Tokyo Electron Ltd (TOELF) 64.8500 $TOELF
Global Semiconductor Wafer Cleaning Systems Market 2014-2018
M2 - Tue Jul 29, 6:21AM CDT
Research and Markets (http://www.researchandmarkets.com/research/7fvgvr/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2014-2018" report to their offering. The prevention of contamination is vital in the semiconductor production process. The ability of semiconductor wafer manufacturers to keep semiconductor wafers contaminant-free determines the success of the semiconductor production process. Therefore, semiconductor wafer cleaning equipment is used before and after every phase of the semiconductor production process to circumvent contamination. Recently, the miniaturization of semiconductor wafers has caused a shift from batch cleaning to single-wafer cleaning. The analysts forecast the Global Semiconductor Wafer Cleaning Systems market will grow at a CAGR of 16 percent over the period 2013-2018. This report covers the present scenario and the growth prospects of the Global Semiconductor Wafer Cleaning Systems market for the period 2014-2018. To calculate the market size, the report considers revenue generated from the sales of semiconductor wafer cleaning systems worldwide. The report does not consider the following when calculating market size: - Aftermarket sales of wafer cleaning systems - Servicing and maintenance of wafer cleaning systems. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Semiconductor Industry Overview 07. Market Landscape 08. Market Segmentation by Equipment Type 09. Geographical Segmentation 10. Key Leading Countries 11. Buying Criteria 12. Market Growth Drivers 13. Drivers and their Impact 14. Market Challenges 15. Impact of Drivers and Challenges 16. Market Trends 17. Trends and their Impact 18. Vendor Landscape 19. Key Vendor Analysis 20. Other Reports in this Series Companies Mentioned: - Dainippon Screen Mfg. Co. Ltd. - Lam Research Corp. - Tokyo Electron Ltd. - Akrion Systems LLC - K.C.Tech Co. Ltd. - SEMES Co. Ltd. For more information visit http://www.researchandmarkets.com/research/7fvgvr/global
A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
PR Newswire - Wed Jul 23, 1:59AM CDT
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing
Applied Materials and Tokyo Electron Unveil New Company Name - Eteris
M2 - Tue Jul 08, 2:02AM CDT
SAN FRANCISCO and TOKYO - Applied Materials, Inc. (NASDAQ: AMAT) and Tokyo Electron Limited (TSE: 8035) today unveiled the new name and logo of their combined company which will be used once the merger closes. Derived from the concept of eternal innovation for society, Eteris(TM) [pronounced: eh-TAIR-iss] embodies the spirit of what will drive the new company and speaks to what makes the combination unique.
Global Flexible Glass Market 2014-2018: Market will grow at a CAGR of 50% to 2018
M2 - Mon Jun 30, 6:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hqfd8g/global_flexible) has announced the addition of the "Global Flexible Glass Market 2014-2018" report to their offering. The Global Flexible Glass market will grow at a CAGR of 50% to 2018 The Global Flexible Glass market can be segmented by application into the Display market, PV market, OLED market, and Other markets. These are the various application markets of flexible glass that are expected to emerge during the forecast period. The commercial applications of flexible glass in the Display, OLED, and PV markets are expected to materialize during the forecast period. However, end-users could come from other application markets as flexible glass is still in search of a market where it can be used to its full potential. The report, the Global Flexible Glass Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Global Flexible Glass market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key Market Drivers/Challenges/Trends - Increased Demand for Slim and Scratch-resistant Displays. - Rapidly Changing Technology. - Emergence of Wearable Technology. Key Vendors - Asahi Glass Co. Ltd. - Corning Inc. - Nippon Electric Glass Co. Ltd. - Schott AG Other Prominent Vendors - Abrisa Technologies - LiSEC Group - Tokyo Electron Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Application - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/hq...l_flexible
Applied Materials Announces Stockholder Approval of its Proposed Combination with Tokyo Electron
Thomson Reuters ONE - Mon Jun 23, 3:06PM CDT
SANTA CLARA, Calif., June 23, 2014 - Applied Materials, Inc. (NASDAQ: AMAT) announced today that its stockholders have approved its proposed business combination with Tokyo Electron Limited (TSE: 8035).
