Rudolph Technologies (RTEC) 10.74 $RTEC
Rudolph Technologies Schedules 2014 First Quarter Earnings Conference Call for April 28, 2014
Business Wire - Fri Apr 11, 6:00AM CDT
Rudolph Technologies, Inc. (NYSE:RTEC) will release results for the 2014 first quarter, after the market closes on Monday, April 28, 2014. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the Internet. Paul F. McLaughlin, Chairman and Chief Executive Officer, and Steven Roth, Chief Financial Officer will host the call. The call will take place:
Rudolph Announces Favorable Ruling in Patent Infringement Lawsuit
Business Wire - Wed Apr 09, 3:53PM CDT
Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced another favorable ruling in its ongoing patent infringement suit against Israeli manufacturer, Camtek, Ltd.
Concise Analysis of the International Metrology Software Market
M2 - Thu Mar 06, 3:30AM CST
Research and Markets (http://www.researchandmarkets.com/research/bdjdwv/metrology) has announced the addition of the "Concise Analysis of the International Metrology Software Market" report to their offering. This report analyzes the worldwide markets for Metrology Software in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East/Africa, and Latin America. Annual estimates and forecasts are provided for the period 2010 through 2018. Also, a six-year historic analysis is provided for these markets. The report profiles 59 companies including many key and niche players such as 3D Systems Corporation, Aberlink Innovative Metrology LLP, AICON 3D Systems GmbH, BuildIT Software & Solutions Ltd., Carl Zeiss Industrial Metrology, Creaform, Inc., Delcam Plc, FARO Technologies Inc., GE Measurement & Control Solutions, Heidenhain Corp., Hexagon AB, Hexagon Metrology, Inc., New River Kinematics, Inc., Image Metrology A/S, Innovative Metrology Solutions, InnovMetric Software, Inc., Konica Minolta Sensing Americas, Inc., Kotem Technologies, Inc., Metrologic Group SA, Metrology Software Products Ltd., Micro-Vu Corporation, Mitutoyo America Corporation, Nikon Metrology, Inc., Optical Gaging Products, RAM Optical Instrumentation, Renishaw Plc, Rudolph Technologies, Inc., The L.S. Starrett Company, and Verisurf Software, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. Key Topics Covered: I. Introduction, Methodology & Product Definitions II. Executive Summary 1. Industry Overview 2. Market Trends, Issues And Drivers 3. Product Overview 4. Strategic Corporate Developments 5. Product/Service Launches 6. Focus On Select Global Players 7. Global Market Perspective III. Market 1. The United States 2. Canada 3. Japan 4. Europe 5. Asia-Pacific 6. Middle-East & Africa 7. Latin America IV. Competitive Landscape Total Companies Profiled: 59 (including Divisions/Subsidiaries - 62) - The United States (36) - Canada (5) - Europe (20) - France (2) - Germany (
- The United Kingdom (4) - Spain (1) - Rest of Europe (5) - Middle East (1) For more information visit http://www.researchandmarkets.com/research/bdjdwv/metrology
Global Thin Film Metrology Systems Market 2014-2018 with Nanometrics, Nova, KLA-Tencor, and Rudolph Tech Dominating
M2 - Thu Feb 27, 5:43AM CST
Research and Markets (http://www.researchandmarkets.com/research/88jdgs/global_thin_film) has announced the addition of the "Global Thin Film Metrology Systems Market 2014-2018" report to their offering. The Global Thin Film Metrology Systems market to grow at a CAGR of 5% percent over the period 2013-2018. One of the major trends emerging in the Global Thin Film Metrology Systems market is the increased R&D spending by the market vendors. Vendors such as Rudolph, KLA-Tencor, Nanometrics, and Nova Measuring Instruments have already invested a considerable amount of time and money in their R&D departments for the expansion of their product portfolios. They are also increasingly investing in their R&D divisions to provide enhanced functionality and to meet the unsatisfied requirements of end-consumers. The R&D investments have enabled them to capture a significant market share and gain a competitive edge over the other vendors in the market. According to the report, the high demand for thin film metrology systems for the development of flat panel displays is an important driver. These systems are used for measuring the thin films used in the flat panel displays of portable mobile devices such as smartphones, tablets, and e-readers. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry. The Semiconductor industry is one of the major end-users of thin film metrology systems, and any fluctuations in this industry inevitably leads to fluctuations in the Global Thin Film Metrology Systems market. Key vendors dominating this space include: - Nanometrics Inc. - Nova Measuring Instruments - KLA-Tencor Corp. - Rudolph Technologies Inc. Other vendors mentioned in the report are: - Dainippon Screen Mfg Co. Ltd. - FIE Co - HORIBA Ltd. - Jordan Valley Semiconductors Ltd. - Ocean Optics Inc. - ReVera Inc. - Semilab Co. Ltd. - Scientific Computing International - Windsor Scientific Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and their Impact 16. Vendor Landscape 17. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/88..._thin_film
