Dublin, June 22, 2015 (GLOBE NEWSWIRE) -- Research and Markets ( http://www.researchandmarkets.com/research/qf...wei_ascend ) has announced the addition of the "Huawei Ascend Mate 7 Fingerprint Sensor - Reverse Costing Analysis" report to their offering. Huawei's technological choice for the fingerprint sensor is going to the opposite direction than Apple's and Samsung's one. The Ascend Mate 7 presents an innovative fingerprint sensor developed by Fingerprint Cards, a main actor in capacitive sensing human interface solutions for consumer electronics companies. The technical choice of Fingerprint Cards is totally different form the other's. The fingerprint device is much more bigger and more expensive than its competitors (2.5 factor) to guarantee a better image quality. It presents a new sensing device design and structure; an innovative packaging and a different supply chain model. The fingerprint sensor of the Ascend Mate 7 is located on the back side of the telephone and it has the dimension of 16.33×15.8 mm. The sensor is assembled on LGA packaging and incorporated within a rectangular shaped housing composed of an aluminum ring and plastic ring. The report presents a detailed analysis of fingerprint structure and cost and a comparison with the Apple's iPhone5 and Samsung's Galaxy S5 fingerprint sensors. Key Topics Covered: 1. Glossary 2. Overview/Introduction 3. Executive Summary - Reverse Costing Methodology 4. Company Profile 5. Fingerprint Cards 6. Physical Analysis 7. Synthesis of the Physical Analysis - Ascend Mate 7 Fingerprint disassembly - Fingerprint Sensor Views - Fingerprint Sensor Croos-Section - Fingerprint Sensor Patents - ASIC Die View & Dimensions - ASIC Die marking - ASIC Die Capacitors - ASIC Die Edge Contact - ASIC Delayering & main Blocs - ASIC Die Process - ASIC Die Cross-Section - ASIC Die Process Characteristic 8. Sensor Manufacturing Process 9. ASIC Front-End Process - ASIC Front-End Wafer Fabrication Unit - Packaging Process - Packaging Fabrication Unit - Synthesis of the main parts 10. Cost Analysis 11. Synthesis of the cost analysis - Main steps of economic analysis - Yields Explanation - Yields Hypotheses - ASIC Wafer Cost - ASIC Die Cost 12. LGA Packaged Component 13. LGA Packaging Cost - Components Cost 14. Fingerprint Module Cost 15. Components Cost - Fingerprint Sensor Assembly Cost 16. Huawei's vs Samsung's vs Apple's fingerprint sensor For more information visit http://www.researchandmarkets.com/research/qf...wei_ascend
CONTACT: Research and Markets Laura Wood, Senior Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 Sector: Computing and Technology
