Qualcomm Inc (QCOM) 72.49 $QCOM
Broadcom's WICED to Connect AS&E's Wireless X-Ray Scanner - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Thu Aug 07, 5:30PM CDT
Broadcom (BRCM)'s Wireless Internet Connectivity for Embedded Devices Wi-Fi technology has been selected by American Science and Engineering (ASEI) as the connectivity component for its revolutionary Z Backscatter imaging system.
Sensors Will Be Measuring Everything, Even NFL Players
Tim Beyers, The Motley Fool - Motley Fool - Thu Aug 07, 3:09PM CDT
If you fear an Orwellian future in which Big Brother takes the form of technology that watches your every movement, click away from this story. You don't want to read it. For those of you still here, let's get to the uncomfortable truth: Sensors...
Why Intel Is Providing a Buying Opportunity Right Now
at The Street - Thu Aug 07, 5:30AM CDT
Intel has had a great run this year and is worth buying on any dip,
China probes automakers, technology firms
By JOE McDONALD - AP - Wed Aug 06, 10:15PM CDT
BEIJING (AP) — Chinese regulators have launched a series of anti-monopoly investigations of global automakers and technology providers, stepping up pressure on foreign companies that feel increasingly unwelcome in China.
2 Comments
Iconic Watch Brand Timex Introduces Innovative Smartwatch
PR Newswire Europe - Wed Aug 06, 7:31AM CDT
- TIMEX(R) IRONMAN(R) ONE GPS+ Offers Stand-Alone Connectivity without a Phone; Developed in Close Collaboration with Qualcomm and AT&T
Global Chips and Salsa XVIII Report 2014 - The Cat 4 is Out of the Bag
M2 - Wed Aug 06, 3:51AM CDT
Research and Markets (http://www.researchandmarkets.com/research/4nr4xk/signals_ahead) has announced the addition of the "Signals Ahead: Chips and Salsa XVIII - The Cat 4 is out of the bag" report to their offering. This report is our eighteenth Chips and Salsa report since 2004 with each of these reports covering various aspects of the wireless IC market. We've done company profiles and emerging trends on various market segments, written about the RF front-end and the many challenges and opportunities associated with LTE and band fragmentation. We've also done more than our fair share of performance benchmarking, including UMTS (call reliability), HSDPA, HSPA , Mobile WiMA X, A-GNSS, and LTE, including over-the-air (OTA) testing of leading smartphones. This report marks the tenth time that we have collaborated with Spirent Communications in the benchmark studies. As it has done in the past, Spirent provided us with its CS8 test system and engineering support in order to obtain highly objective results. In the most recent round of chipset testing, we tested solutions from six different chipset suppliers. All of these chipsets had Category 4 (Cat 4) capabilities, meaning that they could support a theoretical peak data rate of -150 Mbps in a 20 MHz LTE FDD channel - the Cat 4 is out of the bag. Five of these solutions came directly from the chipset suppliers while we purchased the HiSilicon-based platform on the open market. This study does not include several chipset suppliers, but to the best of our knowledge very few of them are currently shipping a Cat 4 chipset into a commercially-available mobile device. We look forward to including these chipsets in future testing, including our LTE TDD and LTE Advanced Carrier Aggregation benchmark tests that we are planning to kick off in the very near future. We subjected the chipsets to 29 different test scenarios that combined a mix of fading profiles (EPA5, EVA5, ETU70 and ETU300, plus Static channel conditions) and transmission modes (Open Loop MIMO and Closed Loop MIMO). We also incorporated different MIMO correlation factors (low, medium, and high), and six different SINR values for each of the four fading profiles. Based on our highly-objective evaluation criteria, Samsung's pre-commercial chipset was the top- performing chipset, based on its average throughput in each of the tests and based on its individual finishing place in each of the tests. We explain our ranking criteria in more detail later in this report. Samsung (19) also had the most first place finishes, followed by MediaTek (4), Qualcomm (3), Intel (2), and Ericsson (1). We also ranked the chipsets for each grouping of ITU channel models. Based only on the ranking of average throughputs, the winning chipsets in each grouping of tests were as follows: Static (MediaTek - pre-commercial), High SINR with varying MIMO correlation factors (Intel - commercial hardware), EPA5 (Samsung - pre-commercial), EVA5 (Samsung - pre-commercial), ETU70 (Samsung - pre-commercial) and ETU300 (Samsung - pre-commercial). All this and more in this issue of Signals Ahead. Key Topics Covered: 1.0 Executive Summary 2.0 Introduction 3.0 The Results - Sliced and diced several different ways 4.0 Results and Analysis by Test Grouping 5.0 Deep Dive Analysis 6.0 Test Methodology 7.0 Final Thoughts Companies Mentioned - Ericsson - HiSilicon Intel - MediaTek - Qualcomm - Samsung For more information visit http://www.researchandmarkets.com/research/4n...nals_ahead
Microsoft hires Qualcomm exec to make more deals
AP - Tue Aug 05, 6:37PM CDT
REDMOND, Wash. (AP) — Microsoft CEO Satya Nadella has lured away an executive from smartphone chip maker Qualcomm to hammer out more deals that will expand the software maker's presence in the mobile device market.
