SCIPF News Alert Stats Chippac Ltd (SCIPF) 0.3100 02/15/2015
Post# of 64074
Posted On: 02/15/2015 12:52:27 PM
Stats Chippac Ltd (SCIPF) 0.3100 $SCIPF
STATS ChipPAC Reports Fourth Quarter and Full Year 2014 Results
Marketwired - Thu Jan 29, 3:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the fourth quarter and full year 2014.
STATS ChipPAC Schedules Fourth Quarter and Full Year 2014 Results Conference Call
Marketwired - Mon Jan 19, 3:31AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Friday, 30 January 2015 at 8:00 a.m. in Singapore to discuss the Company's results for the fourth quarter and full year 2014.
STATS ChipPAC Announces Plan to Relocate China Manufacturing Operation
Marketwired - Wed Dec 31, 11:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced its plan to relocate the Company's wholly-owned subsidiary, STATS ChipPAC Shanghai, Co., Ltd. ("SCC" to a new manufacturing site in China.
SMIC Announces Co-investment Agreement and Investment Exit Agreement in Relation to Proposed Acquisition
PR Newswire - Mon Dec 22, 6:53AM CST
Semiconductor Manufacturing International Corporation ("SMIC"; "The Company"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry announces that on 22 December 2014 (after trading hours), SilTech Shanghai, an indirectly wholly-owned subsidiary of the Company, JCET and the IC Fund entered into the Co-investment Agreement to form an investment consortium in connection with the Proposed Acquisition of STATS ChipPAC. The consideration payable by SilTech Shanghai is the RMB equivalent of US$100 million (subject to exchange rate adjustments and the terms of the Co-investment Agreement).
SMI: 4.68 (+0.17)
STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year
Marketwired - Tue Dec 16, 3:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world's top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology.
Global TSV 3D IC Industry Future Market Trends Report
PR Newswire - Mon Dec 15, 4:00AM CST
ReportsnReports.com adds Future Trends of the Worldwide TSV 3D IC Industry research report published in Dec 2014 and providing global industry value forecast up to 2017 and major players' development plan in 2015 and 2016.
XLNX: 41.51 (+0.51), ALTR: 35.66 (+0.45)
Global and Chinese IC Advanced Packaging Industry Report 2014
M2 - Mon Dec 01, 4:31AM CST
Research and Markets (http://www.researchandmarkets.com/research/jtxmsg/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Industry Report, 2013-2014" report to their offering. It is projected that in 2014 the output value of OSAT industry will grow by 8.4% to USD27.2 billion, and advanced packaging industry probably by 10% to USD18.2 billion At present, both mobile phones and computers are developing towards ultra-thin, multi-core and high frequency while memory industry is targeted at ultra bandwidth, which would prompt the packaging and testing market to satisfy the market demand with the updated technologies. Since 2014, a number of new technologies have been applied, which would bring with it a more than 6% growth in packaging and testing industry. These technologies, including MLP PoP, Cu Bol, FC-CSP, FOWLP, Embedded Component (Trace) Substrate, and 2.5D, are mainly used in smartphones and ultra-thin computers, with a robust market demand. Meanwhile, TSV is expected to be widely applied from the memory industry. On the other hand, some major IDM vendors like Panasonic and Renesas Electronics have retreated from packaging business. In terms of industry, a type of middle-end enterprises has emerged between Foundry or IDM and OSAT since 2008. In the era of FC packaging, these enterprises mainly provide RDL, Wafer Bumping, and Wafer Level Test. But in the age of 2.5D and 3D, their scope of business has been greatly expanded, primarily including Micro Bumping, Thin & Reveal, Interposer, Via Middle, WL-Carrier Assembly, etc. KEY TOPICS COVERED - Overview of semiconductor industry - Status quo of memory and wafer foundry industry - Upstream market of semiconductor industry - Trend in emerging advanced packaging technologies - Analysis and ranking of packaging enterprises - 23 major advanced packaging vendors Companies Mentioned - ASE - Amkor - ChipMOS - Chipbond - FATC - Greatek - Hana Micron - J-DEVICES - JECT - KYEC - Lingsen Precision - MPI - Nantong Fujitsu Microelectronics - Nepes - PTI - SPIL - STATS ChipPAC - STS Semiconductor - Signetics - Tian Shui Hua Tian Technology - UTAC - Unisem - Walton Advanced Engineering For more information visit http://www.researchandmarkets.com/research/jtxmsg/global_and
STATS ChipPAC Reports Third Quarter 2014 Results
Marketwired - Tue Oct 28, 4:30AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the third quarter 2014.
