Qualcomm Inc (QCOM) 73.88 $QCOM
Is the Next Healthcare Revolution Already Brewing?
Keith Speights, The Motley Fool - Motley Fool - Sat Aug 09, 8:03AM CDT
A big health care change appears to be under way, but few are paying much attention to it. At least not yet. On July 28, U.S. Senators Thad Cochran (R-Miss.) and Roger Wicker (R-Miss.) introduced a bill that could help open the door to a new model...
Watch for QUALCOMM to Potentially Pullback After Gaining 1.92% Yesterday
Comtex SmarTrend(R) - Fri Aug 08, 3:41PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $72.50 to a high of $73.96. Yesterday, the shares gained 1.9%, which took the trading range above the 3-day high of $73.35 on volume of 9.0 million shares. Often times after large one-day gains, short term traders will seek to take profits and, as such, investors should be cautious.
QUALCOMM Set to Possibly Pullback After Yesterday's Rally of 1.92%
Comtex SmarTrend(R) - Fri Aug 08, 3:41PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $72.50 to a high of $73.96. Yesterday, the shares gained 1.9%, which took the trading range above the 3-day high of $73.35 on volume of 9.0 million shares. Often times after large one-day gains, short term traders will seek to take profits and, as such, investors should be cautious.
NVIDIA Beats on Q2 Earnings, Misses Revenue Estimates - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 08, 12:40PM CDT
NVIDIA Corp. (NVDA) reported second quarter of fiscal 2015 adjusted earnings of 25 cents per share, which came ahead of the Zacks Consensus Estimate of 19 cents.
Earnings Releases, Acquisitions, Dividend Announcements, and New Products - Research Reports on Qualcomm, AT&T, Yahoo, EMC and Groupon
PR Newswire - Fri Aug 08, 7:40AM CDT
Today, Analysts Review released its research reports regarding Qualcomm Incorporated (NASDAQ: QCOM), AT&T, Inc. (NYSE: T), Yahoo! Inc (NASDAQ: YHOO), EMC Corporation (NYSE: EMC) and Groupon, Inc. (NASDAQ: GRPN). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/5573-100free.
5 NFL Cities Being Squeezed for Stadium Funding
at The Street - Fri Aug 08, 7:30AM CDT
The NFL, its team owners and commissioner are pressuring taxpayers to shell out for upgraded facilities. Not every city is buying.
Broadcom's WICED to Connect AS&E's Wireless X-Ray Scanner - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Thu Aug 07, 5:30PM CDT
Broadcom (BRCM)'s Wireless Internet Connectivity for Embedded Devices Wi-Fi technology has been selected by American Science and Engineering (ASEI) as the connectivity component for its revolutionary Z Backscatter imaging system.
Sensors Will Be Measuring Everything, Even NFL Players
Tim Beyers, The Motley Fool - Motley Fool - Thu Aug 07, 3:09PM CDT
If you fear an Orwellian future in which Big Brother takes the form of technology that watches your every movement, click away from this story. You don't want to read it. For those of you still here, let's get to the uncomfortable truth: Sensors...
Why Intel Is Providing a Buying Opportunity Right Now
at The Street - Thu Aug 07, 5:30AM CDT
Intel has had a great run this year and is worth buying on any dip,
China probes automakers, technology firms
By JOE McDONALD - AP - Wed Aug 06, 10:15PM CDT
BEIJING (AP) — Chinese regulators have launched a series of anti-monopoly investigations of global automakers and technology providers, stepping up pressure on foreign companies that feel increasingly unwelcome in China.
