Silicon On Insulator (SLOIF) 2.9500 $SLOIF
SOITEC : Soitec reports consolidated sales of 49.5 million Euros for the first quarter 2014-2015
Thomson Reuters ONE - Mon Jul 21, 10:48AM CDT
Soitec reports consolidated sales of 49.5 million Euros for the first quarter 2014-2015
SOITEC : SOITEC ANNOUNCES WIDESPREAD ADOPTION OF ITS eSI(TM) SUBSTRATES BY LEADING RF SEMICONDUCTOR COMPANIES
GlobeNewswire - Tue Jul 08, 12:55PM CDT
(SEMICON West 2014) -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has reached an early milestone in the fast-paced and widespread adoption of its proprietary Enhanced Signal Integrity(TM) (eSI) substrates. Soitec eSI substrates are the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. Since Soitec began production of its eSI product, Soitec estimates that it has shipped enough of these leading-edge substrates to fabricate more than 1.4 billion RF front-end semiconductor devices. As the first-to-market supplier of these wafers, Soitec is the driving force in the RF semiconductor materials market.
SOITEC : USIB CONCENTRATOR PHOTOVOLTAIC DEMONSTRATION PLANT INAUGURATED BY NAMIBIAN MINISTER OF MINES AND ENERGY
GlobeNewswire - Tue Jun 10, 12:37AM CDT
Located near Rehoboth, 80 km south of Windhoek in central Namibia, the Usib concentrator photovoltaic (CPV) demonstration plant was today officially inaugurated by Honourable Isak Katali, Namibian Minister of Mines and Energy. The 26 kWp CPV plant, which consists of 2 CPV systems, results from a cooperative agreement between the French company Soitec, one of the world's leading manufacturers of CPV modules, and NamPower, the national power utility of Namibia. The plant generates solar electricity which powers Usib Primary School and a water pump which irrigates the community garden.
SOITEC : SOITEC APPOINTS INDUSTRY VETERAN FROM INTEL TO LEAD MICROELECTRONICS BUSINESS IN NORTH AMERICA
GlobeNewswire - Wed Jun 04, 1:08PM CDT
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has named Thom Degnan vice president of sales and business development for its Electronics Division in North America. This strategic appointment comes at a time when Soitec's Electronics Division is focusing its silicon-on-insulator (SOI) technology on fast-growing mainstream and emerging mobile communication markets - from smart phones to the Internet of Things - with well-positioned products including its FD-SOI wafers for digital electronics and RF-SOI wafers for radio-frequency (RF) applications.
SOITEC : South African Department of Energy grants final approval to a change in the financing structure of Touwsrivier 44 MWp solar project
GlobeNewswire - Mon Jun 02, 1:07AM CDT
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for energy and electronics, today announced that the Department of Energy in South Africa has granted its final approval to a change in the financing structure of Soitec 44 MWp solar project developed in Touwsrivier, enabling the South African Government Employee Pension Fund (GEPF) to come on board as a strong long term investor in the project.
Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market
M2 - Mon May 26, 9:44AM CDT
Research and Markets (http://www.researchandmarkets.com/research/czxvbs/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. EV GROUP IS LEADING, AMAT AND TEL ARE MERGING, WHAT WILL HAPPEN NEXT? The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron). These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV. Key Findings - EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials),two of the largest semiconductor equipment suppliers in the world. - The entrance of aggressive new players is likely to challenge established players in the permanent bonding market: - Some players have recently entered the market with low barriers of entry such as Mitsubishi Heavy Industry (MHI); mainly with customers involved in the R&D sector. - Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area. - TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature. KEY FEATURES OF THE REPORT - Permanent bonding market metrics (wpsy, units and value) - Breakdown by wafer size - Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors - Market share of each major equipment supplier - Overview of the different permanent bonding technologies - Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges - Detailed analysis on the applications using permanent bonding technologies - Detailed information on established and emerging permanent bonding process steps Key Topics Covered: - Executive summary - Introduction, definitions & scope of the report - 2013-2019 detailed permanent bonding - Permanent bonding technologies - 2013-2019 detailed permanent bonding forecast by applications - Conclusions & perspectives - Company presentation Companies Mentioned - AMD - AML - Applied Materials - Avago - Bosch - Discera - EVG - Infineon - InvenSense - Lemoptix - Luxtera - Mitsubishi Heavy Industries - Murata / VTI - Nemotek - OSRAM - PlanOptik - Samsung - Sensonor - Silicon Labs - SOITEC - STMicroelectronics - SUSS MicroTec - Sony - Teledyne DALSA - Tokyo Electron - Ziptronix - IMEC - Leti - Texas Instruments - Tezzaron For more information visit http://www.researchandmarkets.com/research/cz...nent_wafer
SOITEC: SOITEC AND SIMGUI ANNOUNCE MAJOR PARTNERSHIP TO PRODUCE 200-MM SOI WAFERS IN CHINA FOR RF AND POWER SEMICONDUCTOR MARKETS
GlobeNewswire - Mon May 26, 1:54AM CDT
Agreement Includes Technology Licensing and Manufacturing Capacity Collaborations
SOITEC: MAJOR INDUSTRY ANNOUNCEMENT CONFIRMS FD-SOI AS TECHNOLOGY OF CHOICE FOR MOBILE AND CONSUMER MARKETS
GlobeNewswire - Thu May 15, 1:50AM CDT
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today welcomes the extended strategic collaboration announced yesterday by Samsung and STMicroelectronics. Samsung is licensing the 28 nm FD-SOI design platform from STMicroelectronics, allowing designers to immediately begin implementing the platform for system-on-chip products. This announcement further validates Soitec's early strategic technology choice to develop the starting wafers used as a foundation for FD-SOI chip manufacturing. It also represents a tipping point for FD-SOI industry deployment and for Soitec's electronics business in the next decade.