Global 3D IC Market Outlook 2018 Featuring Advanced Semiconductor Engineering, Samsung Electronics, STMicroelectronics & Taiwan Semiconductor Manufacturing
M2 - Wed Oct 22, 9:47AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hhb7mb/global_3d_ic) has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. The Global 3D IC market to grow at a CAGR of 18.4% over the period 2013-2018 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems. One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs. According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size. Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products. Key Vendors - Advanced Semiconductor Engineering - Samsung Electronics - STMicroelectronics - Taiwan Semiconductor Manufacturing Other Prominent Vendors - 3M Company - IBM - Micron Technology - STATS ChipPAC - United Microelectronics - Xilinx Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Product - Market Segmentation by End-users - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis - Market Summary For more information visit http://www.researchandmarkets.com/research/hh...obal_3d_ic
MU: 31.85 (-0.09), MMM: 165.94 (+0.03), ASX: 7.36 (+0.15), UMC: 2.48 (unch), IBM: 160.40 (+1.88), XLNX: 41.51 (+0.51)
STATS ChipPAC Schedules Third Quarter 2014 Results Conference Call
Marketwired - Thu Oct 16, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Wednesday, 29 October 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the third quarter 2014 and business outlook for the fourth quarter 2014.
STATS ChipPAC Announces Resignation of Chief Operating Officer
Marketwire - Sun Sep 21, 5:11PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that Mr. Wan Choong Hoe has resigned from his position as Executive Vice President and Chief Operating Officer effective 30 September 2014 to pursue personal interests.
STATS ChipPAC Provides Update for Third Quarter 2014
Marketwire - Wed Sep 17, 4:30AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today provided an update for the third quarter 2014.
Advantest Earns STATS ChipPAC's Outstanding Award in Service and Support for Seventh Year in a Row
Marketwire - Wed Sep 03, 2:05AM CDT
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) (NYSE: ATE) has again won the annual Outstanding Award in Service and Support from STATS ChipPAC Ltd. (SGX-ST: STATSChP), a global leader in advanced semiconductor packaging and test services. This latest recognition extends Advantest's streak of receiving an award each year since 2007, when STATS ChipPAC began honoring its suppliers for their performance and service.
ATE: 12.91 (+0.15)
Global and Chinese IC Advanced Packaging Industry Report, 2013-2014
M2 - Mon Aug 25, 4:13AM CDT
Research and Markets (http://www.researchandmarkets.com/research/wpnzn5/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Industry Report, 2013-2014" report to their offering. Typically, an independent packaging and testing vendor is known as OSAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, in sharp contrast to the market size of USD23.6 billion in 2011, a figure that occupied 30% of the semiconductor industry. During 2011-2013, the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years, which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized, thus leading to a dramatic decline in unit prices, these packaging technologies including FC-BGA, WLCSP, QFN, SiP, and PoP, etc. In 2014, the biggest event that happened to the packaging industry was nothing but the attempt of Temasek to sell STATS ChipPAC, the world's fifth largest packaging company. Owned by the Government of Singapore, STATS ChipPAC is less competitive, especially when facing the competition from the Taiwanese rivals. Although it has state-of-the-art technologies, yet the company depends heavily on its key accounts, including Infineon, Apple Inc., Qualcomm, and Broadcom, etc. However, Infineon has gradually withdrawn from mobile phone market while Apple Inc. and Qualcomm have diversified supply chain risks, cutting down on the orders of STATS ChipPAC, which led to a fall in revenue for four consecutive years. In addition, a second major event was the fact that SPIL had won massive orders from Qualcomm, MTK as well as Huawei's Hisilicon, which would considerably increase SPIL's revenue. In H1 2014, SPIL harvested a substantial growth of 27% in revenue, making it the world's No.1 by operating margin. In 2014, the company is expected to surpass Amkor as the global second. In terms of technology, 3D (TSV) application is not yet so mature that the market is still confined to such non-mainstream fields as CIS, MEMS, and HB LED. The key Logic Memory market have not made progress and will not get improvements in the coming 5 years, with PoP packaging still the mainstream. This comes mainly from the following reasons: Key Topics Covered: 1. Global Semiconductor Industry - Supply Chain - Semiconductor Packaging Introduction 2. Upstream & Downstream of IC Packaging Industry - Semiconductor Industry by Location - Semiconductor Industry Capital Spending Trend - DRAM Industry - NAND Flash - Wafer Foundry Industry - Wafer Foundry Competition - Wafer Foundry Industry Ranking - Mobile Phone Market - PC Market - Tablet PC Market - FPGA and CPLD Market 3. Packaging & Testing Technology Trend - Wide IO/HMC Memory - Embedded Component Substrate - Embedded Trace Substrate - IC Packaging for Handset - SIP Packaging - 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER) - TSV (3D) Packaging 4. Packaging & Testing Industry - Market Size - Middle-end Packaging &Testing Industry - OSAT Industry by Region - Semiconductor Testing - Global Vendor Ranking 5. Packaging & Testing Vendors - ASE - Amkor - SPIL - STATS ChipPAC - PTI - Greatek - ChipMOS - KYEC - Unisem - FATC - JECT - UTAC - Lingsen Precision - Nantong Fujitsu Microelectronics - Walton Advanced Engineering - Chipbond - J-DEVICES - MPI - STS Semiconductor - Signetics - Hana Micron - Nepes - Tian Shui Hua Tian Technology For more information visit http://www.researchandmarkets.com/research/wpnzn5/global_and
QCOM: 70.88 (+0.49), AAPL: 127.08 (+0.62)
STATS ChipPAC's fcCuBE Technology Surpasses 100 Million Unit Milestone
Marketwire - Tue Aug 19, 3:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the Company's fcCuBE(R) technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.
