Micropac Industries Inc (MPAD) 9.0500 $MPAD
Global Radiation Hardened Electronic Devices and Components Market Analysis 2013-2019
M2 - Wed Feb 18, 3:20AM CST
Research and Markets (http://www.researchandmarkets.com/research/rb6f8d/global_radiation) has announced the addition of the "Global Radiation Hardened Electronic Devices and Components Market Analysis (2013 - 2019)" report to their offering. Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years. The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others. Key Topics Covered: 1 Rad-Hard And Rad-Tol Edc- Market Overview 2 Executive Summary 3 Rad-Hard Edc Market Landscape 4 Rad-Hard Edc Market Forces 5 Rad-Hard Edc Market - Strategic Analysis 6 Rad Hard Edc Market By Products 7 Rad Hard Edc Market By Materials 8 Rad Hard Edc Market By Product-Type 9 Rad Hard Edc Market By Industry Verticals 10 Rad Hard Edc Market - Geographic Analysis 11 Market Entropy 12 Company Profiles - Aeroflex Inc. - Atmel Corporation - Bae Systems Plc - Crane Co. - Honeywell Aerospace - International Rectifier Corporation - Intersil Corporation - Linear Technology Corporation - Maxwell Technologies Inc. - Microsemi Corporation - Stmicroelectronics Nv - Texas Instruments Inc. - Xilinx Inc. - Micropac Industries Inc. - Ms Kennedy Corporation - Peregrine Semiconductor Corp - Semicoa Corporation - Teledyne Microelectronic Technologies, Inc. - 3D Plus SA. - Aitech Defense Systems Inc. For more information visit http://www.researchandmarkets.com/research/rb..._radiation
HON: 101.16 (+0.09), LLTC: 41.21 (-0.58), MSCC: 35.27 (-0.80), ISIL: 12.33 (-0.14), ATML: 8.57 (+0.04), MXWL: 6.23 (+0.14), XLNX: 44.90 (-0.24), IRF: 39.98 (-0.01), TXN: 50.87 (-0.65), CR: 51.16 (+0.77)
Micropac Industries declares special dividend of USD0.10 per share
M2 - Thu Dec 18, 5:36AM CST
The board of directors of Micropac Industries Inc (OTC BB:MPAD) a diversified, high technology company, authorised a special common stock dividend of USD0.10 per share, the company declared on Wednesday.
Micropac Industries, Inc. Approves Special Dividend
PR Newswire - Wed Dec 17, 11:27AM CST
The Board of Directors of Micropac Industries, Inc. (OTC Bulletin Board: MPAD) has approved the payment of a special common stock dividend of $0.10 per share payable to shareholders of record on January 12, 2015. It is anticipated that the payment date for such dividend will be on or about February 10, 2015.
Global Radiation Hardened Electronic Devices and Components Market Analysis 2013-2019
M2 - Wed Feb 18, 3:20AM CST
Research and Markets (http://www.researchandmarkets.com/research/rb6f8d/global_radiation) has announced the addition of the "Global Radiation Hardened Electronic Devices and Components Market Analysis (2013 - 2019)" report to their offering. Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years. The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others. Key Topics Covered: 1 Rad-Hard And Rad-Tol Edc- Market Overview 2 Executive Summary 3 Rad-Hard Edc Market Landscape 4 Rad-Hard Edc Market Forces 5 Rad-Hard Edc Market - Strategic Analysis 6 Rad Hard Edc Market By Products 7 Rad Hard Edc Market By Materials 8 Rad Hard Edc Market By Product-Type 9 Rad Hard Edc Market By Industry Verticals 10 Rad Hard Edc Market - Geographic Analysis 11 Market Entropy 12 Company Profiles - Aeroflex Inc. - Atmel Corporation - Bae Systems Plc - Crane Co. - Honeywell Aerospace - International Rectifier Corporation - Intersil Corporation - Linear Technology Corporation - Maxwell Technologies Inc. - Microsemi Corporation - Stmicroelectronics Nv - Texas Instruments Inc. - Xilinx Inc. - Micropac Industries Inc. - Ms Kennedy Corporation - Peregrine Semiconductor Corp - Semicoa Corporation - Teledyne Microelectronic Technologies, Inc. - 3D Plus SA. - Aitech Defense Systems Inc. For more information visit http://www.researchandmarkets.com/research/rb..._radiation
HON: 101.16 (+0.09), LLTC: 41.21 (-0.58), MSCC: 35.27 (-0.80), ISIL: 12.33 (-0.14), ATML: 8.57 (+0.04), MXWL: 6.23 (+0.14), XLNX: 44.90 (-0.24), IRF: 39.98 (-0.01), TXN: 50.87 (-0.65), CR: 51.16 (+0.77)
Micropac Industries declares special dividend of USD0.10 per share
M2 - Thu Dec 18, 5:36AM CST
The board of directors of Micropac Industries Inc (OTC BB:MPAD) a diversified, high technology company, authorised a special common stock dividend of USD0.10 per share, the company declared on Wednesday.
Micropac Industries, Inc. Approves Special Dividend
PR Newswire - Wed Dec 17, 11:27AM CST
The Board of Directors of Micropac Industries, Inc. (OTC Bulletin Board: MPAD) has approved the payment of a special common stock dividend of $0.10 per share payable to shareholders of record on January 12, 2015. It is anticipated that the payment date for such dividend will be on or about February 10, 2015.
