Tokyo Electron Ltd (TOELF) 57.3600 $TOELF
Global Semiconductor Metal Etching Equipment Market Forecasts & Opportunities, 2018
M2 - Tue Apr 29, 5:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hrtbk8/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market Forecasts & Opportunities, 2018" report to their offering. One of the major trends witnessed in the Global Semiconductor Metal Etching Equipment market is the emergence of miniaturized semiconductors. The increase in the demand for high-performance, low-power consumption and compact electronic devices necessitates the miniaturization of semiconductors. The miniaturization of semiconductor circuits requires wafer fabrication through various etching processes including metal etching. Currently, electronic devices use semiconductors with circuit line widths in the 20nm range. However, ultra-miniature circuits, with line widths in the 10nm range, are expected to be introduced during the forecast period. Therefore, the increasing number of miniaturized semiconductor ICs is expected to fuel the demand for semiconductor metal etching equipment, thereby propelling the growth of the market. According to the report, the most important driver is the rising demand for smart electronic devices. In the recent past, there has been a significant increase in the adoption of smart electronic devices such as smartphones and tablets. These devices employ numerous semiconductor components such as microchips. This in turn is expected to increase the demand for metal etching equipment as semiconductor components undergo microfabrication through the metal etching process. Further, the report states that one of the major challenges in this market is the cyclical nature of the Semiconductor industry. As a result of this, many metal etching equipment vendors often experience fluctuating revenues, which in turn affects their profitability. Moreover, the market often witnesses excess production, which results in inventory pile up. Key vendors dominating this space are: - Applied Materials Inc. - Hitachi High-Technologies Corp. - Lam Research Corp. Other vendors mentioned in the report are: - Jusung Engineering Co. Ltd - Mattson Technology Inc. - Semes Co. Ltd. - Tokyo Electron Ltd. - ULVAC Technologies Inc. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/hrtbk8/global
Research and Markets: Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating
Business Wire - Mon Apr 28, 12:32PM CDT
Research and Markets (http://www.researchandmarkets.com/research/s26fqw/global) has announced the addition of the "Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating" report to their offering.
Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating
M2 - Mon Apr 28, 8:38AM CDT
Research and Markets (http://www.researchandmarkets.com/research/8lw2p7/global) has announced the addition of the "Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating" report to their offering. The growth of the Global Semiconductor Dielectric Etching Equipment market is driven by several factors, including the increasing demand for smartphones and tablets. There has been unprecedented growth in the adoption of smart electronic devices which employ numerous semiconductor components like microchips. This is expected to lead to an increase in the demand for dielectric etching equipment as semiconductor components require microfabrication. Commenting on the report, an analyst from the team said: The increasing demand for compact, energy-efficient, and high performance electronic devices necessitates miniaturization of semiconductor circuits. Miniature semiconductor circuits undergo wafer fabrication process through dielectric etching. Circuit miniaturization requires more thorough dielectric etching and the number of etch steps increases as capacity additions are incorporated. Currently, electronic devices use semiconductors with circuit line widths in the 0-20nm range. However, it is expected that ultraminiature circuits, with line widths in the 0-10nm range could be introduced during the forecast period. Thus, the growing need for miniaturization of semiconductor circuits is expected to fuel the demand for semiconductor dielectric etching equipment during the forecast period. Further, the report states that despite the presence of several drivers, the growth of the Global Semiconductor Dielectric Etching Equipment market is curtailed by some serious challenges, such as the cyclical nature of Semiconductor industry. The revenue generated in the Semiconductor industry is cyclical in nature because the demand for etching is dependent on the economic climate. Very often, production tends to exceed demand, resulting in inventory pile up. Key vendors dominating this space are: - Applied Materials Inc. - Hitachi High-Technologies Corp. - Lam Research Corp. - Tokyo Electron Ltd. Other vendors mentioned in the report are: - Jusung Engineering Co. Ltd. - Mattson Technology Inc. - Semes Co. Ltd. - ULVAC Technologies Inc. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/8lw2p7/global
Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating
M2 - Mon Apr 28, 8:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/885wcx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating" report to their offering. The Global Wafer-level Packaging Equipment market to grow at a CAGR of 2.9% over the period 2013-2018. The most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc. - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc - SEMES Co. Ltd - Suss Microtec AG - Ultratech Inc. - ULVAC. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/885wcx/global
Global Flexible Glass Market 2014-2018: Asahi Glass, Corning, Nippon Electric Glass & Schott AG Dominate the Industry
M2 - Fri Apr 25, 6:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/r9hr2g/global_flexible) has announced the addition of the "Global Flexible Glass Market 2014-2018" report to their offering. The Global Flexible Glass market will grow at a CAGR of 50.21 percent over the period 2013-2018. Flexible glass is an ultra-thin glass that has the properties of rigid glass such as high barrier properties, strength, temperature stability and durability, but in a flexible form. Moreover, flexible glass combines the scratch resistance and rigidity properties of plastics. The Global Flexible Glass market is an emerging market that is experiencing enormous changes and innovations. Flexible glass plays a key role in making electronic gadgets lightweight, attractive, handy, and of high quality. It also holds the key to the making of next-generation gadgets with are rollable, flexible, and wearable. The Global Flexible Glass market is driven by several factors, and the increasing demand for slim and scratch-resistant displays in electronic gadgets is one of the major drivers. Using flexible glass as display glass for cellphones and tablets because of the rising demand for slim, lightweight, scratch-resistant, and high-clarity displays for electronic gadgets will drive the demand for the market by enabling the production and commercialization of high-quality products. The emerging market for wearable technology, and the heavy investment in developing it, enhances the future prospects of flexible glass. Technology giants such as Google Inc., Apple Inc., and Samsung Electronics Co. are developing next-generation wearable technology that will lead to huge demand for flexible glass for display screens in new devices. These factors will lead to a robust increase in the usage of flexible glass, which will also allow the Global Flexible Glass market to grow. Further, the report states that one of the major challenges is the rapid change in technology and innovation that can lead to the replacement of the glass substrate with plastic. Key Vendors - Asahi Glass Co. Ltd. - Corning Inc. - Nippon Electric Glass Co. Ltd. - Schott AG Other Prominent Vendors - Abrisa Technologies - LiSEC Group - Tokyo Electron Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Application - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/r9...l_flexible
TOKYO ELECTRON DEVICE Announces the Release of LSI TE7740RPF with Extended I/O for Car Navigation Systems and an Automotive AEC-Q100 Compliant Qualification
Business Wire - Tue Apr 22, 8:02AM CDT
Tokyo Electron Device Limited (TED) announces the launch of the new LSI TE7740RPF with extended I/O and an automotive AEC-Q100* compliant qualification for in-car ICs. TED began the release of sample products on April 22 under its own brand name "inrevium."