Kulicke & Soffa Receives Supplier Award from STATS ChipPAC "Outstanding Award in Service and Support"
Business Wire - Fri Aug 08, 8:05AM CDT
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company" today announced that STATS ChipPAC (SGX-ST Code: S24) honored the company with a Supplier Award on July 22, 2014.
KLIC: 16.00 (-0.30)
STATS ChipPAC Reports Second Quarter 2014 Results
Marketwire - Fri Aug 08, 5:24AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the second quarter 2014.
STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
Marketwire - Tue Aug 05, 3:01PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its seventh annual Supplier Awards, honouring the excellent performance and outstanding contributions of the Company's top suppliers in 2013.
STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits
Marketwire - Mon Jul 28, 3:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSP(TM)) solution. The combined benefits of superior quality, lower cost structure and the ease of conversion through a drop-in replacement have led to a strong demand for eWLCSP(TM) and an accelerated adoption across its customer base.
STATS ChipPAC Schedules Second Quarter 2014 Results Conference Call
Marketwire - Thu Jul 17, 6:50PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Tuesday, 12 August 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the second quarter 2014 and business outlook for the third quarter 2014.
STATS ChipPAC Reports Fourth Quarter and Full Year 2014 Results
Marketwired - Thu Jan 29, 3:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the fourth quarter and full year 2014. STATS ChipPAC Schedules Fourth Quarter and Full Year 2014 Results Conference Call
Marketwired - Mon Jan 19, 3:31AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Friday, 30 January 2015 at 8:00 a.m. in Singapore to discuss the Company's results for the fourth quarter and full year 2014. STATS ChipPAC Announces Plan to Relocate China Manufacturing Operation
Marketwired - Wed Dec 31, 11:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced its plan to relocate the Company's wholly-owned subsidiary, STATS ChipPAC Shanghai, Co., Ltd. ("SCC" to a new manufacturing site in China. SMIC Announces Co-investment Agreement and Investment Exit Agreement in Relation to Proposed Acquisition
PR Newswire - Mon Dec 22, 6:53AM CST
Semiconductor Manufacturing International Corporation ("SMIC"; "The Company"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry announces that on 22 December 2014 (after trading hours), SilTech Shanghai, an indirectly wholly-owned subsidiary of the Company, JCET and the IC Fund entered into the Co-investment Agreement to form an investment consortium in connection with the Proposed Acquisition of STATS ChipPAC. The consideration payable by SilTech Shanghai is the RMB equivalent of US$100 million (subject to exchange rate adjustments and the terms of the Co-investment Agreement).
SMI: 4.68 (+0.17)
STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year
Marketwired - Tue Dec 16, 3:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world's top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology. Global TSV 3D IC Industry Future Market Trends Report
PR Newswire - Mon Dec 15, 4:00AM CST
ReportsnReports.com adds Future Trends of the Worldwide TSV 3D IC Industry research report published in Dec 2014 and providing global industry value forecast up to 2017 and major players' development plan in 2015 and 2016.