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Wafer Level Packaging Inspection Systems Market 2014-2018 Research Report
M2 - Thu Feb 27, 3:12AM CST
Research and Markets (http://www.researchandmarkets.com/research/5rrfd2/global_wafer) has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering. The analysts forecast the Global Wafer Level Packaging Inspection Systems market to grow at a CAGR of 1.54 percent over the period 2013-2018. One of the key factors contributing to this market growth is the rising demand for smartphones and tablets. The Global Wafer Level Packaging Inspection Systems market has also been witnessing the short replacement cycle of portable electronic devices. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Wafer Level Packaging Inspection Systems Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, Europe, and the ROW; it also covers the Global Wafer Level Packaging Inspection Systems market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Camtek Ltd., KLA-Tencor Corp., Rudolph Technologies Inc., and Topcon Technohouse Corp. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report. Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries 09. Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5r...obal_wafer About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Rudolph Technologies Announces Record Installations for its Yield Management Systems
Business Wire - Mon Feb 24, 6:00AM CST
Rudolph Technologies, Inc. (NYSE: RTEC) announced today completion of record installations in Q4 2013 of its fab-wide yield management software (YMS) products, Discover Enterprise(TM) and Genesis Enterprise(TM), which are used by semiconductor manufacturers to obtain valuable process yield and equipment productivity information. In addition to traditional semiconductor manufacturing, Discover Enterprise Software was installed at a multi-billion dollar OEM in multiple labs, replacing the incumbent technology. Rudolph attributes the rise in adoption to the industry's growing need for productivity data as it seeks to increase the yields of new, increasingly complex manufacturing processes.
Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development
Business Wire - Tue Feb 11, 6:00AM CST
Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX(R) 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional integrated circuit (3DIC) technologies that use through silicon vias (TSVs) to conduct signals among vertically-stacked chips. The new NSX 320 TSV system includes integrated 3D metrology that enables specialized measurements critical to the TSV process.
Mattson Technology (MTSN) Crumbles : Stock Goes Down 5.8% - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Wed Feb 05, 8:00AM CST
Mattson Technology saw a big move last session, as the company’s shares fell nearly 6% on the day and reversing uptrend over the last one month
Rudolph Technologies announces two lithography orders totalling over USD11m
M2 - Tue Feb 04, 7:02AM CST
US-based Rudolph Technologies Inc (NYSE:RTEC) reported on Monday the receipt of two orders for its lithography systems that total over USD11m. The company designs, develops, manufactures and supports defect inspection, advanced packaging lithography, process control metrology and data analysis systems and software.
Rudolph Technologies to Present at the Stifel Technology, Internet & Media Conference 2014
Business Wire - Tue Feb 04, 6:00AM CST
Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced that the Company will present at the Stifel Technology, Internet & Media Conference 2014 at the Fairmont Hotel in San Francisco on February 11, 2014 at 9:10 am Pacific Standard Time. Steven Roth, Chief Financial Officer, will provide an overview of the Company and will discuss its competitive position and future prospects.
Rudolph Technologies Reports 2013 Fourth Quarter Results
Business Wire - Mon Feb 03, 3:05PM CST
--Increase in Memory Sales Drove Revenues in the Quarter
Rudolph Technologies Wins Multiple Lithography Orders
Business Wire - Mon Feb 03, 3:01PM CST
Rudolph Technologies, Inc. (NYSE:RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep(TM) Lithography System for advanced packaging (AP) applications and a repeat order for a PanelPrinter(TM) 9200 System for flat panel display (FPD) lithography. The orders were received in the fourth quarter of 2013, and came from customers who are presently using Rudolph's lithography systems in volume production, both of whom foresee new capacity needs that require the Company's lithography systems. The JetStep system was shipped in Q1 2014 and the PanelPrinter system is scheduled to ship before the end of 2014.