Global Chemical Vapor Deposition Market 2014-2018 with Adeka Applied Materials, ASM International N.V & Kurt J. Lesker Dominating
M2 - Tue Apr 15, 9:46AM CDT
Research and Markets (http://www.researchandmarkets.com/research/2zxwz8/global_chemical) has announced the addition of the "Global Chemical Vapor Deposition Market 2014-2018" report to their offering. The Global Chemical Vapor Deposition market to grow at a CAGR of 11% to 2018. Increasing demand for CVD among semiconductor manufacturers is one of the major drivers in the market, as CVD equipment and materials are used widely in the manufacturing of semiconductors. Plasma-enhanced CVD is carried out in a vacuum system to generate plasma. The process is the only CVD technique to ensure deposition of a thin film coating at a low temperature. For instance, deposition of Si3N4 on integrated circuits needs to be carried out at a low temperature through plasma enhanced CVD. Thus, there has been an increased use of plasma-enhanced CVD in the market in 2013, although it is a more expensive technique than thermally activated CVD. This trend is expected to contribute significantly to the growth of the Global Chemical Vapor Deposition market during the forecast period. Further, the report states that one of the major challenges is the high total cost of ownership. The use of sophisticated reactor and vacuum systems in CVD increases the cost of fabrication. Also, the CVD system requires skilled operators with effective training, and continuous maintenance and monitoring, to detect and rectify any failure in CVD equipment. Key vendors dominating this space are: - Adeka Corp. - Applied Materials Inc - ASM International N.V. - Kurt J. Lesker Co. Other vendors mentioned in the report are: - AIXTRON SE, Beneq Oy. - Levitech BV - Oxford Instruments plc - Picosun Oy - SENTECH Instruments GmbH - SoLayTec - SVT Associates Inc - Ultratech Inc. - Veeco Instruments Inc - Hitachi Kokusai Electric Inc - NCD Co. Ltd. - Encapsulix SAS - Centrotherm Photovoltaics AG - Tokyo Electron Ltd. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Technology - Market Segmentation by Product - Market Segmentation by End-users - Geographical Segmentation - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/2z...l_chemical
Tokyo Electron and Circuit of The Americas Join Forces to Support STEM Education
Business Wire - Thu Apr 10, 1:51PM CDT
On April 11, 2014, Tokyo Electron (TEL) and Circuit of The Americas (COTA) will host students participating in an educational program that highlights applications of science, technology, engineering, and math (STEM) fields. In conjunction with TEL's corporate responsibility initiatives relating to STEM education, TEL is inviting college students from the Texas State University "SPARK" program and high school students from the Harmony School of Excellence in Southeast Austin to the COTA racing facility in Austin, Texas, for the 2014 Red Bull Grand Prix of The Americas MotoGP event to see demonstrations while participating in discussions relating to STEM.
Research and Markets: Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials,Hitachi High-Technology, Lam Research, Tokyo Electron Dominating
Business Wire - Mon Apr 07, 9:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jfw5r6/global) has announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating" report to their offering.
Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating
M2 - Mon Apr 07, 8:03AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jsl8rs/global) has announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating" report to their offering. The increasing demand for high performance and low power consumption in smaller electronic devices requires the miniaturization of semiconductor circuits. The miniaturization of semiconductor circuits involves a wafer fabrication process through dry etching. Circuit miniaturization requires more thorough dry etching and the number of each etch step increases as capacity additions are incorporated. Currently, electronic devices use semiconductors with circuit line widths in the 20nm range. However, it is expected that ultra-miniature circuits, with line widths in the 10nm range could be introduced during the forecast period. Thus, this growing need for the miniaturization of semiconductor circuits is expected to fuel the demand for semiconductor dry etching equipment. According to the report, one of the major drivers in this market is the increasing demand for smart electronic devices. There has been unprecedented growth in the adoption of smart electronic devices such as mobile phones, smartphones, notebooks, PCs, tablets, ultrabooks, and PDAs in the past few years. These devices employ numerous semiconductor components such as microchips that increase the demand for dry etching equipment, as semiconductor components require microfabrication. Further, the report states that one of the major challenges in this market is the cyclic nature of the Semiconductor industry. The revenue generated in the Semiconductor industry is cyclical in nature because the demand for etching is dependent on the economic climate, due to which production tends often to exceed demand. Key vendors dominating this space are: - APPLIED materials Inc. - Hitachi High-Technology Corp - Lam Research Corp - Tokyo Electron Ltd. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and their Impact 16. Vendor Landscape 17. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/jsl8rs/global
Global On-Chip and Chip-to-Chip Optical Interconnects Market Forecasts & Opportunities 2013-2020
M2 - Mon Apr 07, 2:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/c8btnj/revenue) has announced the addition of the "Global On-Chip and Chip-to-Chip Optical Interconnects Market Forecasts & Opportunities 2013-2020 " report to their offering. The report covers four kinds of chip-level interconnect: optical engines, photonic integrated circuit (PIC)-based interconnects, silicon photonics and free-space optics. It includes nine-year (volume and value) forecasts with breakouts by active components along with fiber and waveguide transmission media. Compound semiconductor, silicon and polymer waveguides are covered, as are VCSELs, silicon lasers and quantum dot lasers. In addition, the report contains assessments of the latest business and technology strategies in the chip-level optical interconnect space. Companies discussed in this report include - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems. From the Report: The growing popularity of parallel computing, and the arrival of multicore processors and 3D chips are leading to data traffic jams both on-chip and chip-to-chip. However, the report believes that these trends are also creating opportunities for chip-level optical interconnects. Avago, Finisar, IBM and Samtec have all proposed optical engines for chip-level interconnect. These miniaturized optical assemblies are currently the most mature technology available for this application and will generate revenues of $235 million in 2019. However, with their attached connectors and heat sinks, optical engines may prove too large for complex optical interconnection environments, such as in the coming generation of Exascale supercomputers. Key Topics Covered: Executive Summary E.1 "Interconnect Bottleneck" Spells Opportunities for the Photonics Industry E.2 Challenges for Chip-Level Optical Interconnection E.3 Roadmap Considerations and Summary 10-year Forecast for Chip Level Interconnection E.4 Two Companies to Watch: IBM and Intel Chapter One: Introduction Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection 2.1 Megatrends Driving the Need for Optical Interconnect at All Levels 2.2 Chip-to-Chip and On-Chip Interconnect: Replacing Copper 2.3 Limits to Electronic Interconnects 2.4 Drivers and Threats for Optical Interconnect 2.5 Moore's Law, Scaling and Interconnect 2.6 Multicore Processing and Interconnect 2.7 3D Chips and Interconnect 2.8 A Possible Transition to Optical Computing and Communications: Interconnect Implications 2.9 Potential for Moving to Nanocarbon Computers Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect 3.1 Future Technologies for Chip-Level Interconnect 3.2 VCSELs for Interconnect: Getting Faster 3.3 Silicon Lasers 3.4 Quantum Dot Lasers 3.5 Optical Engines 3.6 The Role of Optical Integration in Future Chip-Based Interconnection 3.7 Silicon Photonics 3.8 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect 3.9 Use of Carbon Nanotubes and Graphene for Chip-Level Optical Interconnect For more information visit http://www.researchandmarkets.com/research/c8btnj/revenue
Flip-Chip Trends - Global Market Overview 2014
M2 - Fri Apr 04, 9:33AM CDT
Research and Markets (http://www.researchandmarkets.com/research/6mk695/flipchip_trends) has announced the addition of the "Flip-Chip Trends" report to their offering. Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide are profiled, including - Amkor Technology Inc. - FlipChip International LLC - Kyocera America Inc. - NTK Technologies Inc. - Philips Lumileds Lighting Company - Signetics Corporation - STATS ChipPAC Ltd. - STMicroelectronics NV - Tessera Technologies Inc. - Toshiba Electronics Europe GmbH Key Topics Covered: 1. FLIP-CHIP - AN OVERVIEW - A Prelude - Flip-Chip - Enabling Compact, Smart Devices - Flip-Chip - Applications - Advantages of Flip-Chip Technique - High Packaging Density - High Performance - Ruggedness - Cost-efficiency - Flip-Chips Package Design - Manufacturing of Flip-Chip Assemblies 2. MARKET TRENDS - Flip-Chip Technique Extends to New Applications - Table 1: Global Flip Chip Market (2012-2017) in US$ Million - Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications - Latest Chip Interconnection Techniques Drive Flip-Chip Adoption - WLP Gradually Replaces Flip-Chips in Compact Products 3. RECENT INDUSTRY ACTIVITY - FlipChip International Inks Partnership Agreement with EZconn Czech - Philips Lumileds Introduces LUXEON Flip Chip LEDs - Altera Selects FCmBGA Packaging Solution of Amkor Technology - FlipChip