New nViant TM CO 2 -Laser-Based HDI Processing System Delivers the Precision, Accuracy and Throughput Required for High Volume Manufacturing of PCB’s
PORTLAND, Ore., Dec. 04, 2015 (GLOBE NEWSWIRE) -- Electro Scientific Industries, Inc. (NASDAQ: ESIO ), an innovator of laser-based manufacturing solutions for the micromachining industry, today introduced its nViant™ laser processing system designed for High-Density Interconnect (HDI) applications. The nViant™ system expands ESI’s portfolio of solutions for the Printed Circuit Board (PCB) industry. This portfolio already includes the industry-leading 5335 family of tools for flexible printed circuit via drilling as well as the CornerStone™ via drilling system for manufacturing high accuracy substrates used for integrated circuits.
A CO 2 laser-based microvia drilling system, nViant™ combines excellent quality via formation with industry-leading accuracy on a robust platform that delivers high throughput at a competitive price point. The nViant™ system was designed and built for manufacturers of HDI boards, used in smartphones, wearables and other mobile devices. HDI components are also used in industrial and automotive markets.
High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. The nViant™ system enables HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. The nViant™ system joins ESI’s long history of products targeted for the production floor and reinforces ESI’s focus and experience on speed, quality and accuracy.
“nViant™ leverages our expertise in laser processing and our proven track record of success in laser-based systems—especially in the flexible PCB manufacturing segment, where ESI is the clear market leader—and applies it to the HDI manufacturing segment,” said Chris Ryder, Director of HDI Product Management at ESI. “The nViant™ system delivers a compelling solution for HDI PCB manufacturers. It’s engineered to provide great reliability at high-quality output with the industry’s lowest cost of ownership, and is backed by ESI’s professional service and support organization with local offices throughout the world.”
For PCB manufacturers of HDI boards, CO 2 laser processing is the optimal choice for overall lower cost of ownership. ESI’s nViant™ system extends this advantage with robust platform construction that allows for 24/7 operation. Support is provided through ESI’s professional service organization.
The launch of nViant™ is taking place in conjunction with the 2015 International Printed Circuit & APEX South China Fair (2015 HKPCA & IPC Show) December 2-4 at the Shenzhen Convention and Exhibition Center in Shenzhen, China.
Availability
The nViant™ HDI CO 2 laser microvia drilling system is available for order beginning mid-December, worldwide. For more information go to: http://www.esi.com/Products/ViaDrilling/High-...Viant.aspx
About ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com .
Electro Scientific Industries and ESI are registered trademarks of Electro Scientific Industries, Inc. All other trade names referenced are the service marks, trademarks or registered trademarks of their respective companies.
Media Contacts: Rob Goodman Account Manager, McKenzie Worldwide robg@mckenzieworldwide.com 503-380-2441 ESI Brian Smith 503-672-5760 smithb@esi.com