Downgrade Alert for Rudolph Technologies (RTEC)
Comtex SmarTrend(R) - Tue Jan 14, 7:09AM CST
Rudolph Technologies (NASDAQ:RTEC) was downgraded from Outperform to Neutral at Credit Suisse today. The stock closed yesterday at $12.04 on volume of 117,000 shares, below average daily volume of 136,000. There is potential upside of 17.3% for shares of Rudolph Technologies based on a current price of $12.04 and an average consensus analyst price target of $14.12. The stock should find initial support at its 200-day moving average (MA) of $11.34 and further support at its 50-day MA of $11.08.
Rudolph Technologies Schedules 2013 Fourth Quarter Earnings Conference Call for February 3, 2014
Business Wire - Mon Jan 13, 5:59AM CST
Rudolph Technologies, Inc. (NYSE:RTEC) will release results for the 2013 fourth quarter, after the market closes on Monday, February 3, 2014. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the Internet. Paul F. McLaughlin, Chairman and Chief Executive Officer, and Steven Roth, Chief Financial Officer will host the call. The call will take place:
Rudolph to Host Company Sponsored Analyst Event January 13, 2014 (New York, NY)
Business Wire - Thu Dec 19, 9:40AM CST
Rudolph Technologies, Inc. (NYSE: RTEC) today announced that the Company's management will host a Company Sponsored Analyst Event in New York City, NY, January 13, 2014.
Rudolph Technologies to Transfer Stock Listing to NYSE
Business Wire - Tue Dec 03, 6:00AM CST
Rudolph Technologies, Inc. (Nasdaq:RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced the pending transfer of the listing of its common stock from the NASDAQ Global Select Market ("NASDAQ"
to the New York Stock Exchange ("NYSE" .
Automation Market in China 2012-2016: Market Size and CAGR
M2 - Mon Dec 02, 3:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/fcppcr/automation_market) has announced the addition of the "Automation Market in China 2012-2016" report to their offering. The analysts forecast the Automation market in China to grow at a CAGR of 16.05 percent over the period 2012-2016. One of the key factors contributing to this market growth is the need to meet international quality standards. The Automation market in China has also been witnessing the development of customized automation solution. However, the availability of low-cost labor could pose a challenge to the growth of this market. The key vendors dominating this market space are Siemens AG, ABB, Rockwell Automation, and Schneider Electric. Other vendors mentioned in the report are Yokogawa Electric Corp., General Electric Co., Aspen Technology Inc., Rudolph Technologies Inc., Invensys plc, Supcon Group Co. Ltd., Qisda Corp., iBASEt Inc., Fanuc Corp., and HollySys Automation Technologies Ltd. Commenting on the report, an analyst from the team said: One of the major trends being witnessed in the market is the development of customized automation solutions. There is intense competition among the vendors in the Automation market in China. Moreover, the profitability of vendors has been continuously declining over the years due to the intense competition and price wars. Automation vendors have started developing new customized solutions to fulfill the needs of a particular industry. Hence, the market players are focusing on differentiating their products by building solutions that are customized for the needs of a specific company or industry. Customization assists companies to have greater profit margin compared to other generic automation equipment. According to the report, one of the main drivers in this market is the need to improve organizational productivity. Automation helps industries to work unceasingly for long periods of time while simultaneously maintaining consistency and accuracy throughout the manufacturing process. For more information visit http://www.researchandmarkets.com/research/fc...ion_market About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
FormFactor to Participate in the Second Annual Midtown CAP Summit
Marketwire - Fri Nov 22, 6:43PM CST
FormFactor Inc. (NASDAQ: FORM) is pleased to announce its participation in the 2nd Annual Midtown CAP Summit at the Marriott Marquis in New York held on December 11, 2013.
Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
Business Wire - Thu Nov 21, 6:00AM CST
Rudolph Technologies, Inc. (NASDAQ:RTEC) announced today that it has won orders for its AWX(TM) FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. The AWX FSI inspection system is specifically designed to meet the needs of advanced packaging processes, such as TSV (through silicon via), and other back-end processes. One system shipped in the third quarter and the second will ship in the fourth quarter of 2013.
