Shinko Electric Ind (SHEGF) 9.2000 $SHEGF
The Multi-Component IC Packaging Market 2014 Edition
M2 - Tue Feb 25, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/6v7pwk/the) has announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering. Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC package which has enabled the multitude of small, handheld electronics to be invented and proliferate in today's world. It is not just small size, but the added performance with high speed, more functionality, and the ability for handheld electronics to communicate via the Internet so that anyone with a smart phone or tablet has a wealth of information at their fingertips. The costs per transistor is now going up with advancing technology nodes of 22nm and 14nm, when traditionally the cost goes down. Increasingly the backend, or IC packaging, is being looked at a meeting the needs of tomorrow's technology demands rather than the front end manufacturing. Key Topics Covered: Chapter 1: Introduction 1.1 Background 1.2 Scope 1.3 Organization 1.4 Methodology Chapter 2: Executive Summary 2.1 Overview 2.2 Stacked Packages 2.3 Through-Vias Technology, 2-5D, and 3-D Interconnection Solutions 2.4 System in Package Chapter 3: Stacked Packages 3.1 Overview 3.2 Types of Stacked Packages 3.3 The Ins and Outs of Stacked Packages 3.4 Interconnection 3.5 Stacked Package as a Multi-Component Package 3.6 Wafer Thinning 3.7 End Markets and Application Trends 3.8 New Product Introductions 3.9 Unit and Revenue Forecasts Chapter 4: Through Vias, 3-D and 2.5-D Integration 4.1 Through Vias and 3-D Overview 4.2 2.5-D 4.3 2.5-D Interposers and Microbumps 4.4 Wide I/O 4.5 Creating the Vias 4.6 Who Takes Ownership of each Process Steps? 4.7 What does it Cost to Create 2.5-D and 3-D Devices 4.8 Issues / Solutions / Call to Action 4.9 3-D Die-Stacking Technology Requirements 4.10 Bonding Methods 4.11 Via First, Middle, or Last Technology 4.12 Via Etching and Filling 4.13 New Product/Process Highlights 4.14 Industry Consortiums 4.15 Market Potential 4.16 Future Markets 4.17 TSV Forecasts (2.5-D, 3-D, Interposer) Chapter 5: System in Package 5.1 Overview 5.2 Hybrid Memory Cube 5.3 New Product Introductions/Highlights 5.5 SiP Forecasts Companies Mentioned - 3D Glass Solutions - APSTL, llc - Auburn University - CEA-Leti - Cisco, Inc. and Amkor Technology - Corning, Inc. Dow Chemical - EV Group - Fraunhofer Institute for Reliability and Microintegration - Fujikura Ltd. and FlipChip International, LLC - Innovative Micro Technology - Kyocera America - Nanyang Technology University - Sandia National Laboratories - SET North America and RTI International CMET - Shinko Electric Industries - STATS ChipPAC Ltd. - SUNY College, College of Nanoscale Science and Engineering - SUSS MicroTec - Texas Instruments - Tohoku University - Triton Micro Technologies, Inc. and nMode Solutions - Unimicron Technology Corporation and ITRI For more information visit http://www.researchandmarkets.com/research/6v7pwk/the
Global Printed Circuit Board (PCB) Market 2012-2016 with Unimicron Technology Corp., and Zhen Ding Technology Holding Ltd Dominating
M2 - Thu Aug 22, 6:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/67pk83/global_pcb_market) has announced the addition of the "Global PCB Market 2012-2016" report to their offering. The analysts forecast the Global Printed Circuit Board (PCB) market to grow at a CAGR of 7.8 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing adoption of smartphones and tablet PCs. The Global PCB market has also been witnessing the increasing demand for miniaturized PCBs. However, increasing raw materials prices could pose a challenge to the growth of this market. The key vendors dominating this space include Ibiden Co. Ltd., Tripod Technology Corp., Unimicron Technology Corp., and Zhen Ding Technology Holding Ltd. The other vendors mentioned in this report are AT&S Austria Technologies & Systemtechnik Aktiengesellschaft, chin-poon Industrial Co. Ltd., CMK Corp., Compeq Co. Ltd., DAEDUCK Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Elec & Eltek International Holdings Ltd., Founder PCB, Gold Circuit Electronics, Guangdong Ellington Electronics Tech Co. Ltd., Guangdong Goworld Co. Ltd., GUI Technologies, HannStar Board International Holdings Ltd., KINSUS Interconnect Technology Corp., LG Innotek, Meiko Electronics Co. Ltd., Multek Corp., Nan Ya PCB Co. Ltd., SEMCO Machine Corp., Shinko Electric Industries Co. Ltd., Simmtech Co. Ltd., Taiwan PCB Techvest Co. Ltd., TTM Technologies Inc., Unitech Printed Circuit Board Corp., Viasystems Group Inc., and WUS. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? You can request one free hour of our analyst's time when you purchase this market report. Details provided within the report. For more information visit http://www.researchandmarkets.com/research/67...pcb_market About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