2 Comments
Iconic Watch Brand Timex Introduces Innovative Smartwatch
PR Newswire Europe - Wed Aug 06, 7:31AM CDT
- TIMEX(R) IRONMAN(R) ONE GPS+ Offers Stand-Alone Connectivity without a Phone; Developed in Close Collaboration with Qualcomm and AT&T
Global Chips and Salsa XVIII Report 2014 - The Cat 4 is Out of the Bag
M2 - Wed Aug 06, 3:51AM CDT
Research and Markets (http://www.researchandmarkets.com/research/4nr4xk/signals_ahead) has announced the addition of the "Signals Ahead: Chips and Salsa XVIII - The Cat 4 is out of the bag" report to their offering. This report is our eighteenth Chips and Salsa report since 2004 with each of these reports covering various aspects of the wireless IC market. We've done company profiles and emerging trends on various market segments, written about the RF front-end and the many challenges and opportunities associated with LTE and band fragmentation. We've also done more than our fair share of performance benchmarking, including UMTS (call reliability), HSDPA, HSPA , Mobile WiMA X, A-GNSS, and LTE, including over-the-air (OTA) testing of leading smartphones. This report marks the tenth time that we have collaborated with Spirent Communications in the benchmark studies. As it has done in the past, Spirent provided us with its CS8 test system and engineering support in order to obtain highly objective results. In the most recent round of chipset testing, we tested solutions from six different chipset suppliers. All of these chipsets had Category 4 (Cat 4) capabilities, meaning that they could support a theoretical peak data rate of -150 Mbps in a 20 MHz LTE FDD channel - the Cat 4 is out of the bag. Five of these solutions came directly from the chipset suppliers while we purchased the HiSilicon-based platform on the open market. This study does not include several chipset suppliers, but to the best of our knowledge very few of them are currently shipping a Cat 4 chipset into a commercially-available mobile device. We look forward to including these chipsets in future testing, including our LTE TDD and LTE Advanced Carrier Aggregation benchmark tests that we are planning to kick off in the very near future. We subjected the chipsets to 29 different test scenarios that combined a mix of fading profiles (EPA5, EVA5, ETU70 and ETU300, plus Static channel conditions) and transmission modes (Open Loop MIMO and Closed Loop MIMO). We also incorporated different MIMO correlation factors (low, medium, and high), and six different SINR values for each of the four fading profiles. Based on our highly-objective evaluation criteria, Samsung's pre-commercial chipset was the top- performing chipset, based on its average throughput in each of the tests and based on its individual finishing place in each of the tests. We explain our ranking criteria in more detail later in this report. Samsung (19) also had the most first place finishes, followed by MediaTek (4), Qualcomm (3), Intel (2), and Ericsson (1). We also ranked the chipsets for each grouping of ITU channel models. Based only on the ranking of average throughputs, the winning chipsets in each grouping of tests were as follows: Static (MediaTek - pre-commercial), High SINR with varying MIMO correlation factors (Intel - commercial hardware), EPA5 (Samsung - pre-commercial), EVA5 (Samsung - pre-commercial), ETU70 (Samsung - pre-commercial) and ETU300 (Samsung - pre-commercial). All this and more in this issue of Signals Ahead. Key Topics Covered: 1.0 Executive Summary 2.0 Introduction 3.0 The Results - Sliced and diced several different ways 4.0 Results and Analysis by Test Grouping 5.0 Deep Dive Analysis 6.0 Test Methodology 7.0 Final Thoughts Companies Mentioned - Ericsson - HiSilicon Intel - MediaTek - Qualcomm - Samsung For more information visit http://www.researchandmarkets.com/research/4n...nals_ahead
Microsoft hires Qualcomm exec to make more deals
AP - Tue Aug 05, 6:37PM CDT
REDMOND, Wash. (AP) — Microsoft CEO Satya Nadella has lured away an executive from smartphone chip maker Qualcomm to hammer out more deals that will expand the software maker's presence in the mobile device market.
ClearBridge Value: Making It A Top Mutual Fund Again
at Investor's Business Daily - Tue Aug 05, 5:30PM CDT
How do you follow a legend? That's been one of the challenges for Sam Peters, who has been lead manager of $2.7 billion ClearBridge Value since taking the baton from Bill Miller about two years ago. Miller -- who still runs $2.1 billion Legg Mason...
Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services
M2 - Tue Aug 05, 9:19AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t7zmxb/next_generation) has announced the addition of the "Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services" report to their offering. Standardization is on the horizon for LTE to operate in a peer-to-peer mode known as LTE Direct (LTE-D) that involves discovery and a mode of operation involving the so-called "ambient awareness". This is expected to be a novelty at first but quickly evolve into a new ecosystem that is at once complementary and competitive to the current cellular ecosystem. There are a number of additional technologies that may also be deployed that all provide the ability for devices to "discover" one another, although over different distances ranging from centimeters (Near Field Communications), meters (Bluetooth), 10s of meters (Wi-Fi), and some that vary (beacon technologies). This research addresses the technology, companies, solutions, and market opportunities involving discovery, presence/detection, peer-to-peer communications, and related applications. The report evaluates the ecosystem, anticipated impacts, and future of Person-to-Person, Device-to-Device, communications. Key Topics Covered: 1 Introduction 2 Introduction 3 WiFi Direct 4 LTE Direct (LTE-D) 5 P2P Ecosystem Analysis 6 P2P Impact on Operational Support Systems (OSS) 7 P2P Billing Support Systems (BSS) 8 P2P Business Models 9 Market Forecasts 10 Summary and Recommendations 11 Appendix Companies Mentioned: - Broadcom Corporation - Fujitsu Ltd. - HTC Corporation - Hewlett Packard Company - Intel Corporation - JVC Kenwood Holdings - LG Electronics - Motorola Mobility - Qualcomm Atheros - Samsung Electronics Ltd. For more information visit http://www.researchandmarkets.com/research/t7...generation
3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
M2 - Tue Aug 05, 8:43AM CDT
Research and Markets (http://www.researchandmarkets.com/research/btgvxf/3dic_and_2_5d_tsv) has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next several years. For high-end memories, 2015 will be the turning point for 3D adoption. Standards have now been established, therefore the industry will be ready to enter in high-volume manufacturing. Wide I/Os and logic-on-logic will follow, most probably around 2016-2017. Emerging applications, such as photonics based on interposer, are also being developed for future products. However, their market entrance is most likely not going to happen before 2019-2020. Figure1 illustrates the market adoption and growth for the next 5 years; additional information and details per application are available in the report (revenue, wspy, units 2013-2019, etc.). 3D technology and specifically Through Silicon Via processing offer different options for processing wafers. As a result, different business models have been developed. Today, mainly two TSV approaches are being commonly used: via last and via middle. IDMs and wafer foundries are the main adopters of via middle manufacturing for memories and logic dies. They integrate interconnections between the front and back end of the line structures, offering a full device integration. Key Topics Covered: 1. Glossary 2. Motivations and objectives of the report 3. Who should be interested in this report? 4. Companies cited in this report 5. Executive summary 6. Introduction, definitions and report scope 7. Through Silicon Via 8. Key Player and Supply Chain 9.Market Forecast 10. 3D TSV Application Focus 11. Alternative Packaging Technologies 12. Conclusions 13. Perspectives Appendix Companies Mentioned: - Altera - AMD - Amkor - Apple - ASE - ASET - Avago Technologies - Broadcom - Teledyne DALSA - ITRI - eSilicon - ITRI - JCAP - Micron - Pico Computing - Qualcomm - Samsung - Silex Microsystems - TSMC - Tezzaron - Toshiba - TSMC - UMC - UTAC - Xintec - Xilinx - Ziptronix - ZyCube - For more information visit http://www.researchandmarkets.com/research/bt...d_2_5d_tsv.
How Will US Data Companies Suffer In The Wake Of The Snowden Leaks?
at The Street - Mon Aug 04, 9:29AM CDT
By Ben Levine for Kapitall. Just over a year ago, the Edward Snowden leaked classified NSA documents detailing the agency's PRISM [...]
Will Tessera Technologies (TSRA) Beat Earnings Estimates? - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 01, 4:25PM CDT
Tessera Technologies Inc. (TSRA) is set to report second-quarter fiscal 2014 results on Aug 4.