International Takes Over Millennium Microtech Holdings - FlipChip International Forms Joint Venture with Millennium Microtech - Kyocera America Sets Up New Clean Room - Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process - Signetics to Expand Flip-Chip Package Assembly Capacity - STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology - Philips Lumileds Unveils LUXEON Rebel LEDs - STATS ChipPAC Launches LCFC Technology with Copper Column Bump - Tessera Inks Licensing Agreement with Nanium - Zicom Group Purchases Controlling Stake in Orion Systems Integration 4. MARKET PARTICIPANTS - Amkor Technology, Inc. (USA) - ASE Group (Taiwan) - ASE Kaohsiung (Taiwan) - Belton Technology Group (China) - Faraday Technology Corporation (Taiwan) - FlipChip International LLC (USA) - GigOptix, Inc. (USA) - Ibiden Co., Ltd. (Japan) - Kyocera America, Inc. (USA) - LSI Corporation (USA) - Nanium (Portugal) - NTK Technologies, Inc. (USA) - Philips Lumileds Lighting Company (USA) - Reflex Photonics, Inc. (Canada) - Renesas Electronics America, Inc. (USA) - Shinko Electric Industries Co., Ltd. (Japan) - Signetics Corporation (South Korea) - Siliconware Precision Industries Co., Ltd. (Taiwan) - STATS ChipPAC Ltd. (Singapore) - STMicroelectronics NV (Switzerland) - Tektronix Component Solutions (USA) - Tessera Technologies, Inc. (USA) - Tokyo Electron Ltd. (Japan) - Toshiba Electronics Europe GmbH (Germany) - Toshiba Semiconductor & Storage Products (Japan) - Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia) - UTAC Holdings Ltd. (UTAC Group) (Singapore) - Valtronic Technologies (Suisse) SA (Switzerland) 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/6m...hip_trends
Quantum Dots Trends - Global Market Overview 2014
M2 - Wed Apr 02, 8:14AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h7tz7s/quantum_dots) has announced the addition of the "Quantum Dots Trends" report to their offering. Quantum dots or QDs are minute-size spherical semiconductor nanocrystals having the property to confine the motion of carriers such as electrons, valence band holes and even excitons in all three axes. QDs exhibit a unique energy-harnessing ability, which can be used for converting energy from various sources such as solar photons into electrical energy. An ideal isolated quantum dot exhibits discrete energy levels, which corresponds to a delta-shaped density of states having no states among the delta peaks. The report presents an overview of Quantum Dots market worldwide. The report also provides global market estimates and projections for Quantum Dots in US dollars for years 2012 through 2017. The report provides a review of strategic industry activities of major companies worldwide. Key Topics Covered: 1. QUANTUM DOTS - AN OVERVIEW - Quantum Dots - Introduction - Quantum Dots - Properties - Quantum Dots - Application in Key End-Use Segments - Display Devices - Telecom and Photonics - In-Vivo Selective Tissue Marking - In-Vitro Cellular Analysis - Security Inks - Diagnostic and Imaging Devices - Other Applications - Quantum Dots - Drawbacks - Quantum Dots - Technological Advancements 2. MARKET TRENDS 3. RECENT INDUSTRY ACTIVITY - Nanoco Group Inks Global Licensing Agreement with Dow Electronic Materials - Quantum Materials Launches New Range of Metal Tetrapod Quantum Dots - Sony Incorporates Quantum Dot Technology of QD Vision - US DOE National Lab Researchers Procures Tetrapod Quantum Dot Samples from Quantum Materials - Merck Acquires Stake in QLight Nanotech - Nanoco Group Inks Follow-On Agreement with Tokyo Electron - Nanoaxis and Quantum Materials Form Technology Alliance - Samsung Electronics Unveils Full-Color Quantum Dot Display Prototype - Solterra Renewable Technologies Joins JETRO Program - Solterra Renewable Technologies Inks Process Development - Agreement with Flowid and FutureChemistry Holding Consortium 4. MARKET PARTICIPANTS - American Elements - Attonuclei - CAN GmbH (The Center for Applied Nanotechnology) - Cromoz, Inc. - Crystalplex Nanotech - Cyrium Technologies, Inc. - Dow Chemical Company, The - Evident Technologies, Inc. - Irilliant, Inc. - Lab21 Ltd. - MKNano - Nano Axis LLC - Nanoco Group PLC - Nanosquare, Inc. (South Korea) - Nanosys, Inc. - Nanotech-Dubna LLC - Navillum Nanotechnologies LLC - NN-Labs LLC - Ocean NanoTech LLC - Pacific Light Technologies - PlasmaChem GmbH - QD Laser, Inc. - QD Solution - QD Vision, Inc. - Qlight Nanotech - Quantum Materials Corporation - Raytheon Company - Reinste Nanoventures Pvt., Ltd. - Sigma-Aldrich Co., LLC - Voxtel, Inc. 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/h7...antum_dots
Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Semiconductor Metal Etching Equipment Market Forecasts & Opportunities, 2018
M2 - Tue Apr 29, 5:39AM CDT
Research and Markets (http://www.researchandmarkets.com/research/hrtbk8/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market Forecasts & Opportunities, 2018" report to their offering. One of the major trends witnessed in the Global Semiconductor Metal Etching Equipment market is the emergence of miniaturized semiconductors. The increase in the demand for high-performance, low-power consumption and compact electronic devices necessitates the miniaturization of semiconductors. The miniaturization of semiconductor circuits requires wafer fabrication through various etching processes including metal etching. Currently, electronic devices use semiconductors with circuit line widths in the 20nm range. However, ultra-miniature circuits, with line widths in the 10nm range, are expected to be introduced during the forecast period. Therefore, the increasing number of miniaturized semiconductor ICs is expected to fuel the demand for semiconductor metal etching equipment, thereby propelling the growth of the market. According to the report, the most important driver is the rising demand for smart electronic devices. In the recent past, there has been a significant increase in the adoption of smart electronic devices such as smartphones and tablets. These devices employ numerous semiconductor components such as microchips. This in turn is expected to increase the demand for metal etching equipment as semiconductor components undergo microfabrication through the metal etching process. Further, the report states that one of the major challenges in this market is the cyclical nature of the Semiconductor industry. As a result of this, many metal etching equipment vendors often experience fluctuating revenues, which in turn affects their profitability. Moreover, the market often witnesses excess production, which results in inventory pile up. Key vendors dominating this space are: - Applied Materials Inc. - Hitachi High-Technologies Corp. - Lam Research Corp. Other vendors mentioned in the report are: - Jusung Engineering Co. Ltd - Mattson Technology Inc. - Semes Co. Ltd. - Tokyo Electron Ltd. - ULVAC Technologies Inc. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/hrtbk8/global