ClearBridge Value: Making It A Top Mutual Fund Again
at Investor's Business Daily - Tue Aug 05, 5:30PM CDT
How do you follow a legend? That's been one of the challenges for Sam Peters, who has been lead manager of $2.7 billion ClearBridge Value since taking the baton from Bill Miller about two years ago. Miller -- who still runs $2.1 billion Legg Mason...
Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services
M2 - Tue Aug 05, 9:19AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t7zmxb/next_generation) has announced the addition of the "Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services" report to their offering. Standardization is on the horizon for LTE to operate in a peer-to-peer mode known as LTE Direct (LTE-D) that involves discovery and a mode of operation involving the so-called "ambient awareness". This is expected to be a novelty at first but quickly evolve into a new ecosystem that is at once complementary and competitive to the current cellular ecosystem. There are a number of additional technologies that may also be deployed that all provide the ability for devices to "discover" one another, although over different distances ranging from centimeters (Near Field Communications), meters (Bluetooth), 10s of meters (Wi-Fi), and some that vary (beacon technologies). This research addresses the technology, companies, solutions, and market opportunities involving discovery, presence/detection, peer-to-peer communications, and related applications. The report evaluates the ecosystem, anticipated impacts, and future of Person-to-Person, Device-to-Device, communications. Key Topics Covered: 1 Introduction 2 Introduction 3 WiFi Direct 4 LTE Direct (LTE-D) 5 P2P Ecosystem Analysis 6 P2P Impact on Operational Support Systems (OSS) 7 P2P Billing Support Systems (BSS) 8 P2P Business Models 9 Market Forecasts 10 Summary and Recommendations 11 Appendix Companies Mentioned: - Broadcom Corporation - Fujitsu Ltd. - HTC Corporation - Hewlett Packard Company - Intel Corporation - JVC Kenwood Holdings - LG Electronics - Motorola Mobility - Qualcomm Atheros - Samsung Electronics Ltd. For more information visit http://www.researchandmarkets.com/research/t7...generation
3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
M2 - Tue Aug 05, 8:43AM CDT
Research and Markets (http://www.researchandmarkets.com/research/btgvxf/3dic_and_2_5d_tsv) has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next several years. For high-end memories, 2015 will be the turning point for 3D adoption. Standards have now been established, therefore the industry will be ready to enter in high-volume manufacturing. Wide I/Os and logic-on-logic will follow, most probably around 2016-2017. Emerging applications, such as photonics based on interposer, are also being developed for future products. However, their market entrance is most likely not going to happen before 2019-2020. Figure1 illustrates the market adoption and growth for the next 5 years; additional information and details per application are available in the report (revenue, wspy, units 2013-2019, etc.). 3D technology and specifically Through Silicon Via processing offer different options for processing wafers. As a result, different business models have been developed. Today, mainly two TSV approaches are being commonly used: via last and via middle. IDMs and wafer foundries are the main adopters of via middle manufacturing for memories and logic dies. They integrate interconnections between the front and back end of the line structures, offering a full device integration. Key Topics Covered: 1. Glossary 2. Motivations and objectives of the report 3. Who should be interested in this report? 4. Companies cited in this report 5. Executive summary 6. Introduction, definitions and report scope 7. Through Silicon Via 8. Key Player and Supply Chain 9.Market Forecast 10. 3D TSV Application Focus 11. Alternative Packaging Technologies 12. Conclusions 13. Perspectives Appendix Companies Mentioned: - Altera - AMD - Amkor - Apple - ASE - ASET - Avago Technologies - Broadcom - Teledyne DALSA - ITRI - eSilicon - ITRI - JCAP - Micron - Pico Computing - Qualcomm - Samsung - Silex Microsystems - TSMC - Tezzaron - Toshiba - TSMC - UMC - UTAC - Xintec - Xilinx - Ziptronix - ZyCube - For more information visit http://www.researchandmarkets.com/research/bt...d_2_5d_tsv.
