 2014-2015 focuses on the followings: 1 Analysis of Global Semiconductor Market and Industry 2 Analysis of Chinese Semiconductor Market and Industry 3 Technical Trends of Advanced Packaging 4 Analysis of Global and China Advanced Packaging Industry 5 Study of 24 Advanced Packaging Vendors Key Topics Covered: 1 Global Semiconductor Industry 2 Downstream Markets of IC Packaging Industry 3 Trends of Packaging & Test Technology 4 Packaging & Test Industry 5 Packaging & Test Vendors - ASE - Amkor - China Wafer Level CSP - ChipMOS - Chipbond - FATC - Greatek - Hana Micron - J-DEVICES - JECT - KYEC - Lingsen Precision - MPI - NEPES - Nantong Fujitsu Microelectronics - PTI - SPIL - STATS ChipPAC - STS Semiconductor - Signetics - Tianshui Huatian Technology - UTAC - Unisem - Walton Advanced Engineering For more information visit http://www.researchandmarkets.com/research/qrp2nm/global_and