Research and Markets: Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating
Business Wire - Mon Apr 28, 12:32PM CDT
Research and Markets (http://www.researchandmarkets.com/research/s26fqw/global) has announced the addition of the "Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating" report to their offering.
Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating
M2 - Mon Apr 28, 8:38AM CDT
Research and Markets (http://www.researchandmarkets.com/research/8lw2p7/global) has announced the addition of the "Global Semiconductor Dielectric Etching Equipment Market 2014-2018 with Applied Materials, Hitachi High-Technologies , Lam Research & Tokyo Electron Dominating" report to their offering. The growth of the Global Semiconductor Dielectric Etching Equipment market is driven by several factors, including the increasing demand for smartphones and tablets. There has been unprecedented growth in the adoption of smart electronic devices which employ numerous semiconductor components like microchips. This is expected to lead to an increase in the demand for dielectric etching equipment as semiconductor components require microfabrication. Commenting on the report, an analyst from the team said: The increasing demand for compact, energy-efficient, and high performance electronic devices necessitates miniaturization of semiconductor circuits. Miniature semiconductor circuits undergo wafer fabrication process through dielectric etching. Circuit miniaturization requires more thorough dielectric etching and the number of etch steps increases as capacity additions are incorporated. Currently, electronic devices use semiconductors with circuit line widths in the 0-20nm range. However, it is expected that ultraminiature circuits, with line widths in the 0-10nm range could be introduced during the forecast period. Thus, the growing need for miniaturization of semiconductor circuits is expected to fuel the demand for semiconductor dielectric etching equipment during the forecast period. Further, the report states that despite the presence of several drivers, the growth of the Global Semiconductor Dielectric Etching Equipment market is curtailed by some serious challenges, such as the cyclical nature of Semiconductor industry. The revenue generated in the Semiconductor industry is cyclical in nature because the demand for etching is dependent on the economic climate. Very often, production tends to exceed demand, resulting in inventory pile up. Key vendors dominating this space are: - Applied Materials Inc. - Hitachi High-Technologies Corp. - Lam Research Corp. - Tokyo Electron Ltd. Other vendors mentioned in the report are: - Jusung Engineering Co. Ltd. - Mattson Technology Inc. - Semes Co. Ltd. - ULVAC Technologies Inc. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/8lw2p7/global
Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating
M2 - Mon Apr 28, 8:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/885wcx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating" report to their offering. The Global Wafer-level Packaging Equipment market to grow at a CAGR of 2.9% over the period 2013-2018. The most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc. - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc - SEMES Co. Ltd - Suss Microtec AG - Ultratech Inc. - ULVAC. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Geographical Segmentation - Key Leading Countries - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/885wcx/global
Global Flexible Glass Market 2014-2018: Asahi Glass, Corning, Nippon Electric Glass & Schott AG Dominate the Industry
M2 - Fri Apr 25, 6:27AM CDT
Research and Markets (http://www.researchandmarkets.com/research/r9hr2g/global_flexible) has announced the addition of the "Global Flexible Glass Market 2014-2018" report to their offering. The Global Flexible Glass market will grow at a CAGR of 50.21 percent over the period 2013-2018. Flexible glass is an ultra-thin glass that has the properties of rigid glass such as high barrier properties, strength, temperature stability and durability, but in a flexible form. Moreover, flexible glass combines the scratch resistance and rigidity properties of plastics. The Global Flexible Glass market is an emerging market that is experiencing enormous changes and innovations. Flexible glass plays a key role in making electronic gadgets lightweight, attractive, handy, and of high quality. It also holds the key to the making of next-generation gadgets with are rollable, flexible, and wearable. The Global Flexible Glass market is driven by several factors, and the increasing demand for slim and scratch-resistant displays in electronic gadgets is one of the major drivers. Using flexible glass as display glass for cellphones and tablets because of the rising demand for slim, lightweight, scratch-resistant, and high-clarity displays for electronic gadgets will drive the demand for the market by enabling the production and commercialization of high-quality products. The emerging market for wearable technology, and the heavy investment in developing it, enhances the future prospects of flexible glass. Technology giants such as Google Inc., Apple Inc., and Samsung Electronics Co. are developing next-generation wearable technology that will lead to huge demand for flexible glass for display screens in new devices. These factors will lead to a robust increase in the usage of flexible glass, which will also allow the Global Flexible Glass market to grow. Further, the report states that one of the major challenges is the rapid change in technology and innovation that can lead to the replacement of the glass substrate with plastic. Key Vendors - Asahi Glass Co. Ltd. - Corning Inc. - Nippon Electric Glass Co. Ltd. - Schott AG Other Prominent Vendors - Abrisa Technologies - LiSEC Group - Tokyo Electron Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Application - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/r9...l_flexible
TOKYO ELECTRON DEVICE Announces the Release of LSI TE7740RPF with Extended I/O for Car Navigation Systems and an Automotive AEC-Q100 Compliant Qualification
Business Wire - Tue Apr 22, 8:02AM CDT
Tokyo Electron Device Limited (TED) announces the launch of the new LSI TE7740RPF with extended I/O and an automotive AEC-Q100* compliant qualification for in-car ICs. TED began the release of sample products on April 22 under its own brand name "inrevium."
