Dublin, Dec. 09, 2015 (GLOBE NEWSWIRE) -- Research and Markets ( http://www.researchandmarkets.com/research/j4..._galaxy_s6 ) has announced the addition of the "Samsung Galaxy S6 Teardown & Physical Analyses of Key Components - Reverse Technology Report" report to their offering. The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 notable components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging. Five MEMS/Sensors components Fingerprint sensor - second generation eCompass - new reference which has never been used in a smartphone and smallest eCompass on the market OIS gyroscope - smallest gyroscope on the market Heart-rate monitor sensor and color, ambient light and proximity sensor - rarely integrated in a smartphone Imaging components Front and rear camera modules as well as flash LED Two packaging components Samsung Exynos Processor - advanced Package-on-Package (PoP) structure Samsung power management IC - smallest pitch Wafer-Level Package (WLP) on the board One RF component Wi-Fi & Bluetooth combo module - flip-chip BGA SiP integrating the industry's most powerful 5G WiFi combo chip Key Topics Covered: 1. Executive Summary - High Resolution Pictures - ICs Identification - ICs Identification (mfr., ref., fcn., pkg. type, size & pin count) - Unknown Components Decapsulation - Repartition by package type - Mfr. Design wins ranking - ICs footprint ranking - PCB Characteristics - PCB Cross-Section - PCB min. line width 2. Advanced Packaging - Samsung Exynos PoP - Package views & dimensions - Package Cross-Section - Package Opening - Processor & DRAM dies measurement - Samsung smallest pitch WLP - Package views & dimensions - Package Cross-Section 3. MEMS/Sensors - Fingerprint Sensor - Button Assembly View - Fingerprint sensor views & dimensions - Fingerprint sensor Cross-Section - Sensor die measurement - 3-Axis eCompass - Package views & dimensions - Package Cross-Section - Die measurement - Sensor Details - OIS Gyroscope - Assembly in camera module - Package views & dimensions - Package Opening & Die measurement - MEMS opening & sensor details - Cross-Section - Pulse Oximetry & Heart-Rate Monitor Sensor - Package views & dimensions - Package Opening & Die measurement - Color, ALS and Proximity Sensor - Package views & dimensions - Package Opening & Dies measurement 4. RF Devices - 5G Wi-Fi & Bluetooth Combo Chip - Package views & dimensions - Package Opening & Dies measurement 5. Camera Modules & Flash LED - 16Mp Rear Camera Module - Module views & dimensions - Module Opening & CIS die measurement - Module Cross-Section - 5Mp Front Camera Module - Module views & dimensions - Module Opening & CIS die measurement - Module Cross-Section - Flash LED - Package views & dimensions - Package Opening & LED die measurement For more information visit http://www.researchandmarkets.com/research/j4..._galaxy_s6
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