XLNX: 41.51 (+0.51), ALTR: 35.66 (+0.45)
Global and Chinese IC Advanced Packaging Industry Report 2014
M2 - Mon Dec 01, 4:31AM CST
Research and Markets (http://www.researchandmarkets.com/research/jtxmsg/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Industry Report, 2013-2014" report to their offering. It is projected that in 2014 the output value of OSAT industry will grow by 8.4% to USD27.2 billion, and advanced packaging industry probably by 10% to USD18.2 billion At present, both mobile phones and computers are developing towards ultra-thin, multi-core and high frequency while memory industry is targeted at ultra bandwidth, which would prompt the packaging and testing market to satisfy the market demand with the updated technologies. Since 2014, a number of new technologies have been applied, which would bring with it a more than 6% growth in packaging and testing industry. These technologies, including MLP PoP, Cu Bol, FC-CSP, FOWLP, Embedded Component (Trace) Substrate, and 2.5D, are mainly used in smartphones and ultra-thin computers, with a robust market demand. Meanwhile, TSV is expected to be widely applied from the memory industry. On the other hand, some major IDM vendors like Panasonic and Renesas Electronics have retreated from packaging business. In terms of industry, a type of middle-end enterprises has emerged between Foundry or IDM and OSAT since 2008. In the era of FC packaging, these enterprises mainly provide RDL, Wafer Bumping, and Wafer Level Test. But in the age of 2.5D and 3D, their scope of business has been greatly expanded, primarily including Micro Bumping, Thin & Reveal, Interposer, Via Middle, WL-Carrier Assembly, etc. KEY TOPICS COVERED - Overview of semiconductor industry - Status quo of memory and wafer foundry industry - Upstream market of semiconductor industry - Trend in emerging advanced packaging technologies - Analysis and ranking of packaging enterprises - 23 major advanced packaging vendors Companies Mentioned - ASE - Amkor - ChipMOS - Chipbond - FATC - Greatek - Hana Micron - J-DEVICES - JECT - KYEC - Lingsen Precision - MPI - Nantong Fujitsu Microelectronics - Nepes - PTI - SPIL - STATS ChipPAC - STS Semiconductor - Signetics - Tian Shui Hua Tian Technology - UTAC - Unisem - Walton Advanced Engineering For more information visit http://www.researchandmarkets.com/research/jtxmsg/global_and
STATS ChipPAC Reports Third Quarter 2014 Results
Marketwired - Tue Oct 28, 4:30AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the third quarter 2014. Global 3D IC Market Outlook 2018 Featuring Advanced Semiconductor Engineering, Samsung Electronics, STMicroelectronics & Taiwan Semiconductor Manufacturing
M2 - Wed Oct 22, 9:47AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hhb7mb/global_3d_ic) has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. The Global 3D IC market to grow at a CAGR of 18.4% over the period 2013-2018 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems. One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs. According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size. Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products. Key Vendors - Advanced Semiconductor Engineering - Samsung Electronics - STMicroelectronics - Taiwan Semiconductor Manufacturing Other Prominent Vendors - 3M Company - IBM - Micron Technology - STATS ChipPAC - United Microelectronics - Xilinx Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Product - Market Segmentation by End-users - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis - Market Summary For more information visit http://www.researchandmarkets.com/research/hh...obal_3d_ic
MU: 31.85 (-0.09), MMM: 165.94 (+0.03), ASX: 7.36 (+0.15), UMC: 2.48 (unch), IBM: 160.40 (+1.88), XLNX: 41.51 (+0.51)
STATS ChipPAC Schedules Third Quarter 2014 Results Conference Call
Marketwired - Thu Oct 16, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Wednesday, 29 October 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the third quarter 2014 and business outlook for the fourth quarter 2014. STATS ChipPAC Announces Resignation of Chief Operating Officer
Marketwire - Sun Sep 21, 5:11PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that Mr. Wan Choong Hoe has resigned from his position as Executive Vice President and Chief Operating Officer effective 30 September 2014 to pursue personal interests. STATS ChipPAC Provides Update for Third Quarter 2014
Marketwire - Wed Sep 17, 4:30AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading semiconductor test and advanced packaging service provider, today provided an update for the third quarter 2014. Advantest Earns STATS ChipPAC's Outstanding Award in Service and Support for Seventh Year in a Row
Marketwire - Wed Sep 03, 2:05AM CDT
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) (NYSE: ATE) has again won the annual Outstanding Award in Service and Support from STATS ChipPAC Ltd. (SGX-ST: STATSChP), a global leader in advanced semiconductor packaging and test services. This latest recognition extends Advantest's streak of receiving an award each year since 2007, when STATS ChipPAC began honoring its suppliers for their performance and service.