How Will US Data Companies Suffer In The Wake Of The Snowden Leaks?
at The Street - Mon Aug 04, 9:29AM CDT
By Ben Levine for Kapitall. Just over a year ago, the Edward Snowden leaked classified NSA documents detailing the agency's PRISM [...]
Will Tessera Technologies (TSRA) Beat Earnings Estimates? - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 01, 4:25PM CDT
Tessera Technologies Inc. (TSRA) is set to report second-quarter fiscal 2014 results on Aug 4.
Financial Results, Executive Changes, and Scheduled Conference Calls - Research Reports on Qualcomm, Nokia, Harris, Motorola Solutions and Knowles
PR Newswire - Fri Aug 01, 7:40AM CDT
Today, Analysts Review released its research reports regarding Qualcomm Incorporated (NASDAQ: QCOM), Nokia Corporation (NYSE: NOK), Harris Corporation (NYSE: HRS), Motorola Solutions, Inc. (NYSE: MSI) and Knowles Corporation (NYSE: KN). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/5325-100free.
Look for Shares of QUALCOMM to Potentially Rebound after Yesterday's 3.05% Sell Off
Comtex SmarTrend(R) - Thu Jul 31, 4:19PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $73.65 to a high of $75.60. Yesterday, the shares fell 3.1%, which took the trading range below the 3-day low of $75.15 on volume of 15.1 million shares. Often times after large one-day declines, short-term traders may play for some degree of mean reversion.
SmarTrend Watching for Potential Rebound in Shares of QUALCOMM After 3.05% Loss
Comtex SmarTrend(R) - Thu Jul 31, 4:18PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $73.65 to a high of $75.60. Yesterday, the shares fell 3.1%, which took the trading range below the 3-day low of $75.15 on volume of 15.1 million shares. Often times after large one-day declines, short-term traders may play for some degree of mean reversion.
Qualcomm Dumps Package in First CMOS PA Offering, According to ABI Research
Business Wire - Thu Jul 31, 9:45AM CDT
The highly promoted RF PA devices from Qualcomm are starting to hit production phones. The first phone built with the Qualcomm PAs utilizes both the QFE2320 (for low-band) and QFE2340 (for high-band) multi-mode/multi-band (MMMB) PAs. These devices, along with the other front-end components, are new offerings for Qualcomm which has shied away from the PA area up until now. Qualcomm introduced some expected developments including the first CMOS MMMB PA in mass-production and the first CMOS integrated PA/Switch in mass-production. However there was one big surprise.
Watch for Shares of QUALCOMM (QCOM) to Approach Support at $74.73
Comtex SmarTrend(R) - Thu Jul 31, 9:34AM CDT
QUALCOMM (NASDAQ:QCOM) has opened bearishly below the pivot of $75.81 today and has reached the first level of support at $75.38. Analysts will be watching for a cross of the next downside pivot targets of $74.73 and $73.65.
Taiwan Smartphone Application IC Market, 2Q 2014
M2 - Thu Jul 31, 8:29AM CDT
ReportsnReports.com offers "The Taiwanese Smartphone Application IC Market, 2Q 2014" research report in its store. This research report presents market size and value forecast and recent quarter review of the Taiwanese smartphone baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC markets. The report includes baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC market volume, value, ASP, and market share by solution provider. The content of this report is based on primary data obtained through interviews with smartphone component makers. The report finds that Taiwanese smartphone application IC market volume declined 29.6% sequentially in the first quarter of 2014, due largely in sluggish sales of smartphones in the same quarter. Taiwanese smartphone application IC market volume is anticipated to have declined sequentially in the second quarter of 2014, the transitional period between new and older branded smarpthones. Qualcomm continued the leadership in the Taiwanese smartphone baseband IC market with a 92.7% adoption share in the first quarter of 2014, followed by MediaTek and Intel. As for application processors, Samsung's application processors continued to be widespread used by 92.4% of smartphones produced by Taiwanese makers, followed by application processors from Qualcomm, and Nvidia.