Is the Next Healthcare Revolution Already Brewing?
Keith Speights, The Motley Fool - Motley Fool - Sat Aug 09, 8:03AM CDT
A big health care change appears to be under way, but few are paying much attention to it. At least not yet. On July 28, U.S. Senators Thad Cochran (R-Miss.) and Roger Wicker (R-Miss.) introduced a bill that could help open the door to a new model...
Watch for QUALCOMM to Potentially Pullback After Gaining 1.92% Yesterday
Comtex SmarTrend(R) - Fri Aug 08, 3:41PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $72.50 to a high of $73.96. Yesterday, the shares gained 1.9%, which took the trading range above the 3-day high of $73.35 on volume of 9.0 million shares. Often times after large one-day gains, short term traders will seek to take profits and, as such, investors should be cautious.
QUALCOMM Set to Possibly Pullback After Yesterday's Rally of 1.92%
Comtex SmarTrend(R) - Fri Aug 08, 3:41PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $72.50 to a high of $73.96. Yesterday, the shares gained 1.9%, which took the trading range above the 3-day high of $73.35 on volume of 9.0 million shares. Often times after large one-day gains, short term traders will seek to take profits and, as such, investors should be cautious.
NVIDIA Beats on Q2 Earnings, Misses Revenue Estimates - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 08, 12:40PM CDT
NVIDIA Corp. (NVDA) reported second quarter of fiscal 2015 adjusted earnings of 25 cents per share, which came ahead of the Zacks Consensus Estimate of 19 cents.
Earnings Releases, Acquisitions, Dividend Announcements, and New Products - Research Reports on Qualcomm, AT&T, Yahoo, EMC and Groupon
PR Newswire - Fri Aug 08, 7:40AM CDT
Today, Analysts Review released its research reports regarding Qualcomm Incorporated (NASDAQ: QCOM), AT&T, Inc. (NYSE: T), Yahoo! Inc (NASDAQ: YHOO), EMC Corporation (NYSE: EMC) and Groupon, Inc. (NASDAQ: GRPN). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/5573-100free.
5 NFL Cities Being Squeezed for Stadium Funding
at The Street - Fri Aug 08, 7:30AM CDT
The NFL, its team owners and commissioner are pressuring taxpayers to shell out for upgraded facilities. Not every city is buying.
Broadcom's WICED to Connect AS&E's Wireless X-Ray Scanner - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Thu Aug 07, 5:30PM CDT
Broadcom (BRCM)'s Wireless Internet Connectivity for Embedded Devices Wi-Fi technology has been selected by American Science and Engineering (ASEI) as the connectivity component for its revolutionary Z Backscatter imaging system.
Sensors Will Be Measuring Everything, Even NFL Players
Tim Beyers, The Motley Fool - Motley Fool - Thu Aug 07, 3:09PM CDT
If you fear an Orwellian future in which Big Brother takes the form of technology that watches your every movement, click away from this story. You don't want to read it. For those of you still here, let's get to the uncomfortable truth: Sensors...
Why Intel Is Providing a Buying Opportunity Right Now
at The Street - Thu Aug 07, 5:30AM CDT
Intel has had a great run this year and is worth buying on any dip,
China probes automakers, technology firms
By JOE McDONALD - AP - Wed Aug 06, 10:15PM CDT
BEIJING (AP) — Chinese regulators have launched a series of anti-monopoly investigations of global automakers and technology providers, stepping up pressure on foreign companies that feel increasingly unwelcome in China.