SOITEC : WITH SUPPORT FROM SOITEC, CHARITY ZANMI-LASANTE PARIS IS SUPPLYING SOLAR POWER TO A RURAL COMMUNITY IN HAITI
GlobeNewswire - Wed May 14, 5:38AM CDT
A year after it was rebuilt, the Sainte Rose de Lima community center, in the rural district of Palmary on Haiti's Central Plateau, now has a reliable power supply, as a Plug&Sun(TM) installation now provides independent solar-power generation by means of concentrating photovoltaic (CPV) technology. Developed by Soitec, such systems provide a solution to the problems of access to energy in rural areas with poor connections to the grid, or indeed none at all.
SOITEC : UNIVERSITY OF WASHINGTON SELECTS ALTATECH'S CVD SYSTEM TO DEVELOP NEW PROCESS MATERIALS
GlobeNewswire - Mon Mar 31, 11:13AM CDT
Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD(TM) chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value. The Altatech's CVD system will be installed at the university's Washington Nanofabrication Facility (WNF), where it will be used by both internal and external researchers in fabricating a broad range of semiconductor-based devices including leading-edge CMOS transistors, MEMS, ICs built with the latest in through-silicon-via (TSV) technology, advanced LEDs and solar cells.
SOITEC : SOITEC ANNOUNCES FULL COMMISSIONING OF 22MWP ON TOUWSRIVIER SOLAR PLANT IN SOUTH AFRICA
GlobeNewswire - Tue Mar 25, 1:13AM CDT
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for energy and electronics, today announced that its Touwsrivier solar power plant has successfully fulfilled milestones set for commissioning 50% of the total capacity. This event confirms that the power plant performs in accordance with contractual specifications and validates the power purchase agreements applied to the 44MWp solar plant.
SOITEC : Soitec reports consolidated sales of 49.5 million Euros for the first quarter 2014-2015
Thomson Reuters ONE - Mon Jul 21, 10:48AM CDT
Soitec reports consolidated sales of 49.5 million Euros for the first quarter 2014-2015
SOITEC : SOITEC ANNOUNCES WIDESPREAD ADOPTION OF ITS eSI(TM) SUBSTRATES BY LEADING RF SEMICONDUCTOR COMPANIES
GlobeNewswire - Tue Jul 08, 12:55PM CDT
(SEMICON West 2014) -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has reached an early milestone in the fast-paced and widespread adoption of its proprietary Enhanced Signal Integrity(TM) (eSI) substrates. Soitec eSI substrates are the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. Since Soitec began production of its eSI product, Soitec estimates that it has shipped enough of these leading-edge substrates to fabricate more than 1.4 billion RF front-end semiconductor devices. As the first-to-market supplier of these wafers, Soitec is the driving force in the RF semiconductor materials market.
SOITEC : USIB CONCENTRATOR PHOTOVOLTAIC DEMONSTRATION PLANT INAUGURATED BY NAMIBIAN MINISTER OF MINES AND ENERGY
GlobeNewswire - Tue Jun 10, 12:37AM CDT
Located near Rehoboth, 80 km south of Windhoek in central Namibia, the Usib concentrator photovoltaic (CPV) demonstration plant was today officially inaugurated by Honourable Isak Katali, Namibian Minister of Mines and Energy. The 26 kWp CPV plant, which consists of 2 CPV systems, results from a cooperative agreement between the French company Soitec, one of the world's leading manufacturers of CPV modules, and NamPower, the national power utility of Namibia. The plant generates solar electricity which powers Usib Primary School and a water pump which irrigates the community garden.
SOITEC : SOITEC APPOINTS INDUSTRY VETERAN FROM INTEL TO LEAD MICROELECTRONICS BUSINESS IN NORTH AMERICA
GlobeNewswire - Wed Jun 04, 1:08PM CDT
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has named Thom Degnan vice president of sales and business development for its Electronics Division in North America. This strategic appointment comes at a time when Soitec's Electronics Division is focusing its silicon-on-insulator (SOI) technology on fast-growing mainstream and emerging mobile communication markets - from smart phones to the Internet of Things - with well-positioned products including its FD-SOI wafers for digital electronics and RF-SOI wafers for radio-frequency (RF) applications.