Rudolph Technologies Schedules 2014 First Quarter Earnings Conference Call for April 28, 2014
Business Wire - Fri Apr 11, 6:00AM CDT
Rudolph Technologies, Inc. (NYSE:RTEC) will release results for the 2014 first quarter, after the market closes on Monday, April 28, 2014. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the Internet. Paul F. McLaughlin, Chairman and Chief Executive Officer, and Steven Roth, Chief Financial Officer will host the call. The call will take place:
Rudolph Announces Favorable Ruling in Patent Infringement Lawsuit
Business Wire - Wed Apr 09, 3:53PM CDT
Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced another favorable ruling in its ongoing patent infringement suit against Israeli manufacturer, Camtek, Ltd.
Concise Analysis of the International Metrology Software Market
M2 - Thu Mar 06, 3:30AM CST
Research and Markets (http://www.researchandmarkets.com/research/bdjdwv/metrology) has announced the addition of the "Concise Analysis of the International Metrology Software Market" report to their offering. This report analyzes the worldwide markets for Metrology Software in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East/Africa, and Latin America. Annual estimates and forecasts are provided for the period 2010 through 2018. Also, a six-year historic analysis is provided for these markets. The report profiles 59 companies including many key and niche players such as 3D Systems Corporation, Aberlink Innovative Metrology LLP, AICON 3D Systems GmbH, BuildIT Software & Solutions Ltd., Carl Zeiss Industrial Metrology, Creaform, Inc., Delcam Plc, FARO Technologies Inc., GE Measurement & Control Solutions, Heidenhain Corp., Hexagon AB, Hexagon Metrology, Inc., New River Kinematics, Inc., Image Metrology A/S, Innovative Metrology Solutions, InnovMetric Software, Inc., Konica Minolta Sensing Americas, Inc., Kotem Technologies, Inc., Metrologic Group SA, Metrology Software Products Ltd., Micro-Vu Corporation, Mitutoyo America Corporation, Nikon Metrology, Inc., Optical Gaging Products, RAM Optical Instrumentation, Renishaw Plc, Rudolph Technologies, Inc., The L.S. Starrett Company, and Verisurf Software, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. Key Topics Covered: I. Introduction, Methodology & Product Definitions II. Executive Summary 1. Industry Overview 2. Market Trends, Issues And Drivers 3. Product Overview 4. Strategic Corporate Developments 5. Product/Service Launches 6. Focus On Select Global Players 7. Global Market Perspective III. Market 1. The United States 2. Canada 3. Japan 4. Europe 5. Asia-Pacific 6. Middle-East & Africa 7. Latin America IV. Competitive Landscape Total Companies Profiled: 59 (including Divisions/Subsidiaries - 62) - The United States (36) - Canada (5) - Europe (20) - France (2) - Germany (
- The United Kingdom (4) - Spain (1) - Rest of Europe (5) - Middle East (1) For more information visit http://www.researchandmarkets.com/research/bdjdwv/metrology Global Thin Film Metrology Systems Market 2014-2018 with Nanometrics, Nova, KLA-Tencor, and Rudolph Tech Dominating
M2 - Thu Feb 27, 5:43AM CST
Research and Markets (http://www.researchandmarkets.com/research/88jdgs/global_thin_film) has announced the addition of the "Global Thin Film Metrology Systems Market 2014-2018" report to their offering. The Global Thin Film Metrology Systems market to grow at a CAGR of 5% percent over the period 2013-2018. One of the major trends emerging in the Global Thin Film Metrology Systems market is the increased R&D spending by the market vendors. Vendors such as Rudolph, KLA-Tencor, Nanometrics, and Nova Measuring Instruments have already invested a considerable amount of time and money in their R&D departments for the expansion of their product portfolios. They are also increasingly investing in their R&D divisions to provide enhanced functionality and to meet the unsatisfied requirements of end-consumers. The R&D investments have enabled them to capture a significant market share and gain a competitive edge over the other vendors in the market. According to the report, the high demand for thin film metrology systems for the development of flat panel displays is an important driver. These systems are used for measuring the thin films used in the flat panel displays of portable mobile devices such as smartphones, tablets, and e-readers. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry. The Semiconductor industry is one of the major end-users of thin film metrology systems, and any fluctuations in this industry inevitably leads to fluctuations in the Global Thin Film Metrology Systems market. Key vendors dominating this space include: - Nanometrics Inc. - Nova Measuring Instruments - KLA-Tencor Corp. - Rudolph Technologies Inc. Other vendors mentioned in the report are: - Dainippon Screen Mfg Co. Ltd. - FIE Co - HORIBA Ltd. - Jordan Valley Semiconductors Ltd. - Ocean Optics Inc. - ReVera Inc. - Semilab Co. Ltd. - Scientific Computing International - Windsor Scientific Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and their Impact 16. Vendor Landscape 17. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/88..._thin_film