Global Chemical Vapor Deposition Market 2014-2018 with Adeka Applied Materials, ASM International N.V & Kurt J. Lesker Dominating
M2 - Tue Apr 15, 9:46AM CDT
Research and Markets (http://www.researchandmarkets.com/research/2zxwz8/global_chemical) has announced the addition of the "Global Chemical Vapor Deposition Market 2014-2018" report to their offering. The Global Chemical Vapor Deposition market to grow at a CAGR of 11% to 2018. Increasing demand for CVD among semiconductor manufacturers is one of the major drivers in the market, as CVD equipment and materials are used widely in the manufacturing of semiconductors. Plasma-enhanced CVD is carried out in a vacuum system to generate plasma. The process is the only CVD technique to ensure deposition of a thin film coating at a low temperature. For instance, deposition of Si3N4 on integrated circuits needs to be carried out at a low temperature through plasma enhanced CVD. Thus, there has been an increased use of plasma-enhanced CVD in the market in 2013, although it is a more expensive technique than thermally activated CVD. This trend is expected to contribute significantly to the growth of the Global Chemical Vapor Deposition market during the forecast period. Further, the report states that one of the major challenges is the high total cost of ownership. The use of sophisticated reactor and vacuum systems in CVD increases the cost of fabrication. Also, the CVD system requires skilled operators with effective training, and continuous maintenance and monitoring, to detect and rectify any failure in CVD equipment. Key vendors dominating this space are: - Adeka Corp. - Applied Materials Inc - ASM International N.V. - Kurt J. Lesker Co. Other vendors mentioned in the report are: - AIXTRON SE, Beneq Oy. - Levitech BV - Oxford Instruments plc - Picosun Oy - SENTECH Instruments GmbH - SoLayTec - SVT Associates Inc - Ultratech Inc. - Veeco Instruments Inc - Hitachi Kokusai Electric Inc - NCD Co. Ltd. - Encapsulix SAS - Centrotherm Photovoltaics AG - Tokyo Electron Ltd. Key Topics Covered: - Executive Summary - List of Abbreviations - Scope of the Report - Market Research Methodology - Introduction - Market Landscape - Market Segmentation by Technology - Market Segmentation by Product - Market Segmentation by End-users - Geographical Segmentation - Buying Criteria - Market Growth Drivers - Drivers and their Impact - Market Challenges - Impact of Drivers and Challenges - Market Trends - Trends and their Impact - Vendor Landscape - Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/2z...l_chemical
Tokyo Electron and Circuit of The Americas Join Forces to Support STEM Education
Business Wire - Thu Apr 10, 1:51PM CDT
On April 11, 2014, Tokyo Electron (TEL) and Circuit of The Americas (COTA) will host students participating in an educational program that highlights applications of science, technology, engineering, and math (STEM) fields. In conjunction with TEL's corporate responsibility initiatives relating to STEM education, TEL is inviting college students from the Texas State University "SPARK" program and high school students from the Harmony School of Excellence in Southeast Austin to the COTA racing facility in Austin, Texas, for the 2014 Red Bull Grand Prix of The Americas MotoGP event to see demonstrations while participating in discussions relating to STEM.
Research and Markets: Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials,Hitachi High-Technology, Lam Research, Tokyo Electron Dominating
Business Wire - Mon Apr 07, 9:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jfw5r6/global) has announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating" report to their offering.
Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating
M2 - Mon Apr 07, 8:03AM CDT
Research and Markets (http://www.researchandmarkets.com/research/jsl8rs/global) has announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating" report to their offering. The increasing demand for high performance and low power consumption in smaller electronic devices requires the miniaturization of semiconductor circuits. The miniaturization of semiconductor circuits involves a wafer fabrication process through dry etching. Circuit miniaturization requires more thorough dry etching and the number of each etch step increases as capacity additions are incorporated. Currently, electronic devices use semiconductors with circuit line widths in the 20nm range. However, it is expected that ultra-miniature circuits, with line widths in the 10nm range could be introduced during the forecast period. Thus, this growing need for the miniaturization of semiconductor circuits is expected to fuel the demand for semiconductor dry etching equipment. According to the report, one of the major drivers in this market is the increasing demand for smart electronic devices. There has been unprecedented growth in the adoption of smart electronic devices such as mobile phones, smartphones, notebooks, PCs, tablets, ultrabooks, and PDAs in the past few years. These devices employ numerous semiconductor components such as microchips that increase the demand for dry etching equipment, as semiconductor components require microfabrication. Further, the report states that one of the major challenges in this market is the cyclic nature of the Semiconductor industry. The revenue generated in the Semiconductor industry is cyclical in nature because the demand for etching is dependent on the economic climate, due to which production tends often to exceed demand. Key vendors dominating this space are: - APPLIED materials Inc. - Hitachi High-Technology Corp - Lam Research Corp - Tokyo Electron Ltd. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and their Impact 16. Vendor Landscape 17. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/jsl8rs/global
Global On-Chip and Chip-to-Chip Optical Interconnects Market Forecasts & Opportunities 2013-2020
M2 - Mon Apr 07, 2:57AM CDT
Research and Markets (http://www.researchandmarkets.com/research/c8btnj/revenue) has announced the addition of the "Global On-Chip and Chip-to-Chip Optical Interconnects Market Forecasts & Opportunities 2013-2020 " report to their offering. The report covers four kinds of chip-level interconnect: optical engines, photonic integrated circuit (PIC)-based interconnects, silicon photonics and free-space optics. It includes nine-year (volume and value) forecasts with breakouts by active components along with fiber and waveguide transmission media. Compound semiconductor, silicon and polymer waveguides are covered, as are VCSELs, silicon lasers and quantum dot lasers. In addition, the report contains assessments of the latest business and technology strategies in the chip-level optical interconnect space. Companies discussed in this report include - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems. From the Report: The growing popularity of parallel computing, and the arrival of multicore processors and 3D chips are leading to data traffic jams both on-chip and chip-to-chip. However, the report believes that these trends are also creating opportunities for chip-level optical interconnects. Avago, Finisar, IBM and Samtec have all proposed optical engines for chip-level interconnect. These miniaturized optical assemblies are currently the most mature technology available for this application and will generate revenues of $235 million in 2019. However, with their attached connectors and heat sinks, optical engines may prove too large for complex optical interconnection environments, such as in the coming generation of Exascale supercomputers. Key Topics Covered: Executive Summary E.1 "Interconnect Bottleneck" Spells Opportunities for the Photonics Industry E.2 Challenges for Chip-Level Optical Interconnection E.3 Roadmap Considerations and Summary 10-year Forecast for Chip Level Interconnection E.4 Two Companies to Watch: IBM and Intel Chapter One: Introduction Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection 2.1 Megatrends Driving the Need for Optical Interconnect at All Levels 2.2 Chip-to-Chip and On-Chip Interconnect: Replacing Copper 2.3 Limits to Electronic Interconnects 2.4 Drivers and Threats for Optical Interconnect 2.5 Moore's Law, Scaling and Interconnect 2.6 Multicore Processing and Interconnect 2.7 3D Chips and Interconnect 2.8 A Possible Transition to Optical Computing and Communications: Interconnect Implications 2.9 Potential for Moving to Nanocarbon Computers Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect 3.1 Future Technologies for Chip-Level Interconnect 3.2 VCSELs for Interconnect: Getting Faster 3.3 Silicon Lasers 3.4 Quantum Dot Lasers 3.5 Optical Engines 3.6 The Role of Optical Integration in Future Chip-Based Interconnection 3.7 Silicon Photonics 3.8 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect 3.9 Use of Carbon Nanotubes and Graphene for Chip-Level Optical Interconnect For more information visit http://www.researchandmarkets.com/research/c8btnj/revenue
Flip-Chip Trends - Global Market Overview 2014
M2 - Fri Apr 04, 9:33AM CDT