ATE: 12.91 (+0.15)
Global and Chinese IC Advanced Packaging Industry Report, 2013-2014
M2 - Mon Aug 25, 4:13AM CDT
Research and Markets (http://www.researchandmarkets.com/research/wpnzn5/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Industry Report, 2013-2014" report to their offering. Typically, an independent packaging and testing vendor is known as OSAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, in sharp contrast to the market size of USD23.6 billion in 2011, a figure that occupied 30% of the semiconductor industry. During 2011-2013, the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years, which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized, thus leading to a dramatic decline in unit prices, these packaging technologies including FC-BGA, WLCSP, QFN, SiP, and PoP, etc. In 2014, the biggest event that happened to the packaging industry was nothing but the attempt of Temasek to sell STATS ChipPAC, the world's fifth largest packaging company. Owned by the Government of Singapore, STATS ChipPAC is less competitive, especially when facing the competition from the Taiwanese rivals. Although it has state-of-the-art technologies, yet the company depends heavily on its key accounts, including Infineon, Apple Inc., Qualcomm, and Broadcom, etc. However, Infineon has gradually withdrawn from mobile phone market while Apple Inc. and Qualcomm have diversified supply chain risks, cutting down on the orders of STATS ChipPAC, which led to a fall in revenue for four consecutive years. In addition, a second major event was the fact that SPIL had won massive orders from Qualcomm, MTK as well as Huawei's Hisilicon, which would considerably increase SPIL's revenue. In H1 2014, SPIL harvested a substantial growth of 27% in revenue, making it the world's No.1 by operating margin. In 2014, the company is expected to surpass Amkor as the global second. In terms of technology, 3D (TSV) application is not yet so mature that the market is still confined to such non-mainstream fields as CIS, MEMS, and HB LED. The key Logic Memory market have not made progress and will not get improvements in the coming 5 years, with PoP packaging still the mainstream. This comes mainly from the following reasons: Key Topics Covered: 1. Global Semiconductor Industry - Supply Chain - Semiconductor Packaging Introduction 2. Upstream & Downstream of IC Packaging Industry - Semiconductor Industry by Location - Semiconductor Industry Capital Spending Trend - DRAM Industry - NAND Flash - Wafer Foundry Industry - Wafer Foundry Competition - Wafer Foundry Industry Ranking - Mobile Phone Market - PC Market - Tablet PC Market - FPGA and CPLD Market 3. Packaging & Testing Technology Trend - Wide IO/HMC Memory - Embedded Component Substrate - Embedded Trace Substrate - IC Packaging for Handset - SIP Packaging - 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER) - TSV (3D) Packaging 4. Packaging & Testing Industry - Market Size - Middle-end Packaging &Testing Industry - OSAT Industry by Region - Semiconductor Testing - Global Vendor Ranking 5. Packaging & Testing Vendors - ASE - Amkor - SPIL - STATS ChipPAC - PTI - Greatek - ChipMOS - KYEC - Unisem - FATC - JECT - UTAC - Lingsen Precision - Nantong Fujitsu Microelectronics - Walton Advanced Engineering - Chipbond - J-DEVICES - MPI - STS Semiconductor - Signetics - Hana Micron - Nepes - Tian Shui Hua Tian Technology For more information visit http://www.researchandmarkets.com/research/wpnzn5/global_and
QCOM: 70.88 (+0.49), AAPL: 127.08 (+0.62)
STATS ChipPAC's fcCuBE Technology Surpasses 100 Million Unit Milestone
Marketwire - Tue Aug 19, 3:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the Company's fcCuBE(R) technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes. Kulicke & Soffa Receives Supplier Award from STATS ChipPAC "Outstanding Award in Service and Support"
Business Wire - Fri Aug 08, 8:05AM CDT
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company"
today announced that STATS ChipPAC (SGX-ST Code: S24) honored the company with a Supplier Award on July 22, 2014. KLIC: 16.00 (-0.30)
STATS ChipPAC Reports Second Quarter 2014 Results
Marketwire - Fri Aug 08, 5:24AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the second quarter 2014. STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
Marketwire - Tue Aug 05, 3:01PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its seventh annual Supplier Awards, honouring the excellent performance and outstanding contributions of the Company's top suppliers in 2013. STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits
Marketwire - Mon Jul 28, 3:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSP(TM)) solution. The combined benefits of superior quality, lower cost structure and the ease of conversion through a drop-in replacement have led to a strong demand for eWLCSP(TM) and an accelerated adoption across its customer base. STATS ChipPAC Schedules Second Quarter 2014 Results Conference Call
Marketwire - Thu Jul 17, 6:50PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Tuesday, 12 August 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the second quarter 2014 and business outlook for the third quarter 2014. 
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