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Wafer Level Packaging Inspection Systems Market 2014-2018 Research Report
M2 - Thu Feb 27, 3:12AM CST
Research and Markets (http://www.researchandmarkets.com/research/5rrfd2/global_wafer) has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering. The analysts forecast the Global Wafer Level Packaging Inspection Systems market to grow at a CAGR of 1.54 percent over the period 2013-2018. One of the key factors contributing to this market growth is the rising demand for smartphones and tablets. The Global Wafer Level Packaging Inspection Systems market has also been witnessing the short replacement cycle of portable electronic devices. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Wafer Level Packaging Inspection Systems Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, Europe, and the ROW; it also covers the Global Wafer Level Packaging Inspection Systems market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Camtek Ltd., KLA-Tencor Corp., Rudolph Technologies Inc., and Topcon Technohouse Corp. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report. Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries 09. Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5r...obal_wafer About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Rudolph Technologies Announces Record Installations for its Yield Management Systems
Business Wire - Mon Feb 24, 6:00AM CST
Rudolph Technologies, Inc. (NYSE: RTEC) announced today completion of record installations in Q4 2013 of its fab-wide yield management software (YMS) products, Discover Enterprise(TM) and Genesis Enterprise(TM), which are used by semiconductor manufacturers to obtain valuable process yield and equipment productivity information. In addition to traditional semiconductor manufacturing, Discover Enterprise Software was installed at a multi-billion dollar OEM in multiple labs, replacing the incumbent technology. Rudolph attributes the rise in adoption to the industry's growing need for productivity data as it seeks to increase the yields of new, increasingly complex manufacturing processes.
Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development
Business Wire - Tue Feb 11, 6:00AM CST
Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX(R) 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional integrated circuit (3DIC) technologies that use through silicon vias (TSVs) to conduct signals among vertically-stacked chips. The new NSX 320 TSV system includes integrated 3D metrology that enables specialized measurements critical to the TSV process.
Mattson Technology (MTSN) Crumbles : Stock Goes Down 5.8% - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Wed Feb 05, 8:00AM CST
Mattson Technology saw a big move last session, as the company’s shares fell nearly 6% on the day and reversing uptrend over the last one month
Rudolph Technologies announces two lithography orders totalling over USD11m
M2 - Tue Feb 04, 7:02AM CST
US-based Rudolph Technologies Inc (NYSE:RTEC) reported on Monday the receipt of two orders for its lithography systems that total over USD11m. The company designs, develops, manufactures and supports defect inspection, advanced packaging lithography, process control metrology and data analysis systems and software.
Rudolph Technologies to Present at the Stifel Technology, Internet & Media Conference 2014
Business Wire - Tue Feb 04, 6:00AM CST
Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced that the Company will present at the Stifel Technology, Internet & Media Conference 2014 at the Fairmont Hotel in San Francisco on February 11, 2014 at 9:10 am Pacific Standard Time. Steven Roth, Chief Financial Officer, will provide an overview of the Company and will discuss its competitive position and future prospects.
Rudolph Technologies Reports 2013 Fourth Quarter Results
Business Wire - Mon Feb 03, 3:05PM CST
--Increase in Memory Sales Drove Revenues in the Quarter
Rudolph Technologies Wins Multiple Lithography Orders
Business Wire - Mon Feb 03, 3:01PM CST
Rudolph Technologies, Inc. (NYSE:RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep(TM) Lithography System for advanced packaging (AP) applications and a repeat order for a PanelPrinter(TM) 9200 System for flat panel display (FPD) lithography. The orders were received in the fourth quarter of 2013, and came from customers who are presently using Rudolph's lithography systems in volume production, both of whom foresee new capacity needs that require the Company's lithography systems. The JetStep system was shipped in Q1 2014 and the PanelPrinter system is scheduled to ship before the end of 2014.