Broadcom's WICED to Connect AS&E's Wireless X-Ray Scanner - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Thu Aug 07, 5:30PM CDT
Broadcom (BRCM)'s Wireless Internet Connectivity for Embedded Devices Wi-Fi technology has been selected by American Science and Engineering (ASEI) as the connectivity component for its revolutionary Z Backscatter imaging system.
Sensors Will Be Measuring Everything, Even NFL Players
Tim Beyers, The Motley Fool - Motley Fool - Thu Aug 07, 3:09PM CDT
If you fear an Orwellian future in which Big Brother takes the form of technology that watches your every movement, click away from this story. You don't want to read it. For those of you still here, let's get to the uncomfortable truth: Sensors...
Why Intel Is Providing a Buying Opportunity Right Now
at The Street - Thu Aug 07, 5:30AM CDT
Intel has had a great run this year and is worth buying on any dip,
China probes automakers, technology firms
By JOE McDONALD - AP - Wed Aug 06, 10:15PM CDT
BEIJING (AP) — Chinese regulators have launched a series of anti-monopoly investigations of global automakers and technology providers, stepping up pressure on foreign companies that feel increasingly unwelcome in China.
2 Comments
Iconic Watch Brand Timex Introduces Innovative Smartwatch
PR Newswire Europe - Wed Aug 06, 7:31AM CDT
- TIMEX(R) IRONMAN(R) ONE GPS+ Offers Stand-Alone Connectivity without a Phone; Developed in Close Collaboration with Qualcomm and AT&T
Global Chips and Salsa XVIII Report 2014 - The Cat 4 is Out of the Bag
M2 - Wed Aug 06, 3:51AM CDT
Research and Markets (http://www.researchandmarkets.com/research/4nr4xk/signals_ahead) has announced the addition of the "Signals Ahead: Chips and Salsa XVIII - The Cat 4 is out of the bag" report to their offering. This report is our eighteenth Chips and Salsa report since 2004 with each of these reports covering various aspects of the wireless IC market. We've done company profiles and emerging trends on various market segments, written about the RF front-end and the many challenges and opportunities associated with LTE and band fragmentation. We've also done more than our fair share of performance benchmarking, including UMTS (call reliability), HSDPA, HSPA , Mobile WiMA X, A-GNSS, and LTE, including over-the-air (OTA) testing of leading smartphones. This report marks the tenth time that we have collaborated with Spirent Communications in the benchmark studies. As it has done in the past, Spirent provided us with its CS8 test system and engineering support in order to obtain highly objective results. In the most recent round of chipset testing, we tested solutions from six different chipset suppliers. All of these chipsets had Category 4 (Cat 4) capabilities, meaning that they could support a theoretical peak data rate of -150 Mbps in a 20 MHz LTE FDD channel - the Cat 4 is out of the bag. Five of these solutions came directly from the chipset suppliers while we purchased the HiSilicon-based platform on the open market. This study does not include several chipset suppliers, but to the best of our knowledge very few of them are currently shipping a Cat 4 chipset into a commercially-available mobile device. We look forward to including these chipsets in future testing, including our LTE TDD and LTE Advanced Carrier Aggregation benchmark tests that we are planning to kick off in the very near future. We subjected the chipsets to 29 different test scenarios that combined a mix of fading profiles (EPA5, EVA5, ETU70 and ETU300, plus Static channel conditions) and transmission modes (Open Loop MIMO and Closed Loop MIMO). We also incorporated different MIMO correlation factors (low, medium, and high), and six different SINR values for each of the four fading profiles. Based on our highly-objective evaluation criteria, Samsung's pre-commercial chipset was the top- performing chipset, based on its average throughput in each of the tests and based on its individual finishing place in each of the tests. We explain our ranking criteria in more detail later in this report. Samsung (19) also had the most first place finishes, followed by MediaTek (4), Qualcomm (3), Intel (2), and Ericsson (1). We also ranked the chipsets for each grouping of ITU channel models. Based only on the ranking of average throughputs, the winning chipsets in each grouping of tests were as follows: Static (MediaTek - pre-commercial), High SINR with varying MIMO correlation factors (Intel - commercial hardware), EPA5 (Samsung - pre-commercial), EVA5 (Samsung - pre-commercial), ETU70 (Samsung - pre-commercial) and ETU300 (Samsung - pre-commercial). All this and more in this issue of Signals Ahead. Key Topics Covered: 1.0 Executive Summary 2.0 Introduction 3.0 The Results - Sliced and diced several different ways 4.0 Results and Analysis by Test Grouping 5.0 Deep Dive Analysis 6.0 Test Methodology 7.0 Final Thoughts Companies Mentioned - Ericsson - HiSilicon Intel - MediaTek - Qualcomm - Samsung For more information visit http://www.researchandmarkets.com/research/4n...nals_ahead
Microsoft hires Qualcomm exec to make more deals
AP - Tue Aug 05, 6:37PM CDT
REDMOND, Wash. (AP) — Microsoft CEO Satya Nadella has lured away an executive from smartphone chip maker Qualcomm to hammer out more deals that will expand the software maker's presence in the mobile device market.