The Multi-Component IC Packaging Market 2014 Edition
M2 - Tue Feb 25, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/6v7pwk/the) has announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering. Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC package which has enabled the multitude of small, handheld electronics to be invented and proliferate in today's world. It is not just small size, but the added performance with high speed, more functionality, and the ability for handheld electronics to communicate via the Internet so that anyone with a smart phone or tablet has a wealth of information at their fingertips. The costs per transistor is now going up with advancing technology nodes of 22nm and 14nm, when traditionally the cost goes down. Increasingly the backend, or IC packaging, is being looked at a meeting the needs of tomorrow's technology demands rather than the front end manufacturing. Key Topics Covered: Chapter 1: Introduction 1.1 Background 1.2 Scope 1.3 Organization 1.4 Methodology Chapter 2: Executive Summary 2.1 Overview 2.2 Stacked Packages 2.3 Through-Vias Technology, 2-5D, and 3-D Interconnection Solutions 2.4 System in Package Chapter 3: Stacked Packages 3.1 Overview 3.2 Types of Stacked Packages 3.3 The Ins and Outs of Stacked Packages 3.4 Interconnection 3.5 Stacked Package as a Multi-Component Package 3.6 Wafer Thinning 3.7 End Markets and Application Trends 3.8 New Product Introductions 3.9 Unit and Revenue Forecasts Chapter 4: Through Vias, 3-D and 2.5-D Integration 4.1 Through Vias and 3-D Overview 4.2 2.5-D 4.3 2.5-D Interposers and Microbumps 4.4 Wide I/O 4.5 Creating the Vias 4.6 Who Takes Ownership of each Process Steps? 4.7 What does it Cost to Create 2.5-D and 3-D Devices 4.8 Issues / Solutions / Call to Action 4.9 3-D Die-Stacking Technology Requirements 4.10 Bonding Methods 4.11 Via First, Middle, or Last Technology 4.12 Via Etching and Filling 4.13 New Product/Process Highlights 4.14 Industry Consortiums 4.15 Market Potential 4.16 Future Markets 4.17 TSV Forecasts (2.5-D, 3-D, Interposer) Chapter 5: System in Package 5.1 Overview 5.2 Hybrid Memory Cube 5.3 New Product Introductions/Highlights 5.5 SiP Forecasts Companies Mentioned - 3D Glass Solutions - APSTL, llc - Auburn University - CEA-Leti - Cisco, Inc. and Amkor Technology - Corning, Inc. Dow Chemical - EV Group - Fraunhofer Institute for Reliability and Microintegration - Fujikura Ltd. and FlipChip International, LLC - Innovative Micro Technology - Kyocera America - Nanyang Technology University - Sandia National Laboratories - SET North America and RTI International CMET - Shinko Electric Industries - STATS ChipPAC Ltd. - SUNY College, College of Nanoscale Science and Engineering - SUSS MicroTec - Texas Instruments - Tohoku University - Triton Micro Technologies, Inc. and nMode Solutions - Unimicron Technology Corporation and ITRI For more information visit http://www.researchandmarkets.com/research/6v7pwk/the
Global Printed Circuit Board (PCB) Market 2012-2016 with Unimicron Technology Corp., and Zhen Ding Technology Holding Ltd Dominating
M2 - Thu Aug 22, 6:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/67pk83/global_pcb_market) has announced the addition of the "Global PCB Market 2012-2016" report to their offering. The analysts forecast the Global Printed Circuit Board (PCB) market to grow at a CAGR of 7.8 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing adoption of smartphones and tablet PCs. The Global PCB market has also been witnessing the increasing demand for miniaturized PCBs. However, increasing raw materials prices could pose a challenge to the growth of this market. The key vendors dominating this space include Ibiden Co. Ltd., Tripod Technology Corp., Unimicron Technology Corp., and Zhen Ding Technology Holding Ltd. The other vendors mentioned in this report are AT&S Austria Technologies & Systemtechnik Aktiengesellschaft, chin-poon Industrial Co. Ltd., CMK Corp., Compeq Co. Ltd., DAEDUCK Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Elec & Eltek International Holdings Ltd., Founder PCB, Gold Circuit Electronics, Guangdong Ellington Electronics Tech Co. Ltd., Guangdong Goworld Co. Ltd., GUI Technologies, HannStar Board International Holdings Ltd., KINSUS Interconnect Technology Corp., LG Innotek, Meiko Electronics Co. Ltd., Multek Corp., Nan Ya PCB Co. Ltd., SEMCO Machine Corp., Shinko Electric Industries Co. Ltd., Simmtech Co. Ltd., Taiwan PCB Techvest Co. Ltd., TTM Technologies Inc., Unitech Printed Circuit Board Corp., Viasystems Group Inc., and WUS. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? You can request one free hour of our analyst's time when you purchase this market report. Details provided within the report. For more information visit http://www.researchandmarkets.com/research/67...pcb_market About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