Research and Markets (http://www.researchandmarkets.com/research/6mk695/flipchip_trends) has announced the addition of the "Flip-Chip Trends" report to their offering. Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide are profiled, including - Amkor Technology Inc. - FlipChip International LLC - Kyocera America Inc. - NTK Technologies Inc. - Philips Lumileds Lighting Company - Signetics Corporation - STATS ChipPAC Ltd. - STMicroelectronics NV - Tessera Technologies Inc. - Toshiba Electronics Europe GmbH Key Topics Covered: 1. FLIP-CHIP - AN OVERVIEW - A Prelude - Flip-Chip - Enabling Compact, Smart Devices - Flip-Chip - Applications - Advantages of Flip-Chip Technique - High Packaging Density - High Performance - Ruggedness - Cost-efficiency - Flip-Chips Package Design - Manufacturing of Flip-Chip Assemblies 2. MARKET TRENDS - Flip-Chip Technique Extends to New Applications - Table 1: Global Flip Chip Market (2012-2017) in US$ Million - Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications - Latest Chip Interconnection Techniques Drive Flip-Chip Adoption - WLP Gradually Replaces Flip-Chips in Compact Products 3. RECENT INDUSTRY ACTIVITY - FlipChip International Inks Partnership Agreement with EZconn Czech - Philips Lumileds Introduces LUXEON Flip Chip LEDs - Altera Selects FCmBGA Packaging Solution of Amkor Technology - FlipChip International Takes Over Millennium Microtech Holdings - FlipChip International Forms Joint Venture with Millennium Microtech - Kyocera America Sets Up New Clean Room - Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process - Signetics to Expand Flip-Chip Package Assembly Capacity - STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology - Philips Lumileds Unveils LUXEON Rebel LEDs - STATS ChipPAC Launches LCFC Technology with Copper Column Bump - Tessera Inks Licensing Agreement with Nanium - Zicom Group Purchases Controlling Stake in Orion Systems Integration 4. MARKET PARTICIPANTS - Amkor Technology, Inc. (USA) - ASE Group (Taiwan) - ASE Kaohsiung (Taiwan) - Belton Technology Group (China) - Faraday Technology Corporation (Taiwan) - FlipChip International LLC (USA) - GigOptix, Inc. (USA) - Ibiden Co., Ltd. (Japan) - Kyocera America, Inc. (USA) - LSI Corporation (USA) - Nanium (Portugal) - NTK Technologies, Inc. (USA) - Philips Lumileds Lighting Company (USA) - Reflex Photonics, Inc. (Canada) - Renesas Electronics America, Inc. (USA) - Shinko Electric Industries Co., Ltd. (Japan) - Signetics Corporation (South Korea) - Siliconware Precision Industries Co., Ltd. (Taiwan) - STATS ChipPAC Ltd. (Singapore) - STMicroelectronics NV (Switzerland) - Tektronix Component Solutions (USA) - Tessera Technologies, Inc. (USA) - Tokyo Electron Ltd. (Japan) - Toshiba Electronics Europe GmbH (Germany) - Toshiba Semiconductor & Storage Products (Japan) - Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia) - UTAC Holdings Ltd. (UTAC Group) (Singapore) - Valtronic Technologies (Suisse) SA (Switzerland) 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/6m...hip_trends
Quantum Dots Trends - Global Market Overview 2014
M2 - Wed Apr 02, 8:14AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h7tz7s/quantum_dots) has announced the addition of the "Quantum Dots Trends" report to their offering. Quantum dots or QDs are minute-size spherical semiconductor nanocrystals having the property to confine the motion of carriers such as electrons, valence band holes and even excitons in all three axes. QDs exhibit a unique energy-harnessing ability, which can be used for converting energy from various sources such as solar photons into electrical energy. An ideal isolated quantum dot exhibits discrete energy levels, which corresponds to a delta-shaped density of states having no states among the delta peaks. The report presents an overview of Quantum Dots market worldwide. The report also provides global market estimates and projections for Quantum Dots in US dollars for years 2012 through 2017. The report provides a review of strategic industry activities of major companies worldwide. Key Topics Covered: 1. QUANTUM DOTS - AN OVERVIEW - Quantum Dots - Introduction - Quantum Dots - Properties - Quantum Dots - Application in Key End-Use Segments - Display Devices - Telecom and Photonics - In-Vivo Selective Tissue Marking - In-Vitro Cellular Analysis - Security Inks - Diagnostic and Imaging Devices - Other Applications - Quantum Dots - Drawbacks - Quantum Dots - Technological Advancements 2. MARKET TRENDS 3. RECENT INDUSTRY ACTIVITY - Nanoco Group Inks Global Licensing Agreement with Dow Electronic Materials - Quantum Materials Launches New Range of Metal Tetrapod Quantum Dots - Sony Incorporates Quantum Dot Technology of QD Vision - US DOE National Lab Researchers Procures Tetrapod Quantum Dot Samples from Quantum Materials - Merck Acquires Stake in QLight Nanotech - Nanoco Group Inks Follow-On Agreement with Tokyo Electron - Nanoaxis and Quantum Materials Form Technology Alliance - Samsung Electronics Unveils Full-Color Quantum Dot Display Prototype - Solterra Renewable Technologies Joins JETRO Program - Solterra Renewable Technologies Inks Process Development - Agreement with Flowid and FutureChemistry Holding Consortium 4. MARKET PARTICIPANTS - American Elements - Attonuclei - CAN GmbH (The Center for Applied Nanotechnology) - Cromoz, Inc. - Crystalplex Nanotech - Cyrium Technologies, Inc. - Dow Chemical Company, The - Evident Technologies, Inc. - Irilliant, Inc. - Lab21 Ltd. - MKNano - Nano Axis LLC - Nanoco Group PLC - Nanosquare, Inc. (South Korea) - Nanosys, Inc. - Nanotech-Dubna LLC - Navillum Nanotechnologies LLC - NN-Labs LLC - Ocean NanoTech LLC - Pacific Light Technologies - PlasmaChem GmbH - QD Laser, Inc. - QD Solution - QD Vision, Inc. - Qlight Nanotech - Quantum Materials Corporation - Raytheon Company - Reinste Nanoventures Pvt., Ltd. - Sigma-Aldrich Co., LLC - Voxtel, Inc. 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/h7...antum_dots
Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