ClearBridge Value: Making It A Top Mutual Fund Again
at Investor's Business Daily - Tue Aug 05, 5:30PM CDT
How do you follow a legend? That's been one of the challenges for Sam Peters, who has been lead manager of $2.7 billion ClearBridge Value since taking the baton from Bill Miller about two years ago. Miller -- who still runs $2.1 billion Legg Mason...
Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services
M2 - Tue Aug 05, 9:19AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t7zmxb/next_generation) has announced the addition of the "Next Generation Peer-to-Peer (P2P) Wireless: Developing Market Opportunities for P2P Direct Applications and Services" report to their offering. Standardization is on the horizon for LTE to operate in a peer-to-peer mode known as LTE Direct (LTE-D) that involves discovery and a mode of operation involving the so-called "ambient awareness". This is expected to be a novelty at first but quickly evolve into a new ecosystem that is at once complementary and competitive to the current cellular ecosystem. There are a number of additional technologies that may also be deployed that all provide the ability for devices to "discover" one another, although over different distances ranging from centimeters (Near Field Communications), meters (Bluetooth), 10s of meters (Wi-Fi), and some that vary (beacon technologies). This research addresses the technology, companies, solutions, and market opportunities involving discovery, presence/detection, peer-to-peer communications, and related applications. The report evaluates the ecosystem, anticipated impacts, and future of Person-to-Person, Device-to-Device, communications. Key Topics Covered: 1 Introduction 2 Introduction 3 WiFi Direct 4 LTE Direct (LTE-D) 5 P2P Ecosystem Analysis 6 P2P Impact on Operational Support Systems (OSS) 7 P2P Billing Support Systems (BSS) 8 P2P Business Models 9 Market Forecasts 10 Summary and Recommendations 11 Appendix Companies Mentioned: - Broadcom Corporation - Fujitsu Ltd. - HTC Corporation - Hewlett Packard Company - Intel Corporation - JVC Kenwood Holdings - LG Electronics - Motorola Mobility - Qualcomm Atheros - Samsung Electronics Ltd. For more information visit http://www.researchandmarkets.com/research/t7...generation
3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
M2 - Tue Aug 05, 8:43AM CDT
Research and Markets (http://www.researchandmarkets.com/research/btgvxf/3dic_and_2_5d_tsv) has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next several years. For high-end memories, 2015 will be the turning point for 3D adoption. Standards have now been established, therefore the industry will be ready to enter in high-volume manufacturing. Wide I/Os and logic-on-logic will follow, most probably around 2016-2017. Emerging applications, such as photonics based on interposer, are also being developed for future products. However, their market entrance is most likely not going to happen before 2019-2020. Figure1 illustrates the market adoption and growth for the next 5 years; additional information and details per application are available in the report (revenue, wspy, units 2013-2019, etc.). 3D technology and specifically Through Silicon Via processing offer different options for processing wafers. As a result, different business models have been developed. Today, mainly two TSV approaches are being commonly used: via last and via middle. IDMs and wafer foundries are the main adopters of via middle manufacturing for memories and logic dies. They integrate interconnections between the front and back end of the line structures, offering a full device integration. Key Topics Covered: 1. Glossary 2. Motivations and objectives of the report 3. Who should be interested in this report? 4. Companies cited in this report 5. Executive summary 6. Introduction, definitions and report scope 7. Through Silicon Via 8. Key Player and Supply Chain 9.Market Forecast 10. 3D TSV Application Focus 11. Alternative Packaging Technologies 12. Conclusions 13. Perspectives Appendix Companies Mentioned: - Altera - AMD - Amkor - Apple - ASE - ASET - Avago Technologies - Broadcom - Teledyne DALSA - ITRI - eSilicon - ITRI - JCAP - Micron - Pico Computing - Qualcomm - Samsung - Silex Microsystems - TSMC - Tezzaron - Toshiba - TSMC - UMC - UTAC - Xintec - Xilinx - Ziptronix - ZyCube - For more information visit http://www.researchandmarkets.com/research/bt...d_2_5d_tsv.
How Will US Data Companies Suffer In The Wake Of The Snowden Leaks?
at The Street - Mon Aug 04, 9:29AM CDT
By Ben Levine for Kapitall. Just over a year ago, the Edward Snowden leaked classified NSA documents detailing the agency's PRISM [...]
Will Tessera Technologies (TSRA) Beat Earnings Estimates? - Analyst Blog
Zacks Equity Research - Zacks Investment Research - Fri Aug 01, 4:25PM CDT
Tessera Technologies Inc. (TSRA) is set to report second-quarter fiscal 2014 results on Aug 4.
Financial Results, Executive Changes, and Scheduled Conference Calls - Research Reports on Qualcomm, Nokia, Harris, Motorola Solutions and Knowles
PR Newswire - Fri Aug 01, 7:40AM CDT
Today, Analysts Review released its research reports regarding Qualcomm Incorporated (NASDAQ: QCOM), Nokia Corporation (NYSE: NOK), Harris Corporation (NYSE: HRS), Motorola Solutions, Inc. (NYSE: MSI) and Knowles Corporation (NYSE: KN). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/5325-100free.
Look for Shares of QUALCOMM to Potentially Rebound after Yesterday's 3.05% Sell Off
Comtex SmarTrend(R) - Thu Jul 31, 4:19PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $73.65 to a high of $75.60. Yesterday, the shares fell 3.1%, which took the trading range below the 3-day low of $75.15 on volume of 15.1 million shares. Often times after large one-day declines, short-term traders may play for some degree of mean reversion.
SmarTrend Watching for Potential Rebound in Shares of QUALCOMM After 3.05% Loss
Comtex SmarTrend(R) - Thu Jul 31, 4:18PM CDT
QUALCOMM (NASDAQ:QCOM) traded in a range yesterday that spanned from a low of $73.65 to a high of $75.60. Yesterday, the shares fell 3.1%, which took the trading range below the 3-day low of $75.15 on volume of 15.1 million shares. Often times after large one-day declines, short-term traders may play for some degree of mean reversion.
Qualcomm Dumps Package in First CMOS PA Offering, According to ABI Research
Business Wire - Thu Jul 31, 9:45AM CDT
The highly promoted RF PA devices from Qualcomm are starting to hit production phones. The first phone built with the Qualcomm PAs utilizes both the QFE2320 (for low-band) and QFE2340 (for high-band) multi-mode/multi-band (MMMB) PAs. These devices, along with the other front-end components, are new offerings for Qualcomm which has shied away from the PA area up until now. Qualcomm introduced some expected developments including the first CMOS MMMB PA in mass-production and the first CMOS integrated PA/Switch in mass-production. However there was one big surprise.
Watch for Shares of QUALCOMM (QCOM) to Approach Support at $74.73
Comtex SmarTrend(R) - Thu Jul 31, 9:34AM CDT
QUALCOMM (NASDAQ:QCOM) has opened bearishly below the pivot of $75.81 today and has reached the first level of support at $75.38. Analysts will be watching for a cross of the next downside pivot targets of $74.73 and $73.65.
Taiwan Smartphone Application IC Market, 2Q 2014
M2 - Thu Jul 31, 8:29AM CDT
ReportsnReports.com offers "The Taiwanese Smartphone Application IC Market, 2Q 2014" research report in its store. This research report presents market size and value forecast and recent quarter review of the Taiwanese smartphone baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC markets. The report includes baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC market volume, value, ASP, and market share by solution provider. The content of this report is based on primary data obtained through interviews with smartphone component makers. The report finds that Taiwanese smartphone application IC market volume declined 29.6% sequentially in the first quarter of 2014, due largely in sluggish sales of smartphones in the same quarter. Taiwanese smartphone application IC market volume is anticipated to have declined sequentially in the second quarter of 2014, the transitional period between new and older branded smarpthones. Qualcomm continued the leadership in the Taiwanese smartphone baseband IC market with a 92.7% adoption share in the first quarter of 2014, followed by MediaTek and Intel. As for application processors, Samsung's application processors continued to be widespread used by 92.4% of smartphones produced by Taiwanese makers, followed by application processors from Qualcomm, and Nvidia.