2 Comments
Iconic Watch Brand Timex Introduces Innovative Smartwatch
PR Newswire Europe - Wed Aug 06, 7:31AM CDT
- TIMEX(R) IRONMAN(R) ONE GPS+ Offers Stand-Alone Connectivity without a Phone; Developed in Close Collaboration with Qualcomm and AT&T
Global Chips and Salsa XVIII Report 2014 - The Cat 4 is Out of the Bag
M2 - Wed Aug 06, 3:51AM CDT
Research and Markets (http://www.researchandmarkets.com/research/4nr4xk/signals_ahead) has announced the addition of the "Signals Ahead: Chips and Salsa XVIII - The Cat 4 is out of the bag" report to their offering. This report is our eighteenth Chips and Salsa report since 2004 with each of these reports covering various aspects of the wireless IC market. We've done company profiles and emerging trends on various market segments, written about the RF front-end and the many challenges and opportunities associated with LTE and band fragmentation. We've also done more than our fair share of performance benchmarking, including UMTS (call reliability), HSDPA, HSPA , Mobile WiMA X, A-GNSS, and LTE, including over-the-air (OTA) testing of leading smartphones. This report marks the tenth time that we have collaborated with Spirent Communications in the benchmark studies. As it has done in the past, Spirent provided us with its CS8 test system and engineering support in order to obtain highly objective results. In the most recent round of chipset testing, we tested solutions from six different chipset suppliers. All of these chipsets had Category 4 (Cat 4) capabilities, meaning that they could support a theoretical peak data rate of -150 Mbps in a 20 MHz LTE FDD channel - the Cat 4 is out of the bag. Five of these solutions came directly from the chipset suppliers while we purchased the HiSilicon-based platform on the open market. This study does not include several chipset suppliers, but to the best of our knowledge very few of them are currently shipping a Cat 4 chipset into a commercially-available mobile device. We look forward to including these chipsets in future testing, including our LTE TDD and LTE Advanced Carrier Aggregation benchmark tests that we are planning to kick off in the very near future. We subjected the chipsets to 29 different test scenarios that combined a mix of fading profiles (EPA5, EVA5, ETU70 and ETU300, plus Static channel conditions) and transmission modes (Open Loop MIMO and Closed Loop MIMO). We also incorporated different MIMO correlation factors (low, medium, and high), and six different SINR values for each of the four fading profiles. Based on our highly-objective evaluation criteria, Samsung's pre-commercial chipset was the top- performing chipset, based on its average throughput in each of the tests and based on its individual finishing place in each of the tests. We explain our ranking criteria in more detail later in this report. Samsung (19) also had the most first place finishes, followed by MediaTek (4), Qualcomm (3), Intel (2), and Ericsson (1). We also ranked the chipsets for each grouping of ITU channel models. Based only on the ranking of average throughputs, the winning chipsets in each grouping of tests were as follows: Static (MediaTek - pre-commercial), High SINR with varying MIMO correlation factors (Intel - commercial hardware), EPA5 (Samsung - pre-commercial), EVA5 (Samsung - pre-commercial), ETU70 (Samsung - pre-commercial) and ETU300 (Samsung - pre-commercial). All this and more in this issue of Signals Ahead. Key Topics Covered: 1.0 Executive Summary 2.0 Introduction 3.0 The Results - Sliced and diced several different ways 4.0 Results and Analysis by Test Grouping 5.0 Deep Dive Analysis 6.0 Test Methodology 7.0 Final Thoughts Companies Mentioned - Ericsson - HiSilicon Intel - MediaTek - Qualcomm - Samsung For more information visit http://www.researchandmarkets.com/research/4n...nals_ahead
Microsoft hires Qualcomm exec to make more deals
AP - Tue Aug 05, 6:37PM CDT
REDMOND, Wash. (AP) — Microsoft CEO Satya Nadella has lured away an executive from smartphone chip maker Qualcomm to hammer out more deals that will expand the software maker's presence in the mobile device market.
ClearBridge Value: Making It A Top Mutual Fund Again
at Investor's Business Daily - Tue Aug 05, 5:30PM CDT
How do you follow a legend? That's been one of the challenges for Sam Peters, who has been lead manager of $2.7 billion ClearBridge Value since taking the baton from Bill Miller about two years ago. Miller -- who still runs $2.1 billion Legg Mason...
Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services
M2 - Tue Aug 05, 9:19AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t7zmxb/next_generation) has announced the addition of the "Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services" report to their offering. Standardization is on the horizon for LTE to operate in a peer-to-peer mode known as LTE Direct (LTE-D) that involves discovery and a mode of operation involving the so-called "ambient awareness". This is expected to be a novelty at first but quickly evolve into a new ecosystem that is at once complementary and competitive to the current cellular ecosystem. There are a number of additional technologies that may also be deployed that all provide the ability for devices to "discover" one another, although over different distances ranging from centimeters (Near Field Communications), meters (Bluetooth), 10s of meters (Wi-Fi), and some that vary (beacon technologies). This research addresses the technology, companies, solutions, and market opportunities involving discovery, presence/detection, peer-to-peer communications, and related applications. The report evaluates the ecosystem, anticipated impacts, and future of Person-to-Person, Device-to-Device, communications. Key Topics Covered: 1 Introduction 2 Introduction 3 WiFi Direct 4 LTE Direct (LTE-D) 5 P2P Ecosystem Analysis 6 P2P Impact on Operational Support Systems (OSS) 7 P2P Billing Support Systems (BSS) 8 P2P Business Models 9 Market Forecasts 10 Summary and Recommendations 11 Appendix Companies Mentioned: - Broadcom Corporation - Fujitsu Ltd. - HTC Corporation - Hewlett Packard Company - Intel Corporation - JVC Kenwood Holdings - LG Electronics - Motorola Mobility - Qualcomm Atheros - Samsung Electronics Ltd. For more information visit http://www.researchandmarkets.com/research/t7...generation
3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
M2 - Tue Aug 05, 8:43AM CDT
Research and Markets (http://www.researchandmarkets.com/research/btgvxf/3dic_and_2_5d_tsv) has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next several years. For high-end memories, 2015 will be the turning point for 3D adoption. Standards have now been established, therefore the industry will be ready to enter in high-volume manufacturing. Wide I/Os and logic-on-logic will follow, most probably around 2016-2017. Emerging applications, such as photonics based on interposer, are also being developed for future products. However, their market entrance is most likely not going to happen before 2019-2020. Figure1 illustrates the market adoption and growth for the next 5 years; additional information and details per application are available in the report (revenue, wspy, units 2013-2019, etc.). 3D technology and specifically Through Silicon Via processing offer different options for processing wafers. As a result, different business models have been developed. Today, mainly two TSV approaches are being commonly used: via last and via middle. IDMs and wafer foundries are the main adopters of via middle manufacturing for memories and logic dies. They integrate interconnections between the front and back end of the line structures, offering a full device integration. Key Topics Covered: 1. Glossary 2. Motivations and objectives of the report 3. Who should be interested in this report? 4. Companies cited in this report 5. Executive summary 6. Introduction, definitions and report scope 7. Through Silicon Via 8. Key Player and Supply Chain 9.Market Forecast 10. 3D TSV Application Focus 11. Alternative Packaging Technologies 12. Conclusions 13. Perspectives Appendix Companies Mentioned: - Altera - AMD - Amkor - Apple - ASE - ASET - Avago Technologies - Broadcom - Teledyne DALSA - ITRI - eSilicon - ITRI - JCAP - Micron - Pico Computing - Qualcomm - Samsung - Silex Microsystems - TSMC - Tezzaron - Toshiba - TSMC - UMC - UTAC - Xintec - Xilinx - Ziptronix - ZyCube - For more information visit http://www.researchandmarkets.com/research/bt...d_2_5d_tsv.
How Will US Data Companies Suffer In The Wake Of The Snowden Leaks?
at The Street - Mon Aug 04, 9:29AM CDT
By Ben Levine for Kapitall. Just over a year ago, the Edward Snowden leaked classified NSA documents detailing the agency's PRISM [...]
Will Tessera Technologies (TSRA) Beat Earnings Estimates? - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 01, 4:25PM CDT
Tessera Technologies Inc. (TSRA) is set to report second-quarter fiscal 2014 results on Aug 4.