Downgrade Alert for Rudolph Technologies (RTEC)
Comtex SmarTrend(R) - Tue Jan 14, 7:09AM CST
Rudolph Technologies (NASDAQ:RTEC) was downgraded from Outperform to Neutral at Credit Suisse today. The stock closed yesterday at $12.04 on volume of 117,000 shares, below average daily volume of 136,000. There is potential upside of 17.3% for shares of Rudolph Technologies based on a current price of $12.04 and an average consensus analyst price target of $14.12. The stock should find initial support at its 200-day moving average (MA) of $11.34 and further support at its 50-day MA of $11.08.
Rudolph Technologies Schedules 2013 Fourth Quarter Earnings Conference Call for February 3, 2014
Business Wire - Mon Jan 13, 5:59AM CST
Rudolph Technologies, Inc. (NYSE:RTEC) will release results for the 2013 fourth quarter, after the market closes on Monday, February 3, 2014. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the Internet. Paul F. McLaughlin, Chairman and Chief Executive Officer, and Steven Roth, Chief Financial Officer will host the call. The call will take place:
Rudolph to Host Company Sponsored Analyst Event January 13, 2014 (New York, NY)
Business Wire - Thu Dec 19, 9:40AM CST
Rudolph Technologies, Inc. (NYSE: RTEC) today announced that the Company's management will host a Company Sponsored Analyst Event in New York City, NY, January 13, 2014.
Rudolph Technologies to Transfer Stock Listing to NYSE
Business Wire - Tue Dec 03, 6:00AM CST
Rudolph Technologies, Inc. (Nasdaq:RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced the pending transfer of the listing of its common stock from the NASDAQ Global Select Market ("NASDAQ"
to the New York Stock Exchange ("NYSE" . Automation Market in China 2012-2016: Market Size and CAGR
M2 - Mon Dec 02, 3:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/fcppcr/automation_market) has announced the addition of the "Automation Market in China 2012-2016" report to their offering. The analysts forecast the Automation market in China to grow at a CAGR of 16.05 percent over the period 2012-2016. One of the key factors contributing to this market growth is the need to meet international quality standards. The Automation market in China has also been witnessing the development of customized automation solution. However, the availability of low-cost labor could pose a challenge to the growth of this market. The key vendors dominating this market space are Siemens AG, ABB, Rockwell Automation, and Schneider Electric. Other vendors mentioned in the report are Yokogawa Electric Corp., General Electric Co., Aspen Technology Inc., Rudolph Technologies Inc., Invensys plc, Supcon Group Co. Ltd., Qisda Corp., iBASEt Inc., Fanuc Corp., and HollySys Automation Technologies Ltd. Commenting on the report, an analyst from the team said: One of the major trends being witnessed in the market is the development of customized automation solutions. There is intense competition among the vendors in the Automation market in China. Moreover, the profitability of vendors has been continuously declining over the years due to the intense competition and price wars. Automation vendors have started developing new customized solutions to fulfill the needs of a particular industry. Hence, the market players are focusing on differentiating their products by building solutions that are customized for the needs of a specific company or industry. Customization assists companies to have greater profit margin compared to other generic automation equipment. According to the report, one of the main drivers in this market is the need to improve organizational productivity. Automation helps industries to work unceasingly for long periods of time while simultaneously maintaining consistency and accuracy throughout the manufacturing process. For more information visit http://www.researchandmarkets.com/research/fc...ion_market About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
FormFactor to Participate in the Second Annual Midtown CAP Summit
Marketwire - Fri Nov 22, 6:43PM CST
FormFactor Inc. (NASDAQ: FORM) is pleased to announce its participation in the 2nd Annual Midtown CAP Summit at the Marriott Marquis in New York held on December 11, 2013.
Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
Business Wire - Thu Nov 21, 6:00AM CST
Rudolph Technologies, Inc. (NASDAQ:RTEC) announced today that it has won orders for its AWX(TM) FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. The AWX FSI inspection system is specifically designed to meet the needs of advanced packaging processes, such as TSV (through silicon via), and other back-end processes. One system shipped in the third quarter and the second will ship in the fourth quarter of 2013.