SOITEC : South African Department of Energy grants final approval to a change in the financing structure of Touwsrivier 44 MWp solar project
GlobeNewswire - Mon Jun 02, 1:07AM CDT
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for energy and electronics, today announced that the Department of Energy in South Africa has granted its final approval to a change in the financing structure of Soitec 44 MWp solar project developed in Touwsrivier, enabling the South African Government Employee Pension Fund (GEPF) to come on board as a strong long term investor in the project.
Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market
M2 - Mon May 26, 9:44AM CDT
Research and Markets (http://www.researchandmarkets.com/research/czxvbs/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. EV GROUP IS LEADING, AMAT AND TEL ARE MERGING, WHAT WILL HAPPEN NEXT? The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron). These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV. Key Findings - EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials),two of the largest semiconductor equipment suppliers in the world. - The entrance of aggressive new players is likely to challenge established players in the permanent bonding market: - Some players have recently entered the market with low barriers of entry such as Mitsubishi Heavy Industry (MHI); mainly with customers involved in the R&D sector. - Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area. - TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature. KEY FEATURES OF THE REPORT - Permanent bonding market metrics (wpsy, units and value) - Breakdown by wafer size - Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors - Market share of each major equipment supplier - Overview of the different permanent bonding technologies - Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges - Detailed analysis on the applications using permanent bonding technologies - Detailed information on established and emerging permanent bonding process steps Key Topics Covered: - Executive summary - Introduction, definitions & scope of the report - 2013-2019 detailed permanent bonding - Permanent bonding technologies - 2013-2019 detailed permanent bonding forecast by applications - Conclusions & perspectives - Company presentation Companies Mentioned - AMD - AML - Applied Materials - Avago - Bosch - Discera - EVG - Infineon - InvenSense - Lemoptix - Luxtera - Mitsubishi Heavy Industries - Murata / VTI - Nemotek - OSRAM - PlanOptik - Samsung - Sensonor - Silicon Labs - SOITEC - STMicroelectronics - SUSS MicroTec - Sony - Teledyne DALSA - Tokyo Electron - Ziptronix - IMEC - Leti - Texas Instruments - Tezzaron For more information visit http://www.researchandmarkets.com/research/cz...nent_wafer
SOITEC: SOITEC AND SIMGUI ANNOUNCE MAJOR PARTNERSHIP TO PRODUCE 200-MM SOI WAFERS IN CHINA FOR RF AND POWER SEMICONDUCTOR MARKETS
GlobeNewswire - Mon May 26, 1:54AM CDT
Agreement Includes Technology Licensing and Manufacturing Capacity Collaborations
SOITEC: MAJOR INDUSTRY ANNOUNCEMENT CONFIRMS FD-SOI AS TECHNOLOGY OF CHOICE FOR MOBILE AND CONSUMER MARKETS
GlobeNewswire - Thu May 15, 1:50AM CDT
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today welcomes the extended strategic collaboration announced yesterday by Samsung and STMicroelectronics. Samsung is licensing the 28 nm FD-SOI design platform from STMicroelectronics, allowing designers to immediately begin implementing the platform for system-on-chip products. This announcement further validates Soitec's early strategic technology choice to develop the starting wafers used as a foundation for FD-SOI chip manufacturing. It also represents a tipping point for FD-SOI industry deployment and for Soitec's electronics business in the next decade.
SOITEC : WITH SUPPORT FROM SOITEC, CHARITY ZANMI-LASANTE PARIS IS SUPPLYING SOLAR POWER TO A RURAL COMMUNITY IN HAITI
GlobeNewswire - Wed May 14, 5:38AM CDT
A year after it was rebuilt, the Sainte Rose de Lima community center, in the rural district of Palmary on Haiti's Central Plateau, now has a reliable power supply, as a Plug&Sun(TM) installation now provides independent solar-power generation by means of concentrating photovoltaic (CPV) technology. Developed by Soitec, such systems provide a solution to the problems of access to energy in rural areas with poor connections to the grid, or indeed none at all.
SOITEC : UNIVERSITY OF WASHINGTON SELECTS ALTATECH'S CVD SYSTEM TO DEVELOP NEW PROCESS MATERIALS
GlobeNewswire - Mon Mar 31, 11:13AM CDT
Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD(TM) chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value. The Altatech's CVD system will be installed at the university's Washington Nanofabrication Facility (WNF), where it will be used by both internal and external researchers in fabricating a broad range of semiconductor-based devices including leading-edge CMOS transistors, MEMS, ICs built with the latest in through-silicon-via (TSV) technology, advanced LEDs and solar cells.
SOITEC : SOITEC ANNOUNCES FULL COMMISSIONING OF 22MWP ON TOUWSRIVIER SOLAR PLANT IN SOUTH AFRICA
GlobeNewswire - Tue Mar 25, 1:13AM CDT
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for energy and electronics, today announced that its Touwsrivier solar power plant has successfully fulfilled milestones set for commissioning 50% of the total capacity. This event confirms that the power plant performs in accordance with contractual specifications and validates the power purchase agreements applied to the 44MWp solar plant.
