UV imprinting and aligned ink-jet printing for mul
Post# of 22456
Posted On: 04/11/2015 12:17:44 AM
UV imprinting and aligned ink-jet printing for multi-layer patterning of electro-optic polymer modulators
Xiaohui Lin, Tao Ling, Harish Subbaraman, Xingyu Zhang, Kwangsub Byun, L. Jay Guo, Ray T Chen
(Submitted on 1 Mar 2014)
The present work demonstrates an electro-optic polymer based Mach-Zehnder (MZ) modulator fabricated utilizing advanced ultraviolet (UV) imprinting and aligned ink-jet printing technologies for patterning and layer deposition. The bottom electrode layer is designed and directly ink-jet printed on the substrate to form the patterned layer. The waveguide structure is formed into a bottom cladding polymer using a transparent flexible mold based UV imprinting method. All other layers can be ink-jet printed. The top electrode is aligned and printed over the Mach-Zehnder arm. The modulator demonstrates a V-pi of 8V at 3kHz. This technology shows great potential in minimizing the fabrication complexity and roll-to-roll compatibility for manufacturing low cost, light-weight, and conformal modulators at high throughput.
http://arxiv.org/abs/1403.0139
Xiaohui Lin, Tao Ling, Harish Subbaraman, Xingyu Zhang, Kwangsub Byun, L. Jay Guo, Ray T Chen
(Submitted on 1 Mar 2014)
The present work demonstrates an electro-optic polymer based Mach-Zehnder (MZ) modulator fabricated utilizing advanced ultraviolet (UV) imprinting and aligned ink-jet printing technologies for patterning and layer deposition. The bottom electrode layer is designed and directly ink-jet printed on the substrate to form the patterned layer. The waveguide structure is formed into a bottom cladding polymer using a transparent flexible mold based UV imprinting method. All other layers can be ink-jet printed. The top electrode is aligned and printed over the Mach-Zehnder arm. The modulator demonstrates a V-pi of 8V at 3kHz. This technology shows great potential in minimizing the fabrication complexity and roll-to-roll compatibility for manufacturing low cost, light-weight, and conformal modulators at high throughput.
http://arxiv.org/abs/1403.0139
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