GLOBALFOUNDRIES Presents First Global Supplier Awards
Business Wire - Thu Jun 19, 6:23PM CDT
GLOBALFOUNDRIES today recognized the winners of its first-ever global Supplier Awards at the company's 2014 Supplier Day event in Malta, NY. Recipients were recognized for their exceptional collaboration and support, as well as a demonstrated ability to perform at the highest level based on the specific needs of GLOBALFOUNDRIES.
2014 Report on the International and Chinese Semiconductor Equipment Industry
M2 - Thu Jun 12, 8:41AM CDT
Research and Markets (http://www.researchandmarkets.com/research/flk8mq/global_and) has announced the addition of the "2014 Report on the International and Chinese Semiconductor Equipment Industry" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. The semiconductor equipment industry is experiencing ceaseless integration. Take Applied Material for example, it took over second-ranked Tokyo Electron in 2013, further consolidating its position with the market occupancy in the etching market on a big rise. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered: 1 Global Semiconductor Industry 2 Semiconductor Equipment Industry 3 Major Semiconductor Equipment Vendors 3.1 Applied Materials 3.2 ASML 3.3 Tokyo Electron 3.4 KLA-Tencor 3.5 Lam Research 3.6 DAINIPPON SCREEN 3.7 Nikon Precision 3.8 Advantest 3.9 Hitachi High-Technologies 3.10 ASM International N.V. 3.11 Teradyne 3.12 ASM Pacific 3.13 Kulicke & Soffa 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned: - ASM International N.V. - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/flk8mq/global_and
Applied Materials Announces Cash Dividend
M2 - Tue Jun 10, 2:08AM CDT
Applied Materials, Inc. today announced that its Board of Directors has approved a quarterly cash dividend of $0.10 per share payable on the company's common stock. The dividend is payable on September 11, 2014 to stockholders of record as of August 21, 2014.
Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market
M2 - Mon May 26, 9:44AM CDT
Research and Markets (http://www.researchandmarkets.com/research/czxvbs/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. EV GROUP IS LEADING, AMAT AND TEL ARE MERGING, WHAT WILL HAPPEN NEXT? The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron). These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV. Key Findings - EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials),two of the largest semiconductor equipment suppliers in the world. - The entrance of aggressive new players is likely to challenge established players in the permanent bonding market: - Some players have recently entered the market with low barriers of entry such as Mitsubishi Heavy Industry (MHI); mainly with customers involved in the R&D sector. - Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area. - TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature. KEY FEATURES OF THE REPORT - Permanent bonding market metrics (wpsy, units and value) - Breakdown by wafer size - Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors - Market share of each major equipment supplier - Overview of the different permanent bonding technologies - Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges - Detailed analysis on the applications using permanent bonding technologies - Detailed information on established and emerging permanent bonding process steps Key Topics Covered: - Executive summary - Introduction, definitions & scope of the report - 2013-2019 detailed permanent bonding - Permanent bonding technologies - 2013-2019 detailed permanent bonding forecast by applications - Conclusions & perspectives - Company presentation Companies Mentioned - AMD - AML - Applied Materials - Avago - Bosch - Discera - EVG - Infineon - InvenSense - Lemoptix - Luxtera - Mitsubishi Heavy Industries - Murata / VTI - Nemotek - OSRAM - PlanOptik - Samsung - Sensonor - Silicon Labs - SOITEC - STMicroelectronics - SUSS MicroTec - Sony - Teledyne DALSA - Tokyo Electron - Ziptronix - IMEC - Leti - Texas Instruments - Tezzaron For more information visit http://www.researchandmarkets.com/research/cz...nent_wafer
Quantum Dots Trends - Global Market Overview 2014
M2 - Wed Apr 02, 8:14AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h7tz7s/quantum_dots) has announced the addition of the "Quantum Dots Trends" report to their offering. Quantum dots or QDs are minute-size spherical semiconductor nanocrystals having the property to confine the motion of carriers such as electrons, valence band holes and even excitons in all three axes. QDs exhibit a unique energy-harnessing ability, which can be used for converting energy from various sources such as solar photons into electrical energy. An ideal isolated quantum dot exhibits discrete energy levels, which corresponds to a delta-shaped density of states having no states among the delta peaks. The report presents an overview of Quantum Dots market worldwide. The report also provides global market estimates and projections for Quantum Dots in US dollars for years 2012 through 2017. The report provides a review of strategic industry activities of major companies worldwide. Key Topics Covered: 1. QUANTUM DOTS - AN OVERVIEW - Quantum Dots - Introduction - Quantum Dots - Properties - Quantum Dots - Application in Key End-Use Segments - Display Devices - Telecom and Photonics - In-Vivo Selective Tissue Marking - In-Vitro Cellular Analysis - Security Inks - Diagnostic and Imaging Devices - Other Applications - Quantum Dots - Drawbacks - Quantum Dots - Technological Advancements 2. MARKET TRENDS 3. RECENT INDUSTRY ACTIVITY - Nanoco Group Inks Global Licensing Agreement with Dow Electronic Materials - Quantum Materials Launches New Range of Metal Tetrapod Quantum Dots - Sony Incorporates Quantum Dot Technology of QD Vision - US DOE National Lab Researchers Procures Tetrapod Quantum Dot Samples from Quantum Materials - Merck Acquires Stake in QLight Nanotech - Nanoco Group Inks Follow-On Agreement with Tokyo Electron - Nanoaxis and Quantum Materials Form Technology Alliance - Samsung Electronics Unveils Full-Color Quantum Dot Display Prototype - Solterra Renewable Technologies Joins JETRO Program - Solterra Renewable Technologies Inks Process Development - Agreement with Flowid and FutureChemistry Holding Consortium 4. MARKET PARTICIPANTS - American Elements - Attonuclei - CAN GmbH (The Center for Applied Nanotechnology) - Cromoz, Inc. - Crystalplex Nanotech - Cyrium Technologies, Inc. - Dow Chemical Company, The - Evident Technologies, Inc. - Irilliant, Inc. - Lab21 Ltd. - MKNano - Nano Axis LLC - Nanoco Group PLC - Nanosquare, Inc. (South Korea) - Nanosys, Inc. - Nanotech-Dubna LLC - Navillum Nanotechnologies LLC - NN-Labs LLC - Ocean NanoTech LLC - Pacific Light Technologies - PlasmaChem GmbH - QD Laser, Inc. - QD Solution - QD Vision, Inc. - Qlight Nanotech - Quantum Materials Corporation - Raytheon Company - Reinste Nanoventures Pvt., Ltd. - Sigma-Aldrich Co., LLC - Voxtel, Inc. 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/h7...antum_dots
Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Semiconductor Industry Enters 2014 Saddled with Structural Challenges, with Over Half of Public Companies Facing Possible Financial Distress, According to AlixPartners Study
GlobeNewswire - Thu Jan 23, 12:04AM CST
Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the industry could see more consolidation, including via M &A, this year, coming on the heels of recently-announced deals such as those involving Avago Technologies and LSI, Micron and Elpida Memory, and Applied Materials and Tokyo Electron. That's according to a new study from AlixPartners, the global business advisory firm.
Tokyo Electron Presents Results of Kextil Pilot at Technology Services World
PR Newswire - Mon Jan 13, 7:30AM CST
Global field service organizations have been demanding a solution that can provide a detailed understanding of the work performed by the field. To date this has been impossible, as the time required to capture detailed documentation prevents the field from meeting ever tightening response times. Now, Kextil (http://www.kextil.com/) eliminates this trade off.
Global Semiconductor Wafer Cleaning Systems Market 2014-2018
M2 - Tue Jul 29, 6:21AM CDT
Research and Markets (http://www.researchandmarkets.com/research/7fvgvr/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2014-2018" report to their offering. The prevention of contamination is vital in the semiconductor production process. The ability of semiconductor wafer manufacturers to keep semiconductor wafers contaminant-free determines the success of the semiconductor production process. Therefore, semiconductor wafer cleaning equipment is used before and after every phase of the semiconductor production process to circumvent contamination. Recently, the miniaturization of semiconductor wafers has caused a shift from batch cleaning to single-wafer cleaning. The analysts forecast the Global Semiconductor Wafer Cleaning Systems market will grow at a CAGR of 16 percent over the period 2013-2018. This report covers the present scenario and the growth prospects of the Global Semiconductor Wafer Cleaning Systems market for the period 2014-2018. To calculate the market size, the report considers revenue generated from the sales of semiconductor wafer cleaning systems worldwide. The report does not consider the following when calculating market size: - Aftermarket sales of wafer cleaning systems - Servicing and maintenance of wafer cleaning systems. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Semiconductor Industry Overview 07. Market Landscape 08. Market Segmentation by Equipment Type 09. Geographical Segmentation 10. Key Leading Countries 11. Buying Criteria 12. Market Growth Drivers 13. Drivers and their Impact 14. Market Challenges 15. Impact of Drivers and Challenges 16. Market Trends 17. Trends and their Impact 18. Vendor Landscape 19. Key Vendor Analysis 20. Other Reports in this Series Companies Mentioned: - Dainippon Screen Mfg. Co. Ltd. - Lam Research Corp. - Tokyo Electron Ltd. - Akrion Systems LLC - K.C.Tech Co. Ltd. - SEMES Co. Ltd. For more information visit http://www.researchandmarkets.com/research/7fvgvr/global
A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
PR Newswire - Wed Jul 23, 1:59AM CDT
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing
Applied Materials and Tokyo Electron Unveil New Company Name - Eteris
M2 - Tue Jul 08, 2:02AM CDT
SAN FRANCISCO and TOKYO - Applied Materials, Inc. (NASDAQ: AMAT) and Tokyo Electron Limited (TSE: 8035) today unveiled the new name and logo of their combined company which will be used once the merger closes. Derived from the concept of eternal innovation for society, Eteris(TM) [pronounced: eh-TAIR-iss] embodies the spirit of what will drive the new company and speaks to what makes the combination unique.
Global Flexible Glass Market 2014-2018: Market will grow at a CAGR of 50% to 2018
M2 - Mon Jun 30, 6:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hqfd8g/global_flexible) has announced the addition of the "Global Flexible Glass Market 2014-2018" report to their offering. The Global Flexible Glass market will grow at a CAGR of 50% to 2018 The Global Flexible Glass market can be segmented by application into the Display market, PV market, OLED market, and Other markets. These are the various application markets of flexible glass that are expected to emerge during the forecast period. The commercial applications of flexible glass in the Display, OLED, and PV markets are expected to materialize during the forecast period. However, end-users could come from other application markets as flexible glass is still in search of a market where it can be used to its full potential. The report, the Global Flexible Glass Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Global Flexible Glass market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key Market Drivers/Challenges/Trends - Increased Demand for Slim and Scratch-resistant Displays. - Rapidly Changing Technology. - Emergence of Wearable Technology. Key Vendors - Asahi Glass Co. Ltd. - Corning Inc. - Nippon Electric Glass Co. Ltd. - Schott AG Other Prominent Vendors - Abrisa Technologies - LiSEC Group - Tokyo Electron Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Application - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/hq...l_flexible
Applied Materials Announces Stockholder Approval of its Proposed Combination with Tokyo Electron
Thomson Reuters ONE - Mon Jun 23, 3:06PM CDT
SANTA CLARA, Calif., June 23, 2014 - Applied Materials, Inc. (NASDAQ: AMAT) announced today that its stockholders have approved its proposed business combination with Tokyo Electron Limited (TSE: 8035).
GLOBALFOUNDRIES Presents First Global Supplier Awards
Business Wire - Thu Jun 19, 6:23PM CDT
GLOBALFOUNDRIES today recognized the winners of its first-ever global Supplier Awards at the company's 2014 Supplier Day event in Malta, NY. Recipients were recognized for their exceptional collaboration and support, as well as a demonstrated ability to perform at the highest level based on the specific needs of GLOBALFOUNDRIES.
2014 Report on the International and Chinese Semiconductor Equipment Industry
M2 - Thu Jun 12, 8:41AM CDT
Research and Markets (http://www.researchandmarkets.com/research/flk8mq/global_and) has announced the addition of the "2014 Report on the International and Chinese Semiconductor Equipment Industry" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. The semiconductor equipment industry is experiencing ceaseless integration. Take Applied Material for example, it took over second-ranked Tokyo Electron in 2013, further consolidating its position with the market occupancy in the etching market on a big rise. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered: 1 Global Semiconductor Industry 2 Semiconductor Equipment Industry 3 Major Semiconductor Equipment Vendors 3.1 Applied Materials 3.2 ASML 3.3 Tokyo Electron 3.4 KLA-Tencor 3.5 Lam Research 3.6 DAINIPPON SCREEN 3.7 Nikon Precision 3.8 Advantest 3.9 Hitachi High-Technologies 3.10 ASM International N.V. 3.11 Teradyne 3.12 ASM Pacific 3.13 Kulicke & Soffa 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned: - ASM International N.V. - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/flk8mq/global_and
Applied Materials Announces Cash Dividend
M2 - Tue Jun 10, 2:08AM CDT
Applied Materials, Inc. today announced that its Board of Directors has approved a quarterly cash dividend of $0.10 per share payable on the company's common stock. The dividend is payable on September 11, 2014 to stockholders of record as of August 21, 2014.
Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market
M2 - Mon May 26, 9:44AM CDT
Research and Markets (http://www.researchandmarkets.com/research/czxvbs/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. EV GROUP IS LEADING, AMAT AND TEL ARE MERGING, WHAT WILL HAPPEN NEXT? The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron). These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV. Key Findings - EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials),two of the largest semiconductor equipment suppliers in the world. - The entrance of aggressive new players is likely to challenge established players in the permanent bonding market: - Some players have recently entered the market with low barriers of entry such as Mitsubishi Heavy Industry (MHI); mainly with customers involved in the R&D sector. - Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area. - TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature. KEY FEATURES OF THE REPORT - Permanent bonding market metrics (wpsy, units and value) - Breakdown by wafer size - Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors - Market share of each major equipment supplier - Overview of the different permanent bonding technologies - Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges - Detailed analysis on the applications using permanent bonding technologies - Detailed information on established and emerging permanent bonding process steps Key Topics Covered: - Executive summary - Introduction, definitions & scope of the report - 2013-2019 detailed permanent bonding - Permanent bonding technologies - 2013-2019 detailed permanent bonding forecast by applications - Conclusions & perspectives - Company presentation Companies Mentioned - AMD - AML - Applied Materials - Avago - Bosch - Discera - EVG - Infineon - InvenSense - Lemoptix - Luxtera - Mitsubishi Heavy Industries - Murata / VTI - Nemotek - OSRAM - PlanOptik - Samsung - Sensonor - Silicon Labs - SOITEC - STMicroelectronics - SUSS MicroTec - Sony - Teledyne DALSA - Tokyo Electron - Ziptronix - IMEC - Leti - Texas Instruments - Tezzaron For more information visit http://www.researchandmarkets.com/research/cz...nent_wafer
Quantum Dots Trends - Global Market Overview 2014
M2 - Wed Apr 02, 8:14AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h7tz7s/quantum_dots) has announced the addition of the "Quantum Dots Trends" report to their offering. Quantum dots or QDs are minute-size spherical semiconductor nanocrystals having the property to confine the motion of carriers such as electrons, valence band holes and even excitons in all three axes. QDs exhibit a unique energy-harnessing ability, which can be used for converting energy from various sources such as solar photons into electrical energy. An ideal isolated quantum dot exhibits discrete energy levels, which corresponds to a delta-shaped density of states having no states among the delta peaks. The report presents an overview of Quantum Dots market worldwide. The report also provides global market estimates and projections for Quantum Dots in US dollars for years 2012 through 2017. The report provides a review of strategic industry activities of major companies worldwide. Key Topics Covered: 1. QUANTUM DOTS - AN OVERVIEW - Quantum Dots - Introduction - Quantum Dots - Properties - Quantum Dots - Application in Key End-Use Segments - Display Devices - Telecom and Photonics - In-Vivo Selective Tissue Marking - In-Vitro Cellular Analysis - Security Inks - Diagnostic and Imaging Devices - Other Applications - Quantum Dots - Drawbacks - Quantum Dots - Technological Advancements 2. MARKET TRENDS 3. RECENT INDUSTRY ACTIVITY - Nanoco Group Inks Global Licensing Agreement with Dow Electronic Materials - Quantum Materials Launches New Range of Metal Tetrapod Quantum Dots - Sony Incorporates Quantum Dot Technology of QD Vision - US DOE National Lab Researchers Procures Tetrapod Quantum Dot Samples from Quantum Materials - Merck Acquires Stake in QLight Nanotech - Nanoco Group Inks Follow-On Agreement with Tokyo Electron - Nanoaxis and Quantum Materials Form Technology Alliance - Samsung Electronics Unveils Full-Color Quantum Dot Display Prototype - Solterra Renewable Technologies Joins JETRO Program - Solterra Renewable Technologies Inks Process Development - Agreement with Flowid and FutureChemistry Holding Consortium 4. MARKET PARTICIPANTS - American Elements - Attonuclei - CAN GmbH (The Center for Applied Nanotechnology) - Cromoz, Inc. - Crystalplex Nanotech - Cyrium Technologies, Inc. - Dow Chemical Company, The - Evident Technologies, Inc. - Irilliant, Inc. - Lab21 Ltd. - MKNano - Nano Axis LLC - Nanoco Group PLC - Nanosquare, Inc. (South Korea) - Nanosys, Inc. - Nanotech-Dubna LLC - Navillum Nanotechnologies LLC - NN-Labs LLC - Ocean NanoTech LLC - Pacific Light Technologies - PlasmaChem GmbH - QD Laser, Inc. - QD Solution - QD Vision, Inc. - Qlight Nanotech - Quantum Materials Corporation - Raytheon Company - Reinste Nanoventures Pvt., Ltd. - Sigma-Aldrich Co., LLC - Voxtel, Inc. 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/h7...antum_dots
Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Semiconductor Industry Enters 2014 Saddled with Structural Challenges, with Over Half of Public Companies Facing Possible Financial Distress, According to AlixPartners Study
GlobeNewswire - Thu Jan 23, 12:04AM CST
Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the industry could see more consolidation, including via M &A, this year, coming on the heels of recently-announced deals such as those involving Avago Technologies and LSI, Micron and Elpida Memory, and Applied Materials and Tokyo Electron. That's according to a new study from AlixPartners, the global business advisory firm.
Tokyo Electron Presents Results of Kextil Pilot at Technology Services World
PR Newswire - Mon Jan 13, 7:30AM CST
Global field service organizations have been demanding a solution that can provide a detailed understanding of the work performed by the field. To date this has been impossible, as the time required to capture detailed documentation prevents the field from meeting ever tightening response times. Now, Kextil (http://www.kextil.com/) eliminates this trade